Stephen D. Cromwell

Person

Penryn, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heat sink with surface-formed vapor chamber base
- Patent number 8,462,508
- Issue date Jun 11, 2013
- Hewlett-Packard Development Company, L.P.
- Robert J. Lankston
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Jacket for heat dispersion device
- Patent number 7,926,552
- Issue date Apr 19, 2011
- Hewlett-Packard Development Company, L.P.
- Jeffrey Metcalf
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method of assembling an application specific integrated circuit (AS...
- Patent number 7,536,781
- Issue date May 26, 2009
- Hewlett-Packard Development Company, L.P.
- Stephen Daniel Cromwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processor module with rigidly coupled processor and voltage-regulat...
- Patent number 7,385,824
- Issue date Jun 10, 2008
- Hewlett-Packard Development Company, L.P.
- Stephan K. Barsun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for sizing a load plate
- Patent number 7,323,358
- Issue date Jan 29, 2008
- Hewlett-Packard Development Company, L.P.
- Stephen Daniel Cromwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Make first break last connection assembly
- Patent number 7,128,602
- Issue date Oct 31, 2006
- Hewlett-Packard Development Company, L.P.
- Stephen Daniel Cromwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array assembly using a compressive liquid
- Patent number 6,930,884
- Issue date Aug 16, 2005
- Hewlett-Packard Development Company, L.P.
- Stephen D. Cromwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leaf spring load plate with retained linear cam slide
- Patent number 6,724,629
- Issue date Apr 20, 2004
- Hewlett-Packard Development Company, L.P.
- Thomas J. Augustin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Attachment of a single heat dissipation device to multiple componen...
- Patent number 6,667,885
- Issue date Dec 23, 2003
- Hewlett-Packard Development Company, L.P.
- Christopher Gregory Malone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-curved spring bolster plate
- Patent number 6,635,513
- Issue date Oct 21, 2003
- Hewlett-Packard Development Company, L.P.
- James David Hensley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanical loading of a land grid array component using a wave spring
- Patent number 6,430,050
- Issue date Aug 6, 2002
- Hewlett-Packard Co.
- James David Hensley
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
JACKET FOR HEAT DISPERSION DEVICE
- Publication number 20090101317
- Publication date Apr 23, 2009
- Jeffrey Metcalf
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT SINK WITH SURFACE-FORMED VAPOR CHAMBER BASE
- Publication number 20080266800
- Publication date Oct 30, 2008
- Robert J. Lankston
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Processor module with rigidly coupled processor and voltage-regulat...
- Publication number 20070025088
- Publication date Feb 1, 2007
- Stephan K. Barsun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substantial embedment of metallic debris
- Publication number 20060171795
- Publication date Aug 3, 2006
- Stephen Daniel Cromwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Land grid array assembly using a compressive load
- Publication number 20040252462
- Publication date Dec 16, 2004
- Stephen D. Cromwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and system for adjusting a curvature of a load plate based o...
- Publication number 20040247925
- Publication date Dec 9, 2004
- Stephen Daniel Cromwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and system for applying target load to an application specif...
- Publication number 20040246679
- Publication date Dec 9, 2004
- Stephen Daniel Cromwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Protective coating for attach hardware for circuits
- Publication number 20040240188
- Publication date Dec 2, 2004
- Stephen Daniel Cromwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of perimeter stops to support solder interconnects between inte...
- Publication number 20040134680
- Publication date Jul 15, 2004
- Xiang Dai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Pre-curved spring bolster plate
- Publication number 20040089937
- Publication date May 13, 2004
- James David Hensley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Attachment of a single heat dissipation device to multiple componen...
- Publication number 20030016500
- Publication date Jan 23, 2003
- Christopher Gregory Malone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-curved spring bolster plate
- Publication number 20020180039
- Publication date Dec 5, 2002
- James David Hensley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Stephen D. Cromwell

Person

Patents Grantslast 30 patents

Heat sink with surface-formed vapor chamber base

Jacket for heat dispersion device

Method of assembling an application specific integrated circuit (AS...

Processor module with rigidly coupled processor and voltage-regulat...

Method and system for sizing a load plate

Make first break last connection assembly

Land grid array assembly using a compressive liquid

Leaf spring load plate with retained linear cam slide

Attachment of a single heat dissipation device to multiple componen...

Pre-curved spring bolster plate

Mechanical loading of a land grid array component using a wave spring

Patents Applicationslast 30 patents

JACKET FOR HEAT DISPERSION DEVICE

HEAT SINK WITH SURFACE-FORMED VAPOR CHAMBER BASE

Processor module with rigidly coupled processor and voltage-regulat...

Substantial embedment of metallic debris

Land grid array assembly using a compressive load

Method and system for adjusting a curvature of a load plate based o...

Method and system for applying target load to an application specif...

Protective coating for attach hardware for circuits

Use of perimeter stops to support solder interconnects between inte...

Pre-curved spring bolster plate

Attachment of a single heat dissipation device to multiple componen...

Pre-curved spring bolster plate