Stephen E. LEHMAN, JR.

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Solder joint reliability in microelectronic packaging
- Patent number 8,018,063
- Issue date Sep 13, 2011
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Directing the flow of underfill materials using magnetic particles
- Patent number 8,009,442
- Issue date Aug 30, 2011
- Intel Corporation
- Stephen E. Lehman, Jr.
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Solder joint reliability in microelectronic packaging
- Patent number 7,700,476
- Issue date Apr 20, 2010
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Smart curing with a catalyst-functionalized surface
- Patent number 7,579,046
- Issue date Aug 25, 2009
- Intel Corporation
- Stephen E. Lehman, Jr.
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Thermoset polyimides for microelectronic applications
- Patent number 7,534,649
- Issue date May 19, 2009
- Intel Corporation
- Stephen E. Lehman, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear functional copolymers of ethylene with precise and minimum r...
- Patent number 7,504,465
- Issue date Mar 17, 2009
- ExxonMobil Research and Engineering Company
- Lisa S. Baugh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Linear functional copolymers of ethylene with precise and minimum r...
- Patent number 7,402,642
- Issue date Jul 22, 2008
- ExxonMobil Research and Engineering Company
- Lisa S. Baugh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Chip-packaging composition of resin and cycloaliphatic amine hardener
- Patent number 7,351,784
- Issue date Apr 1, 2008
- Intel Corporation
- Stephen E. Lehman, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level processing of chip-packaging compositions including bis...
- Patent number 7,314,778
- Issue date Jan 1, 2008
- Intel Corporation
- Saikumar Jayaraman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Plastic materials including dendrimers or hyperbranched polymers fo...
- Patent number 7,224,050
- Issue date May 29, 2007
- Intel Corporation
- James C. Matayabas, Jr.
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Cyclic olefin polymers and catalyst for semiconductor applications
- Patent number 7,217,600
- Issue date May 15, 2007
- Intel Corporation
- Stephen E. Lehman, Jr.
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
DIRECTING THE FLOW OF UNDERFILL MATERIALS USING MAGNETIC PARTICLES
- Publication number 20110278719
- Publication date Nov 17, 2011
- Stephen E. LEHMAN, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING
- Publication number 20110051376
- Publication date Mar 3, 2011
- INTEL, INC.
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING
- Publication number 20100044848
- Publication date Feb 25, 2010
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
DIRECTING THE FLOW OF UNDERFILL MATERIALS USING MAGNETIC PARTICLES
- Publication number 20090168390
- Publication date Jul 2, 2009
- Stephen E. LEHMAN, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSET POLYIMIDES FOR MICROELECTRONIC APPLICATIONS
- Publication number 20090146289
- Publication date Jun 11, 2009
- Stephen E. Lehman, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Linear functional copolymers of ethylene with precise and minimum r...
- Publication number 20080312393
- Publication date Dec 18, 2008
- Lisa S. Baugh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Stephen E. LEHMAN, JR.

Person

Patents Grantslast 30 patents

Solder joint reliability in microelectronic packaging

Directing the flow of underfill materials using magnetic particles

Solder joint reliability in microelectronic packaging

Smart curing with a catalyst-functionalized surface

Thermoset polyimides for microelectronic applications

Linear functional copolymers of ethylene with precise and minimum r...

Linear functional copolymers of ethylene with precise and minimum r...

Chip-packaging composition of resin and cycloaliphatic amine hardener

Wafer-level processing of chip-packaging compositions including bis...

Plastic materials including dendrimers or hyperbranched polymers fo...

Cyclic olefin polymers and catalyst for semiconductor applications

Patents Applicationslast 30 patents

DIRECTING THE FLOW OF UNDERFILL MATERIALS USING MAGNETIC PARTICLES

SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING

SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING

DIRECTING THE FLOW OF UNDERFILL MATERIALS USING MAGNETIC PARTICLES

THERMOSET POLYIMIDES FOR MICROELECTRONIC APPLICATIONS

Linear functional copolymers of ethylene with precise and minimum r...