Stefan Schwab

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Singapore, MY

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a package having an adhesion promoter
- Patent number 12,230,547
- Issue date Feb 18, 2025
- Infineon Technologies AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package with Insert
- Publication number 20240178109
- Publication date May 30, 2024
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Package Having an Adhesion Promoter
- Publication number 20230260860
- Publication date Aug 17, 2023
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS