Stefan Steinhoff

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Somerset, GB

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip package and method of assembly
- Patent number 11,948,878
- Issue date Apr 2, 2024
- Littelfuse, Inc.
- Stefan Steinhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and method of assembly
- Patent number 11,488,903
- Issue date Nov 1, 2022
- Littelfuse, Inc.
- Stefan Steinhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip contact structure, device assembly, and method o...
- Patent number 11,094,614
- Issue date Aug 17, 2021
- Littelfuse, Inc.
- Stefan Steinhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered backside shim in a press pack cassette
- Patent number 9,099,316
- Issue date Aug 4, 2015
- IXYS Corporation
- Stefan Steinhoff
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND METHOD OF ASSEMBLY
- Publication number 20230032658
- Publication date Feb 2, 2023
- LITTELFUSE, INC.
- Stefan Steinhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND METHOD OF ASSEMBLY
- Publication number 20210233838
- Publication date Jul 29, 2021
- LITTELFUSE, INC.
- Stefan Steinhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP CONTACT STRUCTURE, DEVICE ASSEMBLY, AND METHOD O...
- Publication number 20210090972
- Publication date Mar 25, 2021
- LITTELFUSE, INC.
- Stefan Steinhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERED BACKSIDE SHIM IN A PRESS PACK CASSETTE
- Publication number 20150102481
- Publication date Apr 16, 2015
- IXYS Corporation
- Stefan Steinhoff
- H01 - BASIC ELECTRIC ELEMENTS