Stefan Woehlert

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Chip with a silicon carbide substrate
- Patent number 12,327,727
- Issue date Jun 10, 2025
- Infineon Technologies AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming a semiconductor device
- Patent number 11,842,938
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing an electrical contact on a silicon carbide su...
- Patent number 11,798,807
- Issue date Oct 24, 2023
- Infineon Technologies AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic module and methods for fabricating th...
- Patent number 11,615,963
- Issue date Mar 28, 2023
- Infineon Technologies AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate having a bond pad material based on aluminum
- Patent number 11,410,950
- Issue date Aug 9, 2022
- Infineon Technologies AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming a semiconductor device
- Patent number 11,217,500
- Issue date Jan 4, 2022
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical contact connection on silicon carbide substrate
- Patent number 11,043,383
- Issue date Jun 22, 2021
- Infineon Technologies AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic module and methods for fabricating th...
- Patent number 10,741,402
- Issue date Aug 11, 2020
- Infineon Technologies AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a copper element and method of forming...
- Patent number 10,446,469
- Issue date Oct 15, 2019
- Infineon Technologies AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a wafer and wafer structure
- Patent number 9,935,060
- Issue date Apr 3, 2018
- Infineon Technologies AG
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive element, power semiconductor device having...
- Patent number 9,812,376
- Issue date Nov 7, 2017
- Infineon Technologies AG
- Stefan Woehlert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a device by locally heating one or more met...
- Patent number 9,634,108
- Issue date Apr 25, 2017
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a wafer and wafer structure
- Patent number 9,589,880
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of forming an integrated circuit
- Patent number 9,418,937
- Issue date Aug 16, 2016
- Infineon Technologies AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a device by locally heating one or more met...
- Patent number 9,391,154
- Issue date Jul 12, 2016
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a device by locally heating one or more met...
- Patent number 9,209,281
- Issue date Dec 8, 2015
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including power transistor cells and a connectin...
- Patent number 8,502,274
- Issue date Aug 6, 2013
- Infineon Technologies AG
- Kurt Matoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor device and methods for producing...
- Patent number 8,324,115
- Issue date Dec 4, 2012
- Infineon Technologies AG
- Ralf Otremba
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device
- Patent number 8,156,643
- Issue date Apr 17, 2012
- Infineon Technologies AG
- Manfred Schneegans
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor arrangement including a load transistor and sense tra...
- Patent number 8,097,918
- Issue date Jan 17, 2012
- Infineon Technologies AG
- Christoph Kadow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having a semiconductor arrangement
- Patent number 7,834,427
- Issue date Nov 16, 2010
- Infineon Technologies Austria AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chip with a Silicon Carbide Substrate
- Publication number 20230420257
- Publication date Dec 28, 2023
- INFINEON TECHNOLOGIES AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming a Semiconductor Device
- Publication number 20220093483
- Publication date Mar 24, 2022
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Producing an Electrical Contact on a Silicon Carbide Su...
- Publication number 20210265168
- Publication date Aug 26, 2021
- INFINEON TECHNOLOGIES AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Substrate Having a Bond Pad Material Based on Aluminum
- Publication number 20210091025
- Publication date Mar 25, 2021
- INFINEON TECHNOLOGIES AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...
- Publication number 20200343094
- Publication date Oct 29, 2020
- INFINEON TECHNOLOGIES AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Contact Connection on Silicon Carbide Substrate
- Publication number 20190362973
- Publication date Nov 28, 2019
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming a Semiconductor Device
- Publication number 20190311966
- Publication date Oct 10, 2019
- INFINEON TECHNOLOGIES AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...
- Publication number 20180082848
- Publication date Mar 22, 2018
- INFINEON TECHNOLOGIES AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A WAFER AND WAFER STRUCTURE
- Publication number 20170154857
- Publication date Jun 1, 2017
- INFINEON TECHNOLOGIES AG
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, A SEMICONDUCTOR DEVICE AND A LAYER ARRANGEMENT
- Publication number 20170053879
- Publication date Feb 23, 2017
- INFINEON TECHNOLOGIES AG
- SRINIVASA REDDY YEDURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Copper Element and Method of Forming...
- Publication number 20160329263
- Publication date Nov 10, 2016
- INFINEON TECHNOLOGIES AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Device by Locally Heating One or More Met...
- Publication number 20160155861
- Publication date Jun 2, 2016
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Device by Locally Heating One or More Met...
- Publication number 20160064504
- Publication date Mar 3, 2016
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically Conductive Element, Power Semiconductor Device Having...
- Publication number 20160013117
- Publication date Jan 14, 2016
- INFINEON TECHNOLOGIES AG
- Stefan Woehlert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A WAFER AND WAFER STRUCTURE
- Publication number 20150097294
- Publication date Apr 9, 2015
- INFINEON TECHNOLOGIES AG
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit and Method of Forming an Integrated Circuit
- Publication number 20130147047
- Publication date Jun 13, 2013
- INFINEON TECHNOLOGIES AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110107595
- Publication date May 12, 2011
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT INCLUDING A LOAD TRANSISTOR AND SENSE TRA...
- Publication number 20110037126
- Publication date Feb 17, 2011
- INFINEON TECHNOLOGIES AG
- Christoph Kadow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080315423
- Publication date Dec 25, 2008
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a device by locally heating one or more met...
- Publication number 20080258183
- Publication date Oct 23, 2008
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR ARRANGEMENT
- Publication number 20080179669
- Publication date Jul 31, 2008
- Infineon Technologies Austria AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip, semiconductor device and methods for producing...
- Publication number 20080105907
- Publication date May 8, 2008
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon wafer with solderable coating on its wafer rear side, and p...
- Publication number 20060273810
- Publication date Dec 7, 2006
- Paul Ganitzer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Stefan Woehlert

Person

Patents Grantslast 30 patents

Chip with a silicon carbide substrate

Semiconductor device and method for forming a semiconductor device

Process for producing an electrical contact on a silicon carbide su...

Electronic device, electronic module and methods for fabricating th...

Semiconductor substrate having a bond pad material based on aluminum

Semiconductor device and method for forming a semiconductor device

Electrical contact connection on silicon carbide substrate

Electronic device, electronic module and methods for fabricating th...

Semiconductor device having a copper element and method of forming...

Method for processing a wafer and wafer structure

Electrically conductive element, power semiconductor device having...

Method of manufacturing a device by locally heating one or more met...

Method for processing a wafer and wafer structure

Integrated circuit and method of forming an integrated circuit

Method of manufacturing a device by locally heating one or more met...

Method of manufacturing a device by locally heating one or more met...

Integrated circuit including power transistor cells and a connectin...

Semiconductor chip, semiconductor device and methods for producing...

Semiconductor device

Semiconductor arrangement including a load transistor and sense tra...

Integrated circuit having a semiconductor arrangement

Patents Applicationslast 30 patents

Chip with a Silicon Carbide Substrate

Semiconductor Device and Method for Forming a Semiconductor Device

Process for Producing an Electrical Contact on a Silicon Carbide Su...

Semiconductor Substrate Having a Bond Pad Material Based on Aluminum

ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...

Electrical Contact Connection on Silicon Carbide Substrate

Semiconductor Device and Method for Forming a Semiconductor Device

ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...

METHOD FOR PROCESSING A WAFER AND WAFER STRUCTURE

METHOD, A SEMICONDUCTOR DEVICE AND A LAYER ARRANGEMENT

Semiconductor Device Having a Copper Element and Method of Forming...

Method of Manufacturing a Device by Locally Heating One or More Met...

Method of Manufacturing a Device by Locally Heating One or More Met...

Electrically Conductive Element, Power Semiconductor Device Having...

METHOD FOR PROCESSING A WAFER AND WAFER STRUCTURE

Integrated Circuit and Method of Forming an Integrated Circuit

SEMICONDUCTOR DEVICE

SEMICONDUCTOR ARRANGEMENT INCLUDING A LOAD TRANSISTOR AND SENSE TRA...

SEMICONDUCTOR DEVICE

Method of manufacturing a device by locally heating one or more met...

INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR ARRANGEMENT

Semiconductor chip, semiconductor device and methods for producing...

Silicon wafer with solderable coating on its wafer rear side, and p...