Stephen H. Black

Person

Buellton, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interface circuit for photodetectors providing full-frame integrati...
- Patent number 12,192,658
- Issue date Jan 7, 2025
- Nu-Trek, Inc.
- Stephen Holden Black
- G01 - MEASURING TESTING
Information Patent Grant
Interface circuit for photodetectors providing full-frame integrati...
- Patent number 12,155,951
- Issue date Nov 26, 2024
- Nu-Trek, Inc.
- Stephen Holden Black
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Bias circuit with improved noise performance
- Patent number 11,985,442
- Issue date May 14, 2024
- Nu-Trek, Inc.
- Stephen Holden Black
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of stress relief in anti-reflective coated cap wafers for wa...
- Patent number 10,315,918
- Issue date Jun 11, 2019
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 10,262,913
- Issue date Apr 16, 2019
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 9,966,320
- Issue date May 8, 2018
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Use of an external getter to reduce package pressure
- Patent number 9,865,519
- Issue date Jan 9, 2018
- Raytheon Company
- Stephen H. Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed package having stress reducing layer
- Patent number 9,708,181
- Issue date Jul 18, 2017
- Raytheon Company
- Adam M. Kennedy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Use of an external getter to reduce package pressure
- Patent number 9,570,321
- Issue date Feb 14, 2017
- Raytheon Company
- Stephen H. Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 9,520,332
- Issue date Dec 13, 2016
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of stress relief in anti-reflective coated cap wafers for wa...
- Patent number 9,427,776
- Issue date Aug 30, 2016
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for inhibiting diversion of devices using an e...
- Patent number 9,407,820
- Issue date Aug 2, 2016
- Raytheon Company
- Stephen H. Black
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Hermetically sealed package having stress reducing layer
- Patent number 9,334,154
- Issue date May 10, 2016
- Raytheon Company
- Adam M. Kennedy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Infrared thermal imaging system and method
- Patent number 9,277,142
- Issue date Mar 1, 2016
- Raytheon Company
- Matthew T. Kuiken
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer level packaged infrared (IR) focal plane array (FPA) with eva...
- Patent number 9,227,839
- Issue date Jan 5, 2016
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Getter structure and method for forming such structure
- Patent number 9,196,556
- Issue date Nov 24, 2015
- Raytheon Company
- Roland Gooch
- B32 - LAYERED PRODUCTS
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 9,187,312
- Issue date Nov 17, 2015
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 9,174,836
- Issue date Nov 3, 2015
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming deposited patterns on a surface
- Patent number 9,105,800
- Issue date Aug 11, 2015
- Raytheon Company
- Roland Gooch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 9,093,444
- Issue date Jul 28, 2015
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Protecting an optical surface
- Patent number 9,022,584
- Issue date May 5, 2015
- Raytheon Company
- Stephen H. Black
- G02 - OPTICS
Information Patent Grant
Fabrication of window cavity cap structures in wafer level packaging
- Patent number 8,980,676
- Issue date Mar 17, 2015
- Raytheon Company
- Buu Diep
- G01 - MEASURING TESTING
Information Patent Grant
Antenna-coupled imager having pixels with integrated lenslets
- Patent number 8,884,815
- Issue date Nov 11, 2014
- Ratheon Company
- Michael A. Gritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Incident radiation detector packaging
- Patent number 8,809,784
- Issue date Aug 19, 2014
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 8,736,045
- Issue date May 27, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multichip packaging for imaging system
- Patent number 8,653,467
- Issue date Feb 18, 2014
- Raytheon Company
- Stephen H. Black
- G01 - MEASURING TESTING
Information Patent Grant
Wafer level packaged focal plane array
- Patent number 8,608,894
- Issue date Dec 17, 2013
- Raytheon Company
- Stephen H. Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-coupled antenna arrays
- Patent number 8,586,926
- Issue date Nov 19, 2013
- Raytheon Company
- Stephen H. Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging system
- Patent number 8,511,823
- Issue date Aug 20, 2013
- Raytheon Company
- Stephen H. Black
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
System and method for viewing an area using an optical system posit...
- Patent number 8,294,103
- Issue date Oct 23, 2012
- Raytheon Company
- Robert C. Gibbons
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
AN INTERFACE CIRCUIT FOR PHOTODETECTORS PROVIDING FULL-FRAME INTEGR...
- Publication number 20240053204
