Stefan Schwab

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Patents Grantslast 30 patents

Information Patent Grant
Inorganic encapsulant for electronic component with adhesion promoter
- Patent number 11,652,012
- Issue date May 16, 2023
- Infineon Technologies AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 10,910,284
- Issue date Feb 2, 2021
- Infineon Technologies Austria AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a metallization layer and method of manufacturing...
- Patent number 9,844,134
- Issue date Dec 12, 2017
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing a resin material on a semiconductor body with...
- Patent number 9,818,602
- Issue date Nov 14, 2017
- Infineon Technologies AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Inorganic Encapsulant for Electronic Component with Adhesion Promoter
- Publication number 20200411400
- Publication date Dec 31, 2020
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing Thereof
- Publication number 20170162461
- Publication date Jun 8, 2017
- Infineon Technologies Austria AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING A METALLIZATION LAYER AND METHOD OF MANUFACTURING...
- Publication number 20160225718
- Publication date Aug 4, 2016
- INFINEON TECHNOLOGIES AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods with Inkjet Processes and Their Application
- Publication number 20160082718
- Publication date Mar 24, 2016
- Infineon Technologies Austria AG
- Stefan Schwab
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS