Stephan Bradl

Person

Kofering, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Flat lead package formation method
- Patent number 11,652,084
- Issue date May 16, 2023
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-purpose non-linear semiconductor package assembly line
- Patent number 11,302,668
- Issue date Apr 12, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-purpose non-linear semiconductor package assembly line
- Patent number 10,566,309
- Issue date Feb 18, 2020
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece with semiconductor chips, semiconductor device and method...
- Patent number 9,601,475
- Issue date Mar 21, 2017
- INTEL DEUTSCHLAND GMBH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece with semiconductor chips, semiconductor device and method...
- Patent number 9,293,423
- Issue date Mar 22, 2016
- INTEL DEUTSCHLAND GMBH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment of a substrate with a liquid medium
- Patent number 8,759,230
- Issue date Jun 24, 2014
- Infineon Technologies AG
- Stephan Bradl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for electrostatic discharge in embedded wafer level packages
- Patent number 8,309,454
- Issue date Nov 13, 2012
- Intel Mobile Communications GmbH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor wafer with rear side identific...
- Patent number 8,173,534
- Issue date May 8, 2012
- Infineon Technologies AG
- Stephan Bradl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with rear side identification and method
- Patent number 7,911,036
- Issue date Mar 22, 2011
- Infineon Technologies AG
- Stephan Bradl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,906,860
- Issue date Mar 15, 2011
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrodepositing a metal in integrated circuit applications
- Patent number 7,902,062
- Issue date Mar 8, 2011
- Infineon Technologies AG
- Stephan Bradl
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit including parylene material layer
- Patent number 7,759,792
- Issue date Jul 20, 2010
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece with semiconductor chips and molding, semiconductor devic...
- Patent number 7,687,895
- Issue date Mar 30, 2010
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of electronic semiconductor components on a carrier sys...
- Patent number 7,566,378
- Issue date Jul 28, 2009
- Infineon Technologies AG
- Stephan Bradl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, system and method of using a component for setting the elec...
- Patent number 6,459,296
- Issue date Oct 1, 2002
- Infineon Technologies AG
- Stephan Bradl
- G11 - INFORMATION STORAGE
Information Patent Grant
Polishing agent for semiconductor substrates
- Patent number 6,447,372
- Issue date Sep 10, 2002
- Infineon Technologies AG
- Stephan Bradl
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for forming a trench structure in a silicon substrate
- Patent number 6,337,255
- Issue date Jan 8, 2002
- Infineon Technologies AG
- Stephan Bradl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for applying a substance to a surface
- Patent number 6,086,269
- Issue date Jul 11, 2000
- Siemens Aktiengesellschaft
- Stephan Bradl
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Device and method for end-point monitoring used in the polishing of...
- Patent number 6,014,218
- Issue date Jan 11, 2000
- Siemens Aktiengesellschaft
- Stephan Bradl
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Multi-Purpose Non-Linear Semiconductor Package Assembly Line
- Publication number 20180096966
- Publication date Apr 5, 2018
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD...
- Publication number 20160163682
- Publication date Jun 9, 2016
- Intel Deutschland GmbH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD...
- Publication number 20140332937
- Publication date Nov 13, 2014
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DEPOSITING METAL ON A SUBSTRATE; METAL STRUCTURE AND MET...
- Publication number 20120058362
- Publication date Mar 8, 2012
- INFINEON TECHNOLOGIES AG
- Markus Zistler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR WAFER WITH REAR SIDE IDENTIFIC...
- Publication number 20110147471
- Publication date Jun 23, 2011
- INFINEON TECHNOLOGIES AG
- Stephan Bradl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODEPOSITING A METAL IN INTEGRATED CIRCUIT APPLICATIONS
- Publication number 20110115096
- Publication date May 19, 2011
- INFINEON TECHNOLOGIES AG
- Stephan Bradl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090108440
- Publication date Apr 30, 2009
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Treatment of a Substrate with a Liquid Medium
- Publication number 20090093127
- Publication date Apr 9, 2009
- Stephan Bradl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING PARYLENE MATERIAL LAYER
- Publication number 20090045511
- Publication date Feb 19, 2009
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Workpiece with Semiconductor Chips, Semiconductor Device and Method...
- Publication number 20080265383
- Publication date Oct 30, 2008
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure for Electrostatic Discharge in Embedded Wafer Level Packages
- Publication number 20080265421
- Publication date Oct 30, 2008
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER WITH REAR SIDE IDENTIFICATION AND METHOD
- Publication number 20070178612
- Publication date Aug 2, 2007
- INFINEON TECHNOLOGIES AG
- Stephan Bradl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for machining a workpiece on a workpiece support
- Publication number 20070117351
- Publication date May 24, 2007
- Stephan Bradl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement of electronic semiconductor components on a carrier sys...
- Publication number 20060276010
- Publication date Dec 7, 2006
- Stephan Bradl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrodepositing a metal in integrated circuit applications
- Publication number 20050221602
- Publication date Oct 6, 2005
- Infineon Technologies AG
- Stephan Bradl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for detecting a work piece in an automatic pro...
- Publication number 20020072301
- Publication date Jun 13, 2002
- Stephan Bradl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method, system, and method of using a component for setting the ele...
- Publication number 20020011869
- Publication date Jan 31, 2002
- Stephan Bradl
- G11 - INFORMATION STORAGE

Stephan Bradl

Person

Patents Grantslast 30 patents

Flat lead package formation method

Multi-purpose non-linear semiconductor package assembly line

Multi-purpose non-linear semiconductor package assembly line

Workpiece with semiconductor chips, semiconductor device and method...

Workpiece with semiconductor chips, semiconductor device and method...

Treatment of a substrate with a liquid medium

Structure for electrostatic discharge in embedded wafer level packages

Method for producing a semiconductor wafer with rear side identific...

Semiconductor wafer with rear side identification and method

Semiconductor device

Electrodepositing a metal in integrated circuit applications

Integrated circuit including parylene material layer

Workpiece with semiconductor chips and molding, semiconductor devic...

Arrangement of electronic semiconductor components on a carrier sys...

Method, system and method of using a component for setting the elec...

Polishing agent for semiconductor substrates

Method for forming a trench structure in a silicon substrate

Method and apparatus for applying a substance to a surface

Device and method for end-point monitoring used in the polishing of...

Patents Applicationslast 30 patents

Multi-Purpose Non-Linear Semiconductor Package Assembly Line

WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD...

WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD...

METHOD FOR DEPOSITING METAL ON A SUBSTRATE; METAL STRUCTURE AND MET...

METHOD FOR PRODUCING A SEMICONDUCTOR WAFER WITH REAR SIDE IDENTIFIC...

ELECTRODEPOSITING A METAL IN INTEGRATED CIRCUIT APPLICATIONS

SEMICONDUCTOR DEVICE

Treatment of a Substrate with a Liquid Medium

INTEGRATED CIRCUIT INCLUDING PARYLENE MATERIAL LAYER

Workpiece with Semiconductor Chips, Semiconductor Device and Method...

Structure for Electrostatic Discharge in Embedded Wafer Level Packages

SEMICONDUCTOR WAFER WITH REAR SIDE IDENTIFICATION AND METHOD

Method for machining a workpiece on a workpiece support

Arrangement of electronic semiconductor components on a carrier sys...

Electrodepositing a metal in integrated circuit applications

Apparatus and method for detecting a work piece in an automatic pro...

Method, system, and method of using a component for setting the ele...