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Anode assembly for electroplating
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Patent number 8,262,873
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Issue date Sep 11, 2012
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Metakem Gesellschaft fur Schichtchemie der Metalle mbH
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Jörg Wurm
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C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Anode used for electroplating
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Patent number 7,943,032
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Issue date May 17, 2011
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Metakem Gesellschaft fur Schichtchemie der Metalle mbH
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Jorg Wurm
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C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Electrolytic copper plating method
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Patent number 6,444,110
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Issue date Sep 3, 2002
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Shipley Company, L.L.C.
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Leon R. Barstad
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C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR