Stefano Schiaffino

Person

Mento Park, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
System, method, and device for forming an array of emulsions
- Patent number 11,779,925
- Issue date Oct 10, 2023
- Bio-Rad Laboratories, Inc.
- Thomas Henry Cauley
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
System, method, and device for forming an array of emulsions
- Patent number 11,207,685
- Issue date Dec 28, 2021
- Bio-Rad Laboratories, Inc.
- Thomas Henry Cauley
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Microfluidic system with fluid pickups
- Patent number 10,682,647
- Issue date Jun 16, 2020
- Bio-Rad Laboratories, Inc.
- Anthony J. Makarewicz
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
P—N separation metal fill for flip chip LEDs
- Patent number 10,170,675
- Issue date Jan 1, 2019
- Lumileds LLC
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealed semiconductor light emitting device
- Patent number 10,020,431
- Issue date Jul 10, 2018
- Lumileds LLC
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing solder pad topology differences by planarization
- Patent number 9,935,069
- Issue date Apr 3, 2018
- Lumileds LLC
- Jipu Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED having vertical contacts redistributed for flip chip mounting
- Patent number 9,722,137
- Issue date Aug 1, 2017
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P-n separation metal fill for flip chip LEDs
- Patent number 9,722,161
- Issue date Aug 1, 2017
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfluidic system with fluid pickups
- Patent number 9,687,848
- Issue date Jun 27, 2017
- Bio-Rad Laboratories, Inc.
- Anthony J. Makarewicz
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Light emitting device with reduced epi stress
- Patent number 9,660,164
- Issue date May 23, 2017
- Koninklijke Philips N.V.
- Frederic Stephane Diana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating a wafer of semiconductor devices
- Patent number 9,608,016
- Issue date Mar 28, 2017
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device with thick metal layers
- Patent number 9,484,513
- Issue date Nov 1, 2016
- Koninklijke Philips N.V.
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfluidic system with fluid pickups
- Patent number 9,409,174
- Issue date Aug 9, 2016
- Bio-Rad Laboratories, Inc.
- Anthony J. Makarewicz
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Semiconductor light emitting device with thick metal layers
- Patent number 9,324,927
- Issue date Apr 26, 2016
- Koninklijke Philips N.V.
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device with reduced EPI stress
- Patent number 9,093,630
- Issue date Jul 28, 2015
- Koninklijke Philips Electronics N.V.
- Frederic Stephane Diana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding a semiconductor device using a compliant bonding...
- Patent number 9,076,944
- Issue date Jul 7, 2015
- Koninklijke Philips Electronics N.V.
- James G. Neff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED assembly having maximum metal support for laser lift-off of gro...
- Patent number 8,384,118
- Issue date Feb 26, 2013
- Koninklijke Philips Electronics N.V.
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding a semiconductor device using a compliant bonding...
- Patent number 8,202,741
- Issue date Jun 19, 2012
- Koninklijke Philips Electronics N.V.
- James G. Neff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant bonding structures for semiconductor devices
- Patent number 8,053,905
- Issue date Nov 8, 2011
- Koninklijke Philips Electronics N.V.
- John E. Epler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extension of contact pads to the die edge via electrical isolation
- Patent number 7,977,132
- Issue date Jul 12, 2011
- Koninklijke Philips Electronics N.V.
- Tal Margalith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical contacts for a semiconductor light emitting apparatus
- Patent number 7,842,963
- Issue date Nov 30, 2010
- Koninklijke Philips Electronics N.V.
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED assembly having maximum metal support for laser lift-off of gro...
- Patent number 7,736,945
- Issue date Jun 15, 2010
- Philips Lumileds Lighting Company, LLC
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit for establishing electrical connectivity with opti...
- Patent number 7,439,449
- Issue date Oct 21, 2008
- Finisar Corporation
- Dev E. Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices for reflection reduction in optical devices
- Patent number 7,354,201
- Issue date Apr 8, 2008
- Finisar Corporation
- Lewis B. Aronson
- G02 - OPTICS
Information Patent Grant
Interconnects for semiconductor light emitting devices
- Patent number 7,348,212
- Issue date Mar 25, 2008
- Philips Lumileds Lighting Company LLC
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic components with multi-layer feedthrough structure
- Patent number 7,210,859
- Issue date May 1, 2007
- Finisar Corporation
- Dev E. Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small form factor transceiver with externally modulated laser
- Patent number 7,066,659
- Issue date Jun 27, 2006
- Finisar Corporation
- Lewis B. Aronson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small form factor transceiver with externally modulated laser
- Patent number 6,996,304
- Issue date Feb 7, 2006
- Finisar Corporation
- Lewis B. Aronson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Header assembly for optoelectronic devices
- Patent number 6,911,599
- Issue date Jun 28, 2005
- Finisar Corporation
- Paul K. Rosenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small form factor optical transceiver with extended transmission range
- Patent number 6,878,875
- Issue date Apr 12, 2005
- Finisar Corporation