- Publication date Feb 15, 2024
- Nu-Trek, Inc.
- Stephen Holden Black
- G01 - MEASURING TESTING
Information Patent Application
INTERFACE CIRCUIT FOR PHOTODETECTORS PROVIDING FULL-FRAME INTEGRATI...
- Publication number 20230269502
- Publication date Aug 24, 2023
- Nu-Trek, Inc.
- Stephen Holden Black
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
BIAS CIRCUIT WITH IMPROVED NOISE PERFORMANCE
- Publication number 20230027347
- Publication date Jan 26, 2023
- Nu-Trek, Inc.
- Stephen Holden Black
- G01 - MEASURING TESTING
Information Patent Application
WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
- Publication number 20180226309
- Publication date Aug 9, 2018
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
USE OF AN EXTERNAL GETTER TO REDUCE PACKAGE PRESSURE
- Publication number 20170148695
- Publication date May 25, 2017
- Raytheon Company
- Stephen H. Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
- Publication number 20170011977
- Publication date Jan 12, 2017
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WA...
- Publication number 20160340179
- Publication date Nov 24, 2016
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER
- Publication number 20160167959
- Publication date Jun 16, 2016
- Raytheon Company
- Adam M. Kennedy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE
- Publication number 20160040282
- Publication date Feb 11, 2016
- Raytheon Company
- Roland Gooch
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER
- Publication number 20160039665
- Publication date Feb 11, 2016
- Raytheon Company
- Adam M. Kennedy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGED INFRARED (IR) FOCAL PLANE ARRAY (FPA) WITH EVA...
- Publication number 20150321905
- Publication date Nov 12, 2015
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
- Publication number 20150279755
- Publication date Oct 1, 2015
- Raytheon Company
- Roland W. Gooch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR INHIBITING DIVERSION OF DEVICES USING AN E...
- Publication number 20150271403
- Publication date Sep 24, 2015
- Raytheon Company
- Stephen H. Black
- G01 - MEASURING TESTING
Information Patent Application
GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE
- Publication number 20150249042
- Publication date Sep 3, 2015
- Raytheon Company
- Roland Gooch
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF FORMING DEPOSITED PATTERNS ON A SURFACE
- Publication number 20150162479
- Publication date Jun 11, 2015
- Raytheon Company
- Roland Gooch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
- Publication number 20150014854
- Publication date Jan 15, 2015
- Raytheon Company
- Roland W. Gooch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140346643
- Publication date Nov 27, 2014
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140193948
- Publication date Jul 10, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GETTER STRUCTURE FOR WAFER LEVEL VACUUM PACKAGED DEVICE
- Publication number 20140175590
- Publication date Jun 26, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140124899
- Publication date May 8, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WA...
- Publication number 20140053966
- Publication date Feb 27, 2014
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Fabrication of Window Cavity Cap Structures in Wafer Level Packaging
- Publication number 20130344638
- Publication date Dec 26, 2013
- Raytheon Company
- Buu Diep
- G01 - MEASURING TESTING
Information Patent Application
PIXEL STRUCTURE WITH REDUCED VACUUM REQUIREMENTS
- Publication number 20130334635
- Publication date Dec 19, 2013
- Raytheon Company
- Adam M. Kennedy
- G01 - MEASURING TESTING
Information Patent Application
Multichip Packaging for Imaging System
- Publication number 20130334425
- Publication date Dec 19, 2013
- Raytheon Company
- Stephen H. Black
- G01 - MEASURING TESTING
Information Patent Application
INFRARED THERMAL IMAGING SYSTEM AND METHOD
- Publication number 20130321639
- Publication date Dec 5, 2013
- Raytheon Company
- Matthew T. Kuiken
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Antenna-Coupled Antenna Arrays
- Publication number 20130050015
- Publication date Feb 28, 2013
- Raytheon Company
- Stephen H. Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna-Coupled Imager Having Pixels with Integrated Lenslets
- Publication number 20130021203
- Publication date Jan 24, 2013
- Raytheon Company
- Michael A. Gritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING A MULTI-CHIP SYSTEM IN A PACKAGE (MCSiP) IN IMAGING APPLICATI...
- Publication number 20120281113
- Publication date Nov 8, 2012
- Raytheon Company
- Adam M. Kennedy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wafer Level Packaged Focal Plane Array
- Publication number 20120139072
- Publication date Jun 7, 2012
- Raytheon Company
- Stephen H. Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protecting An Optical Surface
- Publication number 20120127579
- Publication date May 24, 2012
- Raytheon Company
- Stephen H. Black
- G02 - OPTICS

