Stephen Jew

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Slurry distribution device for chemical mechanical polishing
- Patent number 11,986,926
- Issue date May 21, 2024
- Applied Materials, Inc.
- Yen-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry distribution device for chemical mechanical polishing
- Patent number 11,806,835
- Issue date Nov 7, 2023
- Applied Materials, Inc.
- Yen-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry distribution device for chemical mechanical polishing
- Patent number 11,077,536
- Issue date Aug 3, 2021
- Applied Materials, Inc.
- Yen-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry distribution device for chemical mechanical polishing
- Patent number 10,967,483
- Issue date Apr 6, 2021
- Applied Materials, Inc.
- Yen-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Endpoint control of multiple substrate zones of varying thickness i...
- Patent number 10,589,397
- Issue date Mar 17, 2020
- Applied Materials, Inc.
- Alain Duboust
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Temperature control of chemical mechanical polishing
- Patent number 9,005,999
- Issue date Apr 14, 2015
- Applied Materials, Inc.
- Kun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Endpoint control of multiple substrates of varying thickness on the...
- Patent number 8,694,144
- Issue date Apr 8, 2014
- Applied Materials, Inc.
- Alain Duboust
- B24 - GRINDING POLISHING
Information Patent Grant
Control of overpolishing of multiple substrates on the same platen...
- Patent number 8,616,935
- Issue date Dec 31, 2013
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Endpoint control of multiple-wafer chemical mechanical polishing
- Patent number 8,295,967
- Issue date Oct 23, 2012
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Use of pad conditioning in temperature controlled CMP
- Patent number 8,292,691
- Issue date Oct 23, 2012
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate holder with liquid supporting surface
- Patent number 8,021,211
- Issue date Sep 20, 2011
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SLURRY DISTRIBUTION DEVICE FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20220402096
- Publication date Dec 22, 2022
- Applied Materials, Inc.
- Yen-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY DISTRIBUTION DEVICE FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20210331288
- Publication date Oct 28, 2021
- Applied Materials, Inc.
- Yen-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY DISTRIBUTION DEVICE FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20210205953
- Publication date Jul 8, 2021
- Applied Materials, Inc.
- Yen-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY DISTRIBUTION DEVICE FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20170368663
- Publication date Dec 28, 2017
- Yen-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY DISTRIBUTION DEVICE FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20170368664
- Publication date Dec 28, 2017
- Yen-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDPOINT CONTROL OF MULTIPLE SUBSTRATE ZONES OF VARYING THICKNESS I...
- Publication number 20170151647
- Publication date Jun 1, 2017
- Applied Materials, Inc.
- Alain Duboust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE...
- Publication number 20140222188
- Publication date Aug 7, 2014
- Applied Materials, Inc.
- Alain Duboust
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTROL OF POLISHING OF MULTIPLE SUBSTRATES ON THE SAME PLATEN IN C...
- Publication number 20140030956
- Publication date Jan 30, 2014
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
Control Of Overpolishing Of Multiple Substrates On the Same Platen...
- Publication number 20140024293
- Publication date Jan 23, 2014
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
- Publication number 20140004626
- Publication date Jan 2, 2014
- Applied Materials, Inc.
- KUN XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE...
- Publication number 20120053717
- Publication date Mar 1, 2012
- Alain Duboust
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TUNING OF POLISHING PROCESS IN MULTI-CARRIER HEAD PER PLATEN POLISH...
- Publication number 20110300776
- Publication date Dec 8, 2011
- Applied Materials, Inc.
- David H. Mai
- B24 - GRINDING POLISHING
Information Patent Application
Control of Overpolishing of Multiple Substrates on the Same Platen...
- Publication number 20110300775
- Publication date Dec 8, 2011
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
- Publication number 20100279435
- Publication date Nov 4, 2010
- APPLIED MATERIALS, INC.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
ENDPOINT CONTROL OF MULTIPLE-WAFER CHEMICAL MECHANICAL POLISHING
- Publication number 20100120330
- Publication date May 13, 2010
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
ENDPOINT CONTROL OF MULTIPLE-WAFER CHEMICAL MECHANICAL POLISHING
- Publication number 20100120331
- Publication date May 13, 2010
- Applied Materials, Inc.
- Ingemar Carlsson
- B24 - GRINDING POLISHING
Information Patent Application
USE OF PAD CONDITIONING IN TEMPERATURE CONTROLLED CMP
- Publication number 20100081360
- Publication date Apr 1, 2010
- APPLIED MATERIALS, INC.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE HOLDER WITH LIQUID SUPPORTING SURFACE
- Publication number 20090264056
- Publication date Oct 22, 2009
- APPLIED MATERIALS, INC.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Application
HIGH THROUGHPUT LOW TOPOGRAPHY COPPER CMP PROCESS
- Publication number 20090057264
- Publication date Mar 5, 2009
- APPLIED MATERIALS, INC.
- DAVID H. MAI
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF SOFT PAD PREPARATION TO REDUCE REMOVAL RATE RAMP-UP EFFEC...
- Publication number 20090061743
- Publication date Mar 5, 2009
- STEPHEN JEW
- B24 - GRINDING POLISHING

Stephen Jew

Person

Patents Grantslast 30 patents

Slurry distribution device for chemical mechanical polishing

Slurry distribution device for chemical mechanical polishing

Slurry distribution device for chemical mechanical polishing

Slurry distribution device for chemical mechanical polishing

Endpoint control of multiple substrate zones of varying thickness i...

Temperature control of chemical mechanical polishing

Endpoint control of multiple substrates of varying thickness on the...

Control of overpolishing of multiple substrates on the same platen...

Endpoint control of multiple-wafer chemical mechanical polishing

Use of pad conditioning in temperature controlled CMP

Substrate holder with liquid supporting surface

Patents Applicationslast 30 patents

SLURRY DISTRIBUTION DEVICE FOR CHEMICAL MECHANICAL POLISHING

SLURRY DISTRIBUTION DEVICE FOR CHEMICAL MECHANICAL POLISHING

SLURRY DISTRIBUTION DEVICE FOR CHEMICAL MECHANICAL POLISHING

SLURRY DISTRIBUTION DEVICE FOR CHEMICAL MECHANICAL POLISHING

SLURRY DISTRIBUTION DEVICE FOR CHEMICAL MECHANICAL POLISHING

ENDPOINT CONTROL OF MULTIPLE SUBSTRATE ZONES OF VARYING THICKNESS I...

ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE...

CONTROL OF POLISHING OF MULTIPLE SUBSTRATES ON THE SAME PLATEN IN C...

Control Of Overpolishing Of Multiple Substrates On the Same Platen...

TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING

ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE...

TUNING OF POLISHING PROCESS IN MULTI-CARRIER HEAD PER PLATEN POLISH...

Control of Overpolishing of Multiple Substrates on the Same Platen...

TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING

ENDPOINT CONTROL OF MULTIPLE-WAFER CHEMICAL MECHANICAL POLISHING

ENDPOINT CONTROL OF MULTIPLE-WAFER CHEMICAL MECHANICAL POLISHING

USE OF PAD CONDITIONING IN TEMPERATURE CONTROLLED CMP

SUBSTRATE HOLDER WITH LIQUID SUPPORTING SURFACE

HIGH THROUGHPUT LOW TOPOGRAPHY COPPER CMP PROCESS

METHOD OF SOFT PAD PREPARATION TO REDUCE REMOVAL RATE RAMP-UP EFFEC...