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Stephen C. St. Germain
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Scottsdale, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Multi-chip semiconductor connector assemblies
Patent number
7,508,060
Issue date
Mar 24, 2009
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
Publication number
20140264806
Publication date
Sep 18, 2014
Roger M. Arbuthnot
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING MULTIPLE HEAT DISSIPATION PA...
Publication number
20080054438
Publication date
Mar 6, 2008
Semiconductor Components Industries, LLC.
Stephen St. Germain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package structure for vertical mount and method
Publication number
20070138503
Publication date
Jun 21, 2007
Semiconductor Components Industries, LLC.
Stephen St. Germain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP SEMICONDUCTOR CONNECTOR ASSEMBLY METHOD
Publication number
20070126107
Publication date
Jun 7, 2007
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for forming an encapsulated device and structure
Publication number
20060108673
Publication date
May 25, 2006
Stephen St. Germain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-chip semiconductor connector assemblies
Publication number
20050285249
Publication date
Dec 29, 2005
Semiconductor Components Industries, LLC.
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-chip semiconductor connector assembly method
Publication number
20050287703
Publication date
Dec 29, 2005
Semiconductor Components Industries, LLC.
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for forming an encapsulated device and structure
Publication number
20040262781
Publication date
Dec 30, 2004
Semiconductor Components Industries, LLC.
Stephen St. Germain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit and laminated leadframe package
Publication number
20040000702
Publication date
Jan 1, 2004
Semiconductor Components Industries, LLC.
James Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure and method of forming a multiple leadframe semiconductor...
Publication number
20030209804
Publication date
Nov 13, 2003
Semiconductor Components Industries, LLC.
James H. Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit package and method
Publication number
20020134582
Publication date
Sep 26, 2002
Semiconductor Components Industries, LLC.
Phillip C. Celaya
H01 - BASIC ELECTRIC ELEMENTS