Stefan WELSCH

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Polling, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing semiconductor wafers using a wire saw, wire sa...
- Patent number 12,083,705
- Issue date Sep 10, 2024
- Siltronic AG
- Axel Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method, control system, and system for machining a semiconductor wa...
- Patent number 11,658,022
- Issue date May 23, 2023
- Siltronic AG
- Axel Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, control system and plant for processing a semiconductor waf...
- Patent number 11,158,549
- Issue date Oct 26, 2021
- Siltronic AG
- Stefan Welsch
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...
- Publication number 20240246260
- Publication date Jul 25, 2024
- Siltronic AG
- Axel BEYER
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD, CONTROL SYSTEM, AND SYSTEM FOR MACHINING A SEMICONDUCTOR WA...
- Publication number 20230170206
- Publication date Jun 1, 2023
- Siltronic AG
- Axel BEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...
- Publication number 20220040882
- Publication date Feb 10, 2022
- Siltronic AG
- Axel BEYER
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD, CONTROL SYSTEM, AND SYSTEM FOR MACHINING A SEMICONDUCTOR WA...
- Publication number 20210358737
- Publication date Nov 18, 2021
- Siltronic AG
- Axel BEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, CONTROL SYSTEM AND PLANT FOR PROCESSING A SEMICONDUCTOR WAF...
- Publication number 20200126876
- Publication date Apr 23, 2020
- Siltronic AG
- Stefan WELSCH
- B24 - GRINDING POLISHING