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Steffany Ann Lacierda Moreno

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  • Bamban, PH
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Patents Grantslast 30 patents

  • Information Patent Grant

    Flip-chip package assembly
    • Patent number 12,266,631
    • Issue date Apr 1, 2025
    • Texas Instruments Incorporated
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device assembly with pre-reflowed solder
    • Patent number 12,132,027
    • Issue date Oct 29, 2024
    • Texas Instruments Incorporated
    • James Raymond Maliclic Baello
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Flip chip package assembly
    • Patent number 11,929,308
    • Issue date Mar 12, 2024
    • Texas Instruments Incorporated
    • Steffany Ann Lacierda Moreno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Flip-chip package assembly
    • Patent number 11,637,083
    • Issue date Apr 25, 2023
    • Texas Instruments Incorporated
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package with flip chip solder joint capsules
    • Patent number 11,600,498
    • Issue date Mar 7, 2023
    • Texas Instruments Incorporated
    • James Raymond Maliclic Baello
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents