Steffen Jordan

Person

Sinzing, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a package having an adhesion promoter
- Patent number 12,288,727
- Issue date Apr 29, 2025
- Infineon Technologies AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a package having an adhesion promoter
- Patent number 12,230,547
- Issue date Feb 18, 2025
- Infineon Technologies AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip package and chip package
- Patent number 11,862,600
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inorganic encapsulant for electronic component with adhesion promoter
- Patent number 11,652,012
- Issue date May 16, 2023
- Infineon Technologies AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carriers and semiconductor devices including redistribution st...
- Patent number 10,366,924
- Issue date Jul 30, 2019
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of galvanic plating assisted by a current distribution layer
- Patent number 10,229,885
- Issue date Mar 12, 2019
- Infineon Technologies AG
- Martin Gruber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chip embedding package with solderable electric contact
- Patent number 10,229,891
- Issue date Mar 12, 2019
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of assembling a semiconductor package
- Patent number 8,410,586
- Issue date Apr 2, 2013
- Infineon Technologies, AG
- Edmund Riedl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor package
- Patent number 7,989,930
- Issue date Aug 2, 2011
- Infineon Technologies AG
- Edmund Riedl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of Manufacturing a Package Having an Adhesion Promoter
- Publication number 20230260860
- Publication date Aug 17, 2023
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP PACKAGE AND CHIP PACKAGE
- Publication number 20220108974
- Publication date Apr 7, 2022
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inorganic Encapsulant for Electronic Component with Adhesion Promoter
- Publication number 20200411400
- Publication date Dec 31, 2020
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIERS AND SEMICONDUCTOR DEVICES INCLUDING REDISTRIBUTION ST...
- Publication number 20170345714
- Publication date Nov 30, 2017
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip embedding package with solderable electric contact
- Publication number 20170250152
- Publication date Aug 31, 2017
- INFINEON TECHNOLOGIES AG
- Thorsten SCHARF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of galvanic plating assisted by a current distribution layer
- Publication number 20170229399
- Publication date Aug 10, 2017
- INFINEON TECHNOLOGIES AG
- Martin Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20090108423
- Publication date Apr 30, 2009
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Package and Method of Assembling a Semiconductor Package
- Publication number 20090065912
- Publication date Mar 12, 2009
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Steffen Jordan

Person

Patents Grantslast 30 patents

Method of manufacturing a package having an adhesion promoter

Method of manufacturing a package having an adhesion promoter

Method of forming a chip package and chip package

Inorganic encapsulant for electronic component with adhesion promoter

Chip carriers and semiconductor devices including redistribution st...

Method of galvanic plating assisted by a current distribution layer

Chip embedding package with solderable electric contact

Semiconductor package and method of assembling a semiconductor package

Semiconductor package

Patents Applicationslast 30 patents

Method of Manufacturing a Package Having an Adhesion Promoter

METHOD OF FORMING A CHIP PACKAGE AND CHIP PACKAGE

Inorganic Encapsulant for Electronic Component with Adhesion Promoter

CHIP CARRIERS AND SEMICONDUCTOR DEVICES INCLUDING REDISTRIBUTION ST...

Chip embedding package with solderable electric contact

Method of galvanic plating assisted by a current distribution layer

SEMICONDUCTOR PACKAGE

Semiconductor Package and Method of Assembling a Semiconductor Package