Stephen Hensiek

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Foley, MO, US

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Patents Grantslast 30 patents

Information Patent Grant
Process for reducing surface variations for polished wafer
- Patent number 6,479,386
- Issue date Nov 12, 2002
- MEMC Electronic Materials, Inc.
- Kan-Yin Ng
- B24 - GRINDING POLISHING
Information Patent Grant
Method for processing a semiconductor wafer
- Patent number 6,227,944
- Issue date May 8, 2001
- MEMC Electronics Materials, Inc.
- Yun-Biao Xin
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and process for producing polished semiconductor wafers
- Publication number 20030064902
- Publication date Apr 3, 2003
- MEMC Electronic Materials Inc.
- Kan-Yin Ng
- B24 - GRINDING POLISHING