Stephan Lassig

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Danville, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Fabrication of a silicon structure and deep silicon etch with profi...
- Patent number 9,865,472
- Issue date Jan 9, 2018
- Lam Research Corporation
- Robert Chebi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of a silicon structure and deep silicon etch with profi...
- Patent number 9,330,926
- Issue date May 3, 2016
- Lam Research Corporation
- Robert Chebi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for patterning multilevel interconnects
- Patent number 6,875,699
- Issue date Apr 5, 2005
- Lam Research Corporation
- Stephan Lassig
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION OF A SILICON STRUCTURE AND DEEP SILICON ETCH WITH PROFI...
- Publication number 20160233102
- Publication date Aug 11, 2016
- LAM RESEARCH CORPORATION
- Robert CHEBI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF A SILICON STRUCTURE AND DEEP SILICON ETCH WITH PROFI...
- Publication number 20090184089
- Publication date Jul 23, 2009
- LAM RESEARCH CORPORATION
- Robert CHEBI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench etch process for low-k dielectrics
- Publication number 20050009324
- Publication date Jan 13, 2005
- LAM RESEARCH CORPORATION
- SiYi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for patterning a layer of a low dielectric constant material
- Publication number 20040115565
- Publication date Jun 17, 2004
- LAM RESEARCH CORPORATION
- Stephan E. Lassig
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TRENCH ETCH PROCESS FOR LOW-K DIELECTRICS
- Publication number 20040038540
- Publication date Feb 26, 2004
- LAM RESEARCH CORPORATION
- SiYi Li
- H01 - BASIC ELECTRIC ELEMENTS