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Stephen James Kilpatrick
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Oiney, MD, US
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Patents Grants
last 30 patents
Information
Patent Grant
Voltage tunable oscillator using bilayer graphene and a lead zircon...
Patent number
9,252,704
Issue date
Feb 2, 2016
The United States of America as represented by the Secretary of the Army
Osama M. Nayfeh
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Interconnections for flip-chip using lead-free solders and having r...
Patent number
8,026,613
Issue date
Sep 27, 2011
International Business Machines Corporation
Keith E. Fogel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnections for flip-chip using lead-free solders and having r...
Patent number
7,923,849
Issue date
Apr 12, 2011
International Business Machines Corporation
Keith E. Fogel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnections for flip-chip using lead-free solders and having r...
Patent number
7,410,833
Issue date
Aug 12, 2008
International Business Machines Corporation
Keith E. Fogel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Immersion plating and plated structures
Patent number
7,276,296
Issue date
Oct 2, 2007
International Business Machines Corporation
Emanuel I. Cooper
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Ball limiting metallurgy, interconnection structure including the s...
Patent number
7,273,803
Issue date
Sep 25, 2007
International Business Machines Corporation
Yu-Ting Cheng
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Immersion plating and plated structures
Patent number
7,037,559
Issue date
May 2, 2006
International Business Machines Corporation
Emanuel I. Cooper
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Inhibition of tin oxide formation in lead free interconnect formation
Patent number
6,900,142
Issue date
May 31, 2005
International Business Machines Corporation
Emanual I. Cooper
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual-solder flip-chip solder bump
Patent number
6,893,799
Issue date
May 17, 2005
International Business Machines Corporation
David Danovitch
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Voltage tunable oscillator using bilayer graphene and a lead zircon...
Publication number
20120293271
Publication date
Nov 22, 2012
Osama M. Nayfeh
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
Publication number
20120012642
Publication date
Jan 19, 2012
Keith E. Fogel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
Publication number
20080206979
Publication date
Aug 28, 2008
Keith E. Fogel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
Publication number
20080203585
Publication date
Aug 28, 2008
Keith E. Fogel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
Publication number
20080202792
Publication date
Aug 28, 2008
Keith E. Fogel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Ball Limiting Metallurgy, Interconnection Structure Including the S...
Publication number
20080008900
Publication date
Jan 10, 2008
Yu-Ting Cheng
B32 - LAYERED PRODUCTS
Information
Patent Application
Immersion plating and plated structures
Publication number
20050238906
Publication date
Oct 27, 2005
International Business Machines Corporation
Emanuel I. Cooper
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Interconnections for flip-chip using lead-free solders and having r...
Publication number
20050224966
Publication date
Oct 13, 2005
Keith E. Fogel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Ball limiting metallurgy, interconnection structure including the s...
Publication number
20050118437
Publication date
Jun 2, 2005
International Business Machines Corporation
Yu-Ting Cheng
B32 - LAYERED PRODUCTS
Information
Patent Application
STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY
Publication number
20050104208
Publication date
May 19, 2005
International Business Machines Corporation
James C. Bartelo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INHIBITION OF TIN OXIDE FORMATION IN LEAD FREE INTERCONNECT FORMATION
Publication number
20050026450
Publication date
Feb 3, 2005
International Business Machines Corporation
Emanuel I. Cooper
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Immersion plating and plated structures
Publication number
20040219384
Publication date
Nov 4, 2004
International Business Machines Corporation
Emanuel I. Cooper
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
DUAL-SOLDER FLIP-CHIP SOLDER BUMP
Publication number
20040175657
Publication date
Sep 9, 2004
International Business Machines Corporation
David Danovitch
H01 - BASIC ELECTRIC ELEMENTS