Stephen CHRISTIANSON

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Tigard, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Stiffener and package substrate for a semiconductor package
- Patent number 11,295,998
- Issue date Apr 5, 2022
- Intel Corporation
- Stephen Christianson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULAR MEZZANINE POWER VOLTAGE REGULATOR MODULE FOR MEMORY MODULES
- Publication number 20220391007
- Publication date Dec 8, 2022
- Intel Corporation
- Min Suet LIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKABLE MEMORY MODULE WITH DOUBLE-SIDED COMPRESSION CONTACT PADS
- Publication number 20220353991
- Publication date Nov 3, 2022
- Intel Corporation
- Xiang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW POWER MEMORY MODULE
- Publication number 20220217846
- Publication date Jul 7, 2022
- Intel Corporation
- Xiang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA COUPLING STRUCTURES TO REDUCE CROSSTALK EFFECTS
- Publication number 20210376448
- Publication date Dec 2, 2021
- Intel Corporation
- John R. Drew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER AND PACKAGE SUBSTRATE FOR A SEMICONDUCTOR PACKAGE
- Publication number 20190311963
- Publication date Oct 10, 2019
- Intel Corporation
- Stephen CHRISTIANSON
- H01 - BASIC ELECTRIC ELEMENTS