Steffen Bieselt

Person

Stadt Wehlen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Sensor system with a microelectromechanical sensor element and meth...
- Patent number 12,043,539
- Issue date Jul 23, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Dirk Meinhold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of producing a semiconductor component and semiconductor com...
- Patent number 12,002,812
- Issue date Jun 4, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromechanical sensor and methods for producing a micromechanical...
- Patent number 11,493,532
- Issue date Nov 8, 2022
- Infineon Technologies Dresden GmbH & Co. KG
- Erhard Landgraf
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive microelectromechanical device and method for forming a c...
- Patent number 11,422,151
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device, method for manufacturing a microelec...
- Patent number 11,078,072
- Issue date Aug 3, 2021
- Infineon Technologies Dresden GmbH & Co. KG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-mechanical sensor and method for manufacturing a micro-electr...
- Patent number 10,961,116
- Issue date Mar 30, 2021
- Infineon Technologies Dresden GmbH & Co. KG
- Dirk Meinhold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stressed decoupled micro-electro-mechanical system sensor
- Patent number 10,870,575
- Issue date Dec 22, 2020
- Infineon Technologies Dresden GmbH & Co. KG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor and methods for producing a micromechanical...
- Patent number 10,852,319
- Issue date Dec 1, 2020
- Infineon Technologies Dresden GmbH & Co. KG
- Erhard Landgraf
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive microelectromechanical device and method for forming a c...
- Patent number 10,684,306
- Issue date Jun 16, 2020
- Infineon Technologies AG
- Steffen Bieselt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device, method for manufacturing a microelec...
- Patent number 10,683,203
- Issue date Jun 16, 2020
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device and method for forming a microelectro...
- Patent number 10,580,663
- Issue date Mar 3, 2020
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated semiconductor device and manufacturing method
- Patent number 10,544,037
- Issue date Jan 28, 2020
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Accelerometer with compatibility to complementary metal-oxide-semic...
- Patent number 10,539,587
- Issue date Jan 21, 2020
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- G01 - MEASURING TESTING
Information Patent Grant
Silicon on nothing devices and methods of formation thereof
- Patent number 10,354,911
- Issue date Jul 16, 2019
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Emitter and method for manufacturing the same
- Patent number 10,290,805
- Issue date May 14, 2019
- Infineon Technologies Dresden GmbH
- Steffen Bieselt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic device and method for operat...
- Patent number 10,170,497
- Issue date Jan 1, 2019
- Thoralf Kautzsch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier and a method for processing a carrier
- Patent number 10,096,511
- Issue date Oct 9, 2018
- Infineon Technologies Dresden GmbH
- Steffen Bieselt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical stress-decoupling in semiconductor device
- Patent number 9,991,340
- Issue date Jun 5, 2018
- Infineon Technologies AG
- Steffen Bieselt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for a comb-drive MEMS device
- Patent number 9,938,133
- Issue date Apr 10, 2018
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress decoupled piezoresistive relative pressure sensor and method...
- Patent number 9,938,135
- Issue date Apr 10, 2018
- Infineon Technologies Dresden GmbH
- Steffen Bieselt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing an electronic device and method for operat...
- Patent number 9,929,181
- Issue date Mar 27, 2018
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated semiconductor device and manufacturing method
- Patent number 9,896,329
- Issue date Feb 20, 2018
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Emitter and method for manufacturing the same
- Patent number 9,887,355
- Issue date Feb 6, 2018
- Infineon Technologies Desden GmbH
- Steffen Bieselt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and a method for processing a carrier
- Patent number 9,716,015
- Issue date Jul 25, 2017
- Infineon Technologies Dresden GmbH
- Steffen Bieselt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon on nothing devices and methods of formation thereof
- Patent number 9,711,393
- Issue date Jul 18, 2017
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mechanical stress-decoupling in semiconductor device
- Patent number 9,663,354
- Issue date May 30, 2017
- Infineon Technologies AG
- Steffen Bieselt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Carrier and a method for processing a carrier
- Patent number 9,613,878
- Issue date Apr 4, 2017
- Infineon Technologies Dresden GmbH
- Steffen Bieselt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device, a method for manufacturing an electronic device,...
- Patent number 9,560,765
- Issue date Jan 31, 2017
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromechanical system and method for manufacturing a micromechanic...
- Patent number 9,382,111
- Issue date Jul 5, 2016
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for horizontal integration of acceleration sens...
- Patent number 9,330,929
- Issue date May 3, 2016
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SENSOR SYSTEM WITH A MICROELECTROMECHANICAL SENSOR ELEMENT AND METH...
- Publication number 20240343555
- Publication date Oct 17, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Dirk MEINHOLD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Component Including an Electronic Component Based on...
