Stefan Schwab

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Mold compounds and packages for encapsulating electronic components
- Patent number 12,152,133
- Issue date Nov 26, 2024
- Infineon Technologies AG
- Andreas Waterloo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer of sub-structure having elevations and further sub-struc...
- Patent number 12,136,578
- Issue date Nov 5, 2024
- Infineon Technologies AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,027,490
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,908,830
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with isolation layer
- Patent number 11,404,359
- Issue date Aug 2, 2022
- Infineon Technologies AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH ENCAPSULANT AND FURTHER ENCAPSULANT THEREON
- Publication number 20240332102
- Publication date Oct 3, 2024
- INFINEON TECHNOLOGIES AG
- Stefan SCHWAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, CHIP PACKAGE, METHOD OF FORMING A CHIP ARRANGEMEN...
- Publication number 20230274996
- Publication date Aug 31, 2023
- INFINEON TECHNOLOGIES AG
- Stefan SCHWAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH SHAPED EXTERNAL CONTACT FOR REDUCED CRACK...
- Publication number 20220415732
- Publication date Dec 29, 2022
- Christoph Liebl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER PARTICLE HAVING MORPHOLOGICAL ADHESION PROMOTER SHELL ON CORE
- Publication number 20220275217
- Publication date Sep 1, 2022
- INFINEON TECHNOLOGIES AG
- Stefan SCHWAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD COMPOUNDS AND PACKAGES FOR ENCAPSULATING ELECTRONIC COMPONENTS
- Publication number 20220127463
- Publication date Apr 28, 2022
- INFINEON TECHNOLOGIES AG
- Andreas WATERLOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH ISOLATION LAYER
- Publication number 20220122905
- Publication date Apr 21, 2022
- INFINEON TECHNOLOGIES AG
- Stefan SCHWAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220045031
- Publication date Feb 10, 2022
- INFINEON TECHNOLOGIES AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interlayer of Sub-structure Having Elevations and Further Sub-struc...
- Publication number 20210335686
- Publication date Oct 28, 2021
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ENCAPSULANT UNDER COMPRESSIVE STRESS
- Publication number 20210166986
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Alexander ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM LAYER
- Publication number 20210035945
- Publication date Feb 4, 2021
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Providing Coated Leadframes or for Measuring an Adhesion...
- Publication number 20200381314
- Publication date Dec 3, 2020
- INFINEON TECHNOLOGIES AG
- Wu Hu Li
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Corrosion Protected Mold Compound
- Publication number 20200231800
- Publication date Jul 23, 2020
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interface Material Having a Polymer Ceramic
- Publication number 20200227339
- Publication date Jul 16, 2020
- Stefan Schwab
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Stefan Schwab

Person

Patents Grantslast 30 patents

Mold compounds and packages for encapsulating electronic components

Interlayer of sub-structure having elevations and further sub-struc...

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Soldering a conductor to an aluminum layer

Leadframe package with isolation layer

Patents Applicationslast 30 patents

PACKAGE WITH ENCAPSULANT AND FURTHER ENCAPSULANT THEREON

CHIP ARRANGEMENT, CHIP PACKAGE, METHOD OF FORMING A CHIP ARRANGEMEN...

SEMICONDUCTOR MODULE WITH SHAPED EXTERNAL CONTACT FOR REDUCED CRACK...

FILLER PARTICLE HAVING MORPHOLOGICAL ADHESION PROMOTER SHELL ON CORE

MOLD COMPOUNDS AND PACKAGES FOR ENCAPSULATING ELECTRONIC COMPONENTS

LEADFRAME PACKAGE WITH ISOLATION LAYER

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Interlayer of Sub-structure Having Elevations and Further Sub-struc...

PACKAGE WITH ENCAPSULANT UNDER COMPRESSIVE STRESS

SOLDERING A CONDUCTOR TO AN ALUMINUM LAYER

Method for Providing Coated Leadframes or for Measuring an Adhesion...

Corrosion Protected Mold Compound

Interface Material Having a Polymer Ceramic