- Lewis B. Aronson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM, METHOD, AND DEVICE FOR FORMING AN ARRAY OF EMULSIONS
- Publication number 20220097068
- Publication date Mar 31, 2022
- Bio-Rad Laboratories, Inc.
- Thomas Henry CAULEY
- G01 - MEASURING TESTING
Information Patent Application
SEALED SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20180323353
- Publication date Nov 8, 2018
- Lumileds LLC
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, METHOD, AND DEVICE FOR FORMING AN ARRAY OF EMULSIONS
- Publication number 20180229239
- Publication date Aug 16, 2018
- Bio-Rad Laboratories, Inc.
- Trey CAULEY
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ASSAY PERFORMANCE SYSTEMS INCLUDING AQUEOUS SAMPLE STABILIZATION
- Publication number 20180209874
- Publication date Jul 26, 2018
- Bio-Rad Laboratories, Inc.
- Sean Cater
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
LED HAVING VERTICAL CONTACTS REDISTRIBUTED FOR FLIP CHIP MOUNTING
- Publication number 20180019370
- Publication date Jan 18, 2018
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
P-N SEPARATION METAL FILL FOR FLIP CHIP LEDS
- Publication number 20170373235
- Publication date Dec 28, 2017
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFLUIDIC SYSTEM WITH FLUID PICKUPS
- Publication number 20170291174
- Publication date Oct 12, 2017
- Bio-Rad Laboratories, Inc.
- Anthony J. Makarewicz
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
DROPLET ASSAY SYSTEM WITH AUTOMATIC CALIBRATION
- Publication number 20170189908
- Publication date Jul 6, 2017
- Bio-Rad Laboratories, Inc.
- John Dzenitis
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
MICROFLUIDIC SYSTEM WITH FLUID PICKUPS
- Publication number 20160339436
- Publication date Nov 24, 2016
- Bio-Rad Laboratories, Inc.
- Anthony J. Makarewicz
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE WITH THICK METAL LAYERS
- Publication number 20160233400
- Publication date Aug 11, 2016
- Koninklijke Philips N.V.
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING SOLDER PAD TOPOLOGY DIFFERENCES BY PLANARIZATION
- Publication number 20160181216
- Publication date Jun 23, 2016
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
P-N SEPARATION METAL FILL FOR FLIP CHIP LEDS
- Publication number 20160126436
- Publication date May 5, 2016
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED HAVING VERTICAL CONTACTS REDISTRIBUTED FOR FLIP CHIP MOUNTING
- Publication number 20160126408
- Publication date May 5, 2016
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE WITH REDUCED EPI STRESS
- Publication number 20150318459
- Publication date Nov 5, 2015
- Koninklijke Philips N.V.
- FREDERIC STEPHANE DIANA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEPARATING A WAFER OF SEMICONDUCTOR DEVICES
- Publication number 20150140711
- Publication date May 21, 2015
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALED SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20150076538
- Publication date Mar 19, 2015
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFLUIDIC SYSTEM WITH FLUID PICKUPS
- Publication number 20140378348
- Publication date Dec 25, 2014
- Anthony J. Makarewicz
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE WITH THICK METAL LAYERS
- Publication number 20140339597
- Publication date Nov 20, 2014
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE WITH REDUCE EPI STRESS
- Publication number 20130193476
- Publication date Aug 1, 2013
- Koninklijke Philips Electronics N.V.
- Frederic Stephane Diana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING A SEMICONDUCTOR DEVICE USING A COMPLIANT BONDING...
- Publication number 20120225505
- Publication date Sep 6, 2012
- PHILIPS LUMILEDS LIGHTING COMPANY, LLC
- James G. Neff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20110114987
- Publication date May 19, 2011
- Koninklijke Philips Electronics N.V.
- John E. Epler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM FLIP-CHIP SERIES CONNECTED LEDS
- Publication number 20110018013
- Publication date Jan 27, 2011
- Koninklijke Philips Electronics N.V.
- Tal MARGALITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENSION OF CONTACT PADS TO THE DIE EDGE VIA ELECTRICAL ISOLATION
- Publication number 20100283080
- Publication date Nov 11, 2010
- Koninklijke Philips Electronics N.V.
- Tal MARGALITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING A SEMICONDUCTOR DEVICE USING A COMPLIANT BONDING...
- Publication number 20100227421
- Publication date Sep 9, 2010
- Koninklijke Philips Electronics N.V.
- James G. Neff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED ASSEMBLY HAVING MAXIMUM METAL SUPPORT FOR LASER LIFT-OFF OF GRO...
- Publication number 20100207157
- Publication date Aug 19, 2010
- Koninklijke Philips Electronics N.V.
- Stefano SCHIAFFINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnects for semiconductor light emitting devices
- Publication number 20080142833
- Publication date Jun 19, 2008
- Philips Lumileds Lighting Company LLC
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Contacts for a Semiconductor Light Emitting Apparatus
- Publication number 20080096297
- Publication date Apr 24, 2008
- PHILIPS LUMILEDS LIGHTING COMPANY, LLC
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED Assembly Having Maximum Metal Support for Laser Lift-Off of Gro...
- Publication number 20070096130
- Publication date May 3, 2007
- PHILIPS LUMILEDS LIGHTING COMPANY, LLC
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnects for semiconductor light emitting devices
- Publication number 20070057271
- Publication date Mar 15, 2007
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Receive optical assembly with angled optical receiver
- Publication number 20050196173
- Publication date Sep 8, 2005
- Finisar Corporation
- Stefano Schiaffino
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Stefano Schiaffino