- Publication number 20240282774
- Publication date Aug 22, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR SYSTEM WITH A MICROELECTROMECHANICAL SENSOR ELEMENT AND METH...
- Publication number 20220348453
- Publication date Nov 3, 2022
- Infineon Technologies Dresden GmbH & Co. KG
- Dirk MEINHOLD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MICROELECTROMECHANICAL DEVICE AND METHOD FOR FORMING A C...
- Publication number 20220326275
- Publication date Oct 13, 2022
- INFINEON TECHNOLOGIES AG
- Thoralf KAUTZSCH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR COM...
- Publication number 20220285402
- Publication date Sep 8, 2022
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH PRESSURE AND ACCELERATION SENSOR ELEMENTS
- Publication number 20220074803
- Publication date Mar 10, 2022
- Infineon Technologies Dresden GmbH & Co. KG
- Steffen BIESELT
- G01 - MEASURING TESTING
Information Patent Application
MICROMECHANICAL SENSOR AND METHODS FOR PRODUCING A MICROMECHANICAL...
- Publication number 20200379004
- Publication date Dec 3, 2020
- Infineon Technologies Dresden GmbH & Co. KG
- Erhard LANDGRAF
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MICROELECTROMECHANICAL DEVICE AND METHOD FOR FORMING A C...
- Publication number 20200300886
- Publication date Sep 24, 2020
- INFINEON TECHNOLOGIES AG
- Thoralf KAUTZSCH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE, METHOD FOR MANUFACTURING A MICROELE...
- Publication number 20200290867
- Publication date Sep 17, 2020
- Infineon Technologies Dresden GmbH & Co. KG
- Thoralf KAUTZSCH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESSED DECOUPLED MICRO-ELECTRO-MECHANICAL SYSTEM SENSOR
- Publication number 20200002159
- Publication date Jan 2, 2020
- Infineon Technologies Dresden GmbH & Co. KG
- Horst THEUSS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-MECHANICAL SENSOR AND METHOD FOR MANUFACTURING A MICRO-ELECTR...
- Publication number 20190345027
- Publication date Nov 14, 2019
- Infineon Technologies Dresden GmbH & Co. KG
- Dirk MEINHOLD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL SENSOR AND METHODS FOR PRODUCING A MICROMECHANICAL...
- Publication number 20190004084
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Erhard LANDGRAF
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE, METHOD FOR MANUFACTURING A MICROELEC...
- Publication number 20180297838
- Publication date Oct 18, 2018
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELEROMETER WITH COMPATIBILITY TO COMPLEMENTARY METAL-OXIDE-SEMIC...
- Publication number 20180217178
- Publication date Aug 2, 2018
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf KAUTZSCH
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE AND METHOD FOR OPERAT...
- Publication number 20180175069
- Publication date Jun 21, 2018
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMITTER AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180159034
- Publication date Jun 7, 2018
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Steffen BIESELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20180155188
- Publication date Jun 7, 2018
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE AND METHOD FOR FORMING A MICROELECTRO...
- Publication number 20180065846
- Publication date Mar 8, 2018
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS DECOUPLED PIEZORESISTIVE RELATIVE PRESSURE SENSOR AND METHOD...
- Publication number 20170369306
- Publication date Dec 28, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Steffen BIESELT
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
System and Method for a Comb-drive MEMS Device
- Publication number 20170297895
- Publication date Oct 19, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Silicon on Nothing Devices and Methods of Formation Thereof
- Publication number 20170287772
- Publication date Oct 5, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MECHANICAL STRESS-DECOUPLING IN SEMICONDUCTOR DEVICE
- Publication number 20170229537
- Publication date Aug 10, 2017
- INFINEON TECHNOLOGIES AG
- Steffen Bieselt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CARRIER AND A METHOD FOR PROCESSING A CARRIER
- Publication number 20170140978
- Publication date May 18, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Steffen Bieselt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE AND METHOD FOR OPERAT...
- Publication number 20170092659
- Publication date Mar 30, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20170015546
- Publication date Jan 19, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MICROELECTROMECHANICAL DEVICE AND METHOD FOR FORMING A C...
- Publication number 20170010301
- Publication date Jan 12, 2017
- INFINEON TECHNOLOGIES AG
- Steffen BIESELT
- G01 - MEASURING TESTING
Information Patent Application
EMITTER AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160308084
- Publication date Oct 20, 2016
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Steffen BIESELT
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
SYSTEMS AND METHODS FOR HORIZONTAL INTEGRATION OF ACCELERATION SENS...
- Publication number 20160185594
- Publication date Jun 30, 2016
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CARRIER AND A METHOD FOR PROCESSING A CARRIER
- Publication number 20160118270
- Publication date Apr 28, 2016
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Steffen Bieselt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR HORIZONTAL INTEGRATION OF ACCELERATION SENS...
- Publication number 20160104625
- Publication date Apr 14, 2016
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- H01 - BASIC ELECTRIC ELEMENTS

Steffen Bieselt

Person

Patents Grantslast 30 patents

Sensor system with a microelectromechanical sensor element and meth...

