Stefanie Ruth Chiras

Person

Peekskill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Asynchronous persistent stores for transactions
- Patent number 9,081,606
- Issue date Jul 14, 2015
- International Business Machines Corporation
- Gary D. Carpenter
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory programming for a phase change memory cell
- Patent number 8,897,062
- Issue date Nov 25, 2014
- International Business Machines Corporation
- Matthew J. Breitwisch
- G11 - INFORMATION STORAGE
Information Patent Grant
Writing to memory using adaptive write techniques
- Patent number 8,230,276
- Issue date Jul 24, 2012
- International Business Machines Corporation
- Stefanie Chiras
- G11 - INFORMATION STORAGE
Information Patent Grant
Writing a special symbol to a memory to indicate the absence of a d...
- Patent number 8,166,368
- Issue date Apr 24, 2012
- International Business Machines Corporation
- Luis A. Lastras-Montano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Iteratively writing contents to memory locations using a statistica...
- Patent number 8,023,345
- Issue date Sep 20, 2011
- International Business Machines Corporation
- Matthew J. Breitwisch
- G11 - INFORMATION STORAGE
Information Patent Grant
Formation of aligned capped metal lines and interconnections in mul...
- Patent number 7,825,516
- Issue date Nov 2, 2010
- International Business Machines Corporation
- Stefanie Ruth Chiras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure to improve adhesion between top CVD low-K dielectric and...
- Patent number 7,820,559
- Issue date Oct 26, 2010
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal capped copper interconnect
- Patent number 7,495,338
- Issue date Feb 24, 2009
- International Business Machines Corporation
- Michael Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure to improve adhesion between top CVD low-k dielectric and...
- Patent number 7,402,532
- Issue date Jul 22, 2008
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball limiting metallurgy, interconnection structure including the s...
- Patent number 7,273,803
- Issue date Sep 25, 2007
- International Business Machines Corporation
- Yu-Ting Cheng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electroplated CoWP composite structures as copper barrier layers
- Patent number 7,217,655
- Issue date May 15, 2007
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated CoWP composite structures as copper barrier layers
- Patent number 7,193,323
- Issue date Mar 20, 2007
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper conductor
- Patent number 7,119,018
- Issue date Oct 10, 2006
- International Buisness Machines Corporation
- Michael W. Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure to improve adhesion between top CVD low-k dielectric and...
- Patent number 7,102,232
- Issue date Sep 5, 2006
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Line level air gaps
- Patent number 7,084,479
- Issue date Aug 1, 2006
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ASYNCHRONOUS PERSISTENT STORES FOR TRANSACTIONS
- Publication number 20140136786
- Publication date May 15, 2014
- International Business Machines Corporation
- Gary D. Carpenter
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY PROGRAMMING
- Publication number 20110228600
- Publication date Sep 22, 2011
- International Business Machines Corporation
- Matthew J. Breitwisch
- G11 - INFORMATION STORAGE
Information Patent Application
WRITING TO MEMORY USING SHARED ADDRESS BUSES
- Publication number 20110078387
- Publication date Mar 31, 2011
- International Business Machines Corporation
- Stefanie Chiras
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WRITING TO MEMORY USING ADAPTIVE WRITE TECHNIQUES
- Publication number 20110078392
- Publication date Mar 31, 2011
- International Business Machines Corporation
- Stefanie Chiras
- G11 - INFORMATION STORAGE
Information Patent Application
WRITING A SPECIAL SYMBOL TO A MEMORY TO INDICATE THE ABSENCE OF A D...
- Publication number 20100218071
- Publication date Aug 26, 2010
- International Business Machines Corporation
- Luis A. Lastras-Montano
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY PROGRAMMING
- Publication number 20100214829
- Publication date Aug 26, 2010
- International Business Machines Corporation
- Matthew J. Breitwisch
- G11 - INFORMATION STORAGE
Information Patent Application
STRUCTURE TO IMPROVE ADHESION BETWEEN TOP CVD LOW-K DIELECTRIC AND...
- Publication number 20080254643
- Publication date Oct 16, 2008
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball Limiting Metallurgy, Interconnection Structure Including the S...
- Publication number 20080008900
- Publication date Jan 10, 2008
- Yu-Ting Cheng
- B32 - LAYERED PRODUCTS
Information Patent Application
Structure to improve adhesion between top CVD low-k dielectric and...
- Publication number 20070148958
- Publication date Jun 28, 2007
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Line level air gaps
- Publication number 20060264036
- Publication date Nov 23, 2006
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal capped copper interconnect
- Publication number 20060157857
- Publication date Jul 20, 2006
- International Business Machines Corporation
- Michael Lane
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Reliability of low-k dielectric devices with energy dissipative layer
- Publication number 20060012014
- Publication date Jan 19, 2006
- International Business Machines Corporation
- Shyng-Tsong T. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper conductor
- Publication number 20060006070
- Publication date Jan 12, 2006
- International Business Machines Corporation
- Michael Lane
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Structure to improve adhesion between top CVD low-k dielectiric and...
- Publication number 20050230831
- Publication date Oct 20, 2005
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Line level air gaps
- Publication number 20050127514
- Publication date Jun 16, 2005
- IBM
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroplated CoWP composite structures as copper barrier layers
- Publication number 20050127518
- Publication date Jun 16, 2005
- International Business Machines Corporation
- Cyril Cabral
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for forming an electrically conductive interconnect
- Publication number 20050118796
- Publication date Jun 2, 2005
- Stefanie R. Chiras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball limiting metallurgy, interconnection structure including the s...
- Publication number 20050118437
- Publication date Jun 2, 2005
- International Business Machines Corporation
- Yu-Ting Cheng
- B32 - LAYERED PRODUCTS
Information Patent Application
Electroplated CoWP composite structures as copper barrier layers
- Publication number 20050104216
- Publication date May 19, 2005
- International Business Machines Corporation
- Cyril Cabral
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Formation of aligned capped metal lines and interconnections in mul...
- Publication number 20040113277
- Publication date Jun 17, 2004
- Stefanie Ruth Chiras
- H01 - BASIC ELECTRIC ELEMENTS

