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Stephen G. BENNETT
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Niskayuna, NY, US
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last 30 patents
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Patent Grant
Apparatus and method for integration of through substrate vias
Patent number
8,969,200
Issue date
Mar 3, 2015
The Research Foundation of State University of New York
Jeremiah Hebding
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
APPARATUS AND METHOD FOR INTEGRATION OF THROUGH SUBSTRATE VIAS
Publication number
20130270711
Publication date
Oct 17, 2013
THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
Jeremiah HEBDING
H01 - BASIC ELECTRIC ELEMENTS