Method of producing a semiconductor component and semiconductor com...

Micromechanical sensor and methods for producing a micromechanical...

Capacitive microelectromechanical device and method for forming a c...

Microelectromechanical device, method for manufacturing a microelec...

Micro-mechanical sensor and method for manufacturing a micro-electr...

Stressed decoupled micro-electro-mechanical system sensor

Micromechanical sensor and methods for producing a micromechanical...

Capacitive microelectromechanical device and method for forming a c...

Microelectromechanical device, method for manufacturing a microelec...

Microelectromechanical device and method for forming a microelectro...

Integrated semiconductor device and manufacturing method

Accelerometer with compatibility to complementary metal-oxide-semic...

Silicon on nothing devices and methods of formation thereof

Emitter and method for manufacturing the same

Method for manufacturing an electronic device and method for operat...

Carrier and a method for processing a carrier

Mechanical stress-decoupling in semiconductor device

System and method for a comb-drive MEMS device

Stress decoupled piezoresistive relative pressure sensor and method...

Method for manufacturing an electronic device and method for operat...

Integrated semiconductor device and manufacturing method

Emitter and method for manufacturing the same

Carrier and a method for processing a carrier

Silicon on nothing devices and methods of formation thereof

Mechanical stress-decoupling in semiconductor device

Carrier and a method for processing a carrier

Electronic device, a method for manufacturing an electronic device,...

Micromechanical system and method for manufacturing a micromechanic...

Systems and methods for horizontal integration of acceleration sens...

Patents Applicationslast 30 patents

SENSOR SYSTEM WITH A MICROELECTROMECHANICAL SENSOR ELEMENT AND METH...

Semiconductor Component Including an Electronic Component Based on...

SENSOR SYSTEM WITH A MICROELECTROMECHANICAL SENSOR ELEMENT AND METH...

CAPACITIVE MICROELECTROMECHANICAL DEVICE AND METHOD FOR FORMING A C...

METHOD OF PRODUCING A SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR COM...

SEMICONDUCTOR DIE WITH PRESSURE AND ACCELERATION SENSOR ELEMENTS

MICROMECHANICAL SENSOR AND METHODS FOR PRODUCING A MICROMECHANICAL...

CAPACITIVE MICROELECTROMECHANICAL DEVICE AND METHOD FOR FORMING A C...

MICROELECTROMECHANICAL DEVICE, METHOD FOR MANUFACTURING A MICROELE...

STRESSED DECOUPLED MICRO-ELECTRO-MECHANICAL SYSTEM SENSOR

MICRO-MECHANICAL SENSOR AND METHOD FOR MANUFACTURING A MICRO-ELECTR...

MICROMECHANICAL SENSOR AND METHODS FOR PRODUCING A MICROMECHANICAL...

MICROELECTROMECHANICAL DEVICE, METHOD FOR MANUFACTURING A MICROELEC...

ACCELEROMETER WITH COMPATIBILITY TO COMPLEMENTARY METAL-OXIDE-SEMIC...

METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE AND METHOD FOR OPERAT...

EMITTER AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

MICROELECTROMECHANICAL DEVICE AND METHOD FOR FORMING A MICROELECTRO...

STRESS DECOUPLED PIEZORESISTIVE RELATIVE PRESSURE SENSOR AND METHOD...

System and Method for a Comb-drive MEMS Device

Silicon on Nothing Devices and Methods of Formation Thereof

MECHANICAL STRESS-DECOUPLING IN SEMICONDUCTOR DEVICE

CARRIER AND A METHOD FOR PROCESSING A CARRIER

METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE AND METHOD FOR OPERAT...

INTEGRATED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

CAPACITIVE MICROELECTROMECHANICAL DEVICE AND METHOD FOR FORMING A C...

EMITTER AND METHOD FOR MANUFACTURING THE SAME

SYSTEMS AND METHODS FOR HORIZONTAL INTEGRATION OF ACCELERATION SENS...

CARRIER AND A METHOD FOR PROCESSING A CARRIER

SYSTEMS AND METHODS FOR HORIZONTAL INTEGRATION OF ACCELERATION SENS...