Stephen H. Black

Person

Patents Grantslast 30 patents

Interface circuit for photodetectors providing full-frame integrati...

Interface circuit for photodetectors providing full-frame integrati...

Bias circuit with improved noise performance

Method of stress relief in anti-reflective coated cap wafers for wa...

Wafer level package solder barrier used as vacuum getter

Wafer level package solder barrier used as vacuum getter

Use of an external getter to reduce package pressure

Hermetically sealed package having stress reducing layer

Use of an external getter to reduce package pressure

Wafer level package solder barrier used as vacuum getter

Method of stress relief in anti-reflective coated cap wafers for wa...

Method and apparatus for inhibiting diversion of devices using an e...

Hermetically sealed package having stress reducing layer

Infrared thermal imaging system and method

Wafer level packaged infrared (IR) focal plane array (FPA) with eva...

Getter structure and method for forming such structure

Integrated bondline spacers for wafer level packaged circuit devices

Integrated bondline spacers for wafer level packaged circuit devices

Method of forming deposited patterns on a surface

Wafer level package solder barrier used as vacuum getter

Protecting an optical surface

Fabrication of window cavity cap structures in wafer level packaging

Antenna-coupled imager having pixels with integrated lenslets

Incident radiation detector packaging

Integrated bondline spacers for wafer level packaged circuit devices

Multichip packaging for imaging system

Wafer level packaged focal plane array

Antenna-coupled antenna arrays

Imaging system

System and method for viewing an area using an optical system posit...

Patents Applicationslast 30 patents

AN INTERFACE CIRCUIT FOR PHOTODETECTORS PROVIDING FULL-FRAME INTEGR...

INTERFACE CIRCUIT FOR PHOTODETECTORS PROVIDING FULL-FRAME INTEGRATI...

BIAS CIRCUIT WITH IMPROVED NOISE PERFORMANCE

WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER

USE OF AN EXTERNAL GETTER TO REDUCE PACKAGE PRESSURE

WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER

METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WA...

HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER

GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE

HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER

WAFER LEVEL PACKAGED INFRARED (IR) FOCAL PLANE ARRAY (FPA) WITH EVA...

WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER

METHOD AND APPARATUS FOR INHIBITING DIVERSION OF DEVICES USING AN E...

GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE

METHOD OF FORMING DEPOSITED PATTERNS ON A SURFACE

WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

GETTER STRUCTURE FOR WAFER LEVEL VACUUM PACKAGED DEVICE

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WA...

Fabrication of Window Cavity Cap Structures in Wafer Level Packaging

PIXEL STRUCTURE WITH REDUCED VACUUM REQUIREMENTS

Multichip Packaging for Imaging System

INFRARED THERMAL IMAGING SYSTEM AND METHOD

Antenna-Coupled Antenna Arrays

Antenna-Coupled Imager Having Pixels with Integrated Lenslets

USING A MULTI-CHIP SYSTEM IN A PACKAGE (MCSiP) IN IMAGING APPLICATI...

Wafer Level Packaged Focal Plane Array

Protecting An Optical Surface