Person

Patents Grantslast 30 patents

System, method, and device for forming an array of emulsions

System, method, and device for forming an array of emulsions

Microfluidic system with fluid pickups

P—N separation metal fill for flip chip LEDs

Sealed semiconductor light emitting device

Reducing solder pad topology differences by planarization

LED having vertical contacts redistributed for flip chip mounting

P-n separation metal fill for flip chip LEDs

Microfluidic system with fluid pickups

Light emitting device with reduced epi stress

Method of separating a wafer of semiconductor devices

Semiconductor light emitting device with thick metal layers

Microfluidic system with fluid pickups

Semiconductor light emitting device with thick metal layers

Light emitting device with reduced EPI stress

Method of bonding a semiconductor device using a compliant bonding...

LED assembly having maximum metal support for laser lift-off of gro...

Method of bonding a semiconductor device using a compliant bonding...

Compliant bonding structures for semiconductor devices

Extension of contact pads to the die edge via electrical isolation

Electrical contacts for a semiconductor light emitting apparatus

LED assembly having maximum metal support for laser lift-off of gro...

Flexible circuit for establishing electrical connectivity with opti...

Devices for reflection reduction in optical devices

Interconnects for semiconductor light emitting devices

Optoelectronic components with multi-layer feedthrough structure

Small form factor transceiver with externally modulated laser

Small form factor transceiver with externally modulated laser

Header assembly for optoelectronic devices

Small form factor optical transceiver with extended transmission range

Patents Applicationslast 30 patents

SYSTEM, METHOD, AND DEVICE FOR FORMING AN ARRAY OF EMULSIONS

SEALED SEMICONDUCTOR LIGHT EMITTING DEVICE

SYSTEM, METHOD, AND DEVICE FOR FORMING AN ARRAY OF EMULSIONS

ASSAY PERFORMANCE SYSTEMS INCLUDING AQUEOUS SAMPLE STABILIZATION

LED HAVING VERTICAL CONTACTS REDISTRIBUTED FOR FLIP CHIP MOUNTING

P-N SEPARATION METAL FILL FOR FLIP CHIP LEDS

MICROFLUIDIC SYSTEM WITH FLUID PICKUPS

DROPLET ASSAY SYSTEM WITH AUTOMATIC CALIBRATION

MICROFLUIDIC SYSTEM WITH FLUID PICKUPS

SEMICONDUCTOR LIGHT EMITTING DEVICE WITH THICK METAL LAYERS

REDUCING SOLDER PAD TOPOLOGY DIFFERENCES BY PLANARIZATION

P-N SEPARATION METAL FILL FOR FLIP CHIP LEDS

LED HAVING VERTICAL CONTACTS REDISTRIBUTED FOR FLIP CHIP MOUNTING

LIGHT EMITTING DEVICE WITH REDUCED EPI STRESS

METHOD OF SEPARATING A WAFER OF SEMICONDUCTOR DEVICES

SEALED SEMICONDUCTOR LIGHT EMITTING DEVICE

MICROFLUIDIC SYSTEM WITH FLUID PICKUPS

SEMICONDUCTOR LIGHT EMITTING DEVICE WITH THICK METAL LAYERS

LIGHT EMITTING DEVICE WITH REDUCE EPI STRESS

METHOD OF BONDING A SEMICONDUCTOR DEVICE USING A COMPLIANT BONDING...

COMPLIANT BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES

THIN-FILM FLIP-CHIP SERIES CONNECTED LEDS

EXTENSION OF CONTACT PADS TO THE DIE EDGE VIA ELECTRICAL ISOLATION

METHOD OF BONDING A SEMICONDUCTOR DEVICE USING A COMPLIANT BONDING...

LED ASSEMBLY HAVING MAXIMUM METAL SUPPORT FOR LASER LIFT-OFF OF GRO...

Interconnects for semiconductor light emitting devices

Electrical Contacts for a Semiconductor Light Emitting Apparatus

LED Assembly Having Maximum Metal Support for Laser Lift-Off of Gro...

Interconnects for semiconductor light emitting devices

Receive optical assembly with angled optical receiver