Stephan Dobritz

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Arrangement for an optoelectronic component, manufacturing process...
- Patent number 11,728,444
- Issue date Aug 15, 2023
- First Sensor AG
- Martin Wilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,093,696
- Issue date Jan 10, 2012
- Qimonda AG
- Kimyung Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, circuit system, and method of manufacturing
- Patent number 8,072,084
- Issue date Dec 6, 2011
- Qimonda AG
- Roland Irsigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a wafer level package
- Patent number 7,867,817
- Issue date Jan 11, 2011
- Qimonda AG
- Stephan Dobritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric device, stack of electric devices, and method of manufactu...
- Patent number 7,834,462
- Issue date Nov 16, 2010
- Qimonda AG
- Stephan Dobritz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection element for BGA housings and method for producing t...
- Patent number 7,220,666
- Issue date May 22, 2007
- Infineon Technologies AG
- André Hanke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated device and electronic system
- Patent number 7,221,053
- Issue date May 22, 2007
- Infineon Technologies AG
- Thorsten Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement for producing an electrical connection between a BGA pa...
- Patent number 7,068,059
- Issue date Jun 27, 2006
- Infineon Technologies AG
- André Hanke
- G01 - MEASURING TESTING
Information Patent Grant
Leadframe of a conductive material and component with a leadframe o...
- Patent number 6,946,721
- Issue date Sep 20, 2005
- Infineon Technologies AG
- Stephan Dobritz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chip Module, Use of Chip Module, Test Arrangement and Test Method
- Publication number 20220181247
- Publication date Jun 9, 2022
- FIRST SENSOR AG
- Stephan Dobritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement For an Optoelectronic Component, Manufacturing Process...
- Publication number 20210408302
- Publication date Dec 30, 2021
- FIRST SENSOR AG
- Martin Wilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20090283899
- Publication date Nov 19, 2009
- Kimyung Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Wafer Level Package
- Publication number 20090194881
- Publication date Aug 6, 2009
- Stephan Dobritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, CIRCUIT SYSTEM, AND METHOD OF MANUFACTURING
- Publication number 20090072398
- Publication date Mar 19, 2009
- QIMONDA AG
- Roland Irsigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Device, Stack of Electric Devices, and Method of Manufactu...
- Publication number 20090072374
- Publication date Mar 19, 2009
- Stephan Dobritz
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wafer Arrangement and Method for Manufacturing a Wafer Arrangement
- Publication number 20090001366
- Publication date Jan 1, 2009
- Stephan Dobritz
- G01 - MEASURING TESTING
Information Patent Application
Circuit board arrangement and method for producing a circuit board...
- Publication number 20080079149
- Publication date Apr 3, 2008
- Harry Hedler
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit board arrangement
- Publication number 20070279877
- Publication date Dec 6, 2007
- Stephan Dobritz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Memory module
- Publication number 20070230115
- Publication date Oct 4, 2007
- Stephan Dobritz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnection element for BGA housings and method for producing t...
- Publication number 20070123066
- Publication date May 31, 2007
- Andre Hanke
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated device and electronic system
- Publication number 20060208357
- Publication date Sep 21, 2006
- Thorsten Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnection element for BGA housings and method for producing t...
- Publication number 20050093148
- Publication date May 5, 2005
- Andre Hanke
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Arrangement for producing an electrical connection between a BGA pa...
- Publication number 20050085105
- Publication date Apr 21, 2005
- Andre Hanke
- G01 - MEASURING TESTING
Information Patent Application
Carrier for receiving and electrically contacting individually sepa...
- Publication number 20040189333
- Publication date Sep 30, 2004
- Stephan Dobritz
- G01 - MEASURING TESTING
Information Patent Application
Leadframe and component with a leadframe
- Publication number 20030098498
- Publication date May 29, 2003
- Stephan Dobritz
- H01 - BASIC ELECTRIC ELEMENTS

Stephan Dobritz

Person

Patents Grantslast 30 patents

Arrangement for an optoelectronic component, manufacturing process...

Semiconductor device

Integrated circuit, circuit system, and method of manufacturing

Method for manufacturing a wafer level package

Electric device, stack of electric devices, and method of manufactu...

Interconnection element for BGA housings and method for producing t...

Integrated device and electronic system

Arrangement for producing an electrical connection between a BGA pa...

Leadframe of a conductive material and component with a leadframe o...

Patents Applicationslast 30 patents

Chip Module, Use of Chip Module, Test Arrangement and Test Method

Arrangement For an Optoelectronic Component, Manufacturing Process...

Semiconductor Device

Method for Manufacturing a Wafer Level Package

INTEGRATED CIRCUIT, CIRCUIT SYSTEM, AND METHOD OF MANUFACTURING

Electric Device, Stack of Electric Devices, and Method of Manufactu...

Wafer Arrangement and Method for Manufacturing a Wafer Arrangement

Circuit board arrangement and method for producing a circuit board...

Circuit board arrangement

Memory module

Interconnection element for BGA housings and method for producing t...

Integrated device and electronic system

Interconnection element for BGA housings and method for producing t...

Arrangement for producing an electrical connection between a BGA pa...

Carrier for receiving and electrically contacting individually sepa...

Leadframe and component with a leadframe