Stefanie Ruth Chiras

Person

Patents Grantslast 30 patents

Asynchronous persistent stores for transactions

Memory programming for a phase change memory cell

Writing to memory using adaptive write techniques

Writing a special symbol to a memory to indicate the absence of a d...

Iteratively writing contents to memory locations using a statistica...

Formation of aligned capped metal lines and interconnections in mul...

Structure to improve adhesion between top CVD low-K dielectric and...

Metal capped copper interconnect

Structure to improve adhesion between top CVD low-k dielectric and...

Ball limiting metallurgy, interconnection structure including the s...

Electroplated CoWP composite structures as copper barrier layers

Electroplated CoWP composite structures as copper barrier layers

Copper conductor

Structure to improve adhesion between top CVD low-k dielectric and...

Line level air gaps

Patents Applicationslast 30 patents

ASYNCHRONOUS PERSISTENT STORES FOR TRANSACTIONS

MEMORY PROGRAMMING

WRITING TO MEMORY USING SHARED ADDRESS BUSES

WRITING TO MEMORY USING ADAPTIVE WRITE TECHNIQUES

WRITING A SPECIAL SYMBOL TO A MEMORY TO INDICATE THE ABSENCE OF A D...

MEMORY PROGRAMMING

STRUCTURE TO IMPROVE ADHESION BETWEEN TOP CVD LOW-K DIELECTRIC AND...

Ball Limiting Metallurgy, Interconnection Structure Including the S...

Structure to improve adhesion between top CVD low-k dielectric and...

Line level air gaps

Metal capped copper interconnect

Reliability of low-k dielectric devices with energy dissipative layer

Copper conductor

Structure to improve adhesion between top CVD low-k dielectiric and...

Line level air gaps

Electroplated CoWP composite structures as copper barrier layers

Process for forming an electrically conductive interconnect

Ball limiting metallurgy, interconnection structure including the s...

Electroplated CoWP composite structures as copper barrier layers

Formation of aligned capped metal lines and interconnections in mul...