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Stephen L. Buchwalter

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  • Hopewell Junction, NY, US
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ULTRASONIC-ASSISTED SOLDER TRANSFER
    • Publication number 20210229203
    • Publication date Jul 29, 2021
    • International Business Machines Corporation
    • Jae-Woong Nah
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMBINATION POLYIMIDE DECAL WITH A RIGID MOLD
    • Publication number 20210151402
    • Publication date May 20, 2021
    • International Business Machines Corporation
    • Jae-Woong Nah
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONTINUOUS SOLDER TRANSFER TO SUBSTRATES
    • Publication number 20200316702
    • Publication date Oct 8, 2020
    • International Business Machines Corporation
    • Jae-Woong Nah
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INJECTION MOLDED MICROOPTICS
    • Publication number 20200020738
    • Publication date Jan 16, 2020
    • International Business Machines Corporation
    • Lawrence Jacobowitz
    • B82 - NANO-TECHNOLOGY
  • Information Patent Application

    INJECTION MOLDED MICROOPTICS
    • Publication number 20170033153
    • Publication date Feb 2, 2017
    • International Business Machines Corporation
    • Lawrence Jacobowitz
    • G02 - OPTICS
  • Information Patent Application

    INJECTION MOLDED MICROOPTICS
    • Publication number 20140084314
    • Publication date Mar 27, 2014
    • International Business Machines Corporation
    • Lawrence Jacobowitz
    • B82 - NANO-TECHNOLOGY
  • Information Patent Application

    PROCESS FOR MAKING STUBLESS PRINTED CIRCUIT BOARDS
    • Publication number 20130223030
    • Publication date Aug 29, 2013
    • International Business Machines Corporation
    • Stephen L. Buchwalter
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Micro-Fluidic Injection Molded Solder (IMS)
    • Publication number 20120132694
    • Publication date May 31, 2012
    • International Business Machines Corporation
    • Stephen L. Buchwalter
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Micro-Fluidic Injection Molded Solder (IMS)
    • Publication number 20110233262
    • Publication date Sep 29, 2011
    • International Business Machines Corporation
    • Stephen L. Buchwalter
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Micro-Fluidic Injection Molded Solder (IMS)
    • Publication number 20110192887
    • Publication date Aug 11, 2011
    • International Business Machines Corporation
    • Stephen L. Buchwalter
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    REWORKABLE ELECTRONIC DEVICE ASSEMBLY AND METHOD
    • Publication number 20110171756
    • Publication date Jul 14, 2011
    • International Business Machines Corporation
    • Paul S. ANDRY
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Sprocket Opening Alignment Process and Apparatus for Multilayer Sol...
    • Publication number 20110097892
    • Publication date Apr 28, 2011
    • International Business Machines Corporation
    • Stephen L. Buchwalter
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REWORKABLE ELECTRONIC DEVICE ASSEMBLY AND METHOD
    • Publication number 20100276796
    • Publication date Nov 4, 2010
    • International Business Machines Corporation
    • Paul S. ANDRY
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRICAL INTERCONNECT FORMING METHOD
    • Publication number 20100230475
    • Publication date Sep 16, 2010
    • International Business Machines Corporation
    • Stephen Leslie Buchwalter
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    ELECTRICAL INTERCONNECT STRUCTURE
    • Publication number 20100230143
    • Publication date Sep 16, 2010
    • International Business Machines Corporation
    • Stephen Leslie Buchwalter
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    ELECTRICAL INTERCONNECT FORMING METHOD
    • Publication number 20100230474
    • Publication date Sep 16, 2010
    • International Business Machines Corporation
    • Stephen Leslie Buchwalter
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    MICRO-FLUIDIC INJECTION MOLDED SOLDER (IMS)
    • Publication number 20100224670
    • Publication date Sep 9, 2010
    • International Business Machines Corporation
    • Stephen L. Buchwalter
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Interconnection for flip-chip using lead-free solders and having im...
    • Publication number 20100062597
    • Publication date Mar 11, 2010
    • Luc Belanger
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Assembly Method For Reworkable Chip Stacking With Conductive Film
    • Publication number 20090181476
    • Publication date Jul 16, 2009
    • International Business Machines Corporation
    • Stephen L. Buchwalter
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING SOLDER BUMPS
    • Publication number 20090181223
    • Publication date Jul 16, 2009
    • International Business Machines Corporation
    • Stephen L. Buchwalter
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SPROCKET OPENING ALIGNMENT PROCESS AND APPARATUS FOR MULTILAYER SOL...
    • Publication number 20090093111
    • Publication date Apr 9, 2009
    • International Business Machines Corporation
    • Stephen L. Buchwalter
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRICAL INTERCONNECT FORMING METHOD
    • Publication number 20090065555
    • Publication date Mar 12, 2009
    • Stephen Leslie Buchwalter
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CENTRIFUGAL METHOD FOR FILING HIGH ASPECT RATIO BLIND MICRO VIAS WI...
    • Publication number 20090032962
    • Publication date Feb 5, 2009
    • International Business Machines Corporation (Yorktown)
    • Gareth Hougham
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INJECTION MOLDED MICROOPTICS
    • Publication number 20080285136
    • Publication date Nov 20, 2008
    • International Business Machines Corporation
    • Lawrence Jacobowitz
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    PROCESS FOR MAKING STUBLESS PRINTED CIRCUIT BOARDS
    • Publication number 20080277154
    • Publication date Nov 13, 2008
    • Stephen L. Buchwalter
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRICAL INTERCONNECT STRUCTURE AND METHOD
    • Publication number 20080251281
    • Publication date Oct 16, 2008
    • Stephen Leslie Buchwalter
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING I...
    • Publication number 20080157395
    • Publication date Jul 3, 2008
    • Luc Belanger
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Manufacture of printed circuit boards with stubless plated through-...
    • Publication number 20070246252
    • Publication date Oct 25, 2007
    • International Business Machines Corporation
    • Stephen L. Buchwalter
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Injection molded microoptics
    • Publication number 20070029277
    • Publication date Feb 8, 2007
    • International Business Machines Corporation
    • Lawrence Jacobowitz
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    Composite solder transfer moldplate structure and method of making...
    • Publication number 20060289607
    • Publication date Dec 28, 2006
    • Stephen L. Buchwalter
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR