Stephen L. James

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Inserts for directing molding compound flow and semiconductor die a...
- Patent number 8,716,847
- Issue date May 6, 2014
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inserts for directing molding compound flow and semiconductor die a...
- Patent number 8,399,966
- Issue date Mar 19, 2013
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for directing molding compound flow and result...
- Patent number 8,207,599
- Issue date Jun 26, 2012
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for directing molding compound flow and result...
- Patent number 7,927,923
- Issue date Apr 19, 2011
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standoffs for centralizing internals in packaging process
- Patent number 7,501,309
- Issue date Mar 10, 2009
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standoffs for centralizing internals in packaging process
- Patent number 7,462,510
- Issue date Dec 9, 2008
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standoffs for centralizing internals in packaging process
- Patent number 7,459,797
- Issue date Dec 2, 2008
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standoffs for centralizing internals in packaging process
- Patent number 7,323,767
- Issue date Jan 29, 2008
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe alteration to direct compound flow into package
- Patent number 7,271,037
- Issue date Sep 18, 2007
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe alteration to direct compound flow into package
- Patent number 7,271,036
- Issue date Sep 18, 2007
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having dummy segments with trapped corner air
- Patent number 7,265,453
- Issue date Sep 4, 2007
- Micron Technology, Inc.
- Steven L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe alteration to direct compound flow into package
- Patent number 7,247,927
- Issue date Jul 24, 2007
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor components using mold cavities...
- Patent number 7,186,589
- Issue date Mar 6, 2007
- Micron Technology, Inc.
- Steven L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slotted adhesive for die-attach in BOC and LOC packages
- Patent number 7,054,161
- Issue date May 30, 2006
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe alteration to direct compound flow into package
- Patent number 7,053,467
- Issue date May 30, 2006
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices with pressure release elements and...
- Patent number 7,049,685
- Issue date May 23, 2006
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices with pressure release elements and...
- Patent number 6,979,595
- Issue date Dec 27, 2005
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for fabricating semiconductor components using mold cavities...
- Patent number 6,969,918
- Issue date Nov 29, 2005
- Micron Technology, Inc.
- Steven L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single sided adhesive tape for compound diversion on BOC substrates
- Patent number 6,815,835
- Issue date Nov 9, 2004
- Micron Technology Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate area relief strip for a molded I/C package
- Patent number 6,734,372
- Issue date May 11, 2004
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for reducing interposer compression during mol...
- Patent number 6,690,086
- Issue date Feb 10, 2004
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single sided adhesive tape for compound diversion on BOC substrates
- Patent number 6,657,132
- Issue date Dec 2, 2003
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for reducing interposer compression during mol...
- Patent number 6,518,678
- Issue date Feb 11, 2003
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate area relief strip for a molded I/C package
- Patent number 6,473,311
- Issue date Oct 29, 2002
- Micro Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe alteration to direct compound flow into package
- Patent number 6,451,629
- Issue date Sep 17, 2002
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with heat-dissipating lead-frame and process o...
- Patent number 6,396,133
- Issue date May 28, 2002
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe alteration to direct compound flow into package
- Patent number 6,278,175
- Issue date Aug 21, 2001
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INSERTS FOR DIRECTING MOLDING COMPOUND FLOW AND SEMICONDUCTOR DIE A...
- Publication number 20130168838
- Publication date Jul 4, 2013
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSERTS FOR DIRECTING MOLDING COMPOUND FLOW AND SEMICONDUCTOR DIE A...
- Publication number 20120235286
- Publication date Sep 20, 2012
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DIRECTING MOLDING COMPOUND FLOW AND RESULT...
- Publication number 20110163427
- Publication date Jul 7, 2011
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for directing molding compound flow and result...
- Publication number 20080073758
- Publication date Mar 27, 2008
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Standoffs for centralizing internals in packaging process
- Publication number 20060292750
- Publication date Dec 28, 2006
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatuses for encapsulating microelectronic devices
- Publication number 20060261498
- Publication date Nov 23, 2006
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe alteration to direct compound flow into package
- Publication number 20060263943
- Publication date Nov 23, 2006
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Standoffs for centralizing internals in packaging process
- Publication number 20060237832
- Publication date Oct 26, 2006
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic devices with pressure release elements and...
- Publication number 20060180907
- Publication date Aug 17, 2006
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe alteration to direct compound flow into package
- Publication number 20050287712
- Publication date Dec 29, 2005
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe alteration to direct compound flow into package
- Publication number 20050285237
- Publication date Dec 29, 2005
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component having dummy segments with trapped corner air
- Publication number 20050040506
- Publication date Feb 24, 2005
- Steven L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor components using mold cavities...
- Publication number 20050035435
- Publication date Feb 17, 2005
- Steven L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Standoffs for centralizing internals in packaging process
- Publication number 20050023562
- Publication date Feb 3, 2005
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Standoffs for centralizing internals in packaging process
- Publication number 20040169292
- Publication date Sep 2, 2004
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single sided adhesive tape for compound diversion on BOC substrates
- Publication number 20040007781
- Publication date Jan 15, 2004
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Standoffs for centralizing internals in packaging process
- Publication number 20030201525
- Publication date Oct 30, 2003
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for reducing interposer compression during mol...
- Publication number 20030085472
- Publication date May 8, 2003
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe alteration to direct compound flow into package
- Publication number 20030017651
- Publication date Jan 23, 2003
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic devices with pressure release elements and...
- Publication number 20020175399
- Publication date Nov 28, 2002
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate area relief strip for a molded I/C package
- Publication number 20020166695
- Publication date Nov 14, 2002
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single sided adhesive tape for compound diversion on BOC substrates
- Publication number 20020129973
- Publication date Sep 19, 2002
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for reducing interposer compression during mol...
- Publication number 20020084538
- Publication date Jul 4, 2002
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe alteration to direct compound flow into package
- Publication number 20010053566
- Publication date Dec 20, 2001
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS

Stephen L. James

Person

Patents Grantslast 30 patents

Inserts for directing molding compound flow and semiconductor die a...

Inserts for directing molding compound flow and semiconductor die a...

Method and apparatus for directing molding compound flow and result...

Method and apparatus for directing molding compound flow and result...

Standoffs for centralizing internals in packaging process

Standoffs for centralizing internals in packaging process

Standoffs for centralizing internals in packaging process

Standoffs for centralizing internals in packaging process

Leadframe alteration to direct compound flow into package

Leadframe alteration to direct compound flow into package

Semiconductor component having dummy segments with trapped corner air

Leadframe alteration to direct compound flow into package

Method for fabricating semiconductor components using mold cavities...

Slotted adhesive for die-attach in BOC and LOC packages

Leadframe alteration to direct compound flow into package

Packaged microelectronic devices with pressure release elements and...

Packaged microelectronic devices with pressure release elements and...

System for fabricating semiconductor components using mold cavities...

Single sided adhesive tape for compound diversion on BOC substrates

Gate area relief strip for a molded I/C package

Apparatus and method for reducing interposer compression during mol...

Single sided adhesive tape for compound diversion on BOC substrates

Apparatus and method for reducing interposer compression during mol...

Gate area relief strip for a molded I/C package

Leadframe alteration to direct compound flow into package

Semiconductor device with heat-dissipating lead-frame and process o...

Leadframe alteration to direct compound flow into package

Patents Applicationslast 30 patents

INSERTS FOR DIRECTING MOLDING COMPOUND FLOW AND SEMICONDUCTOR DIE A...

INSERTS FOR DIRECTING MOLDING COMPOUND FLOW AND SEMICONDUCTOR DIE A...

METHOD AND APPARATUS FOR DIRECTING MOLDING COMPOUND FLOW AND RESULT...

Method and apparatus for directing molding compound flow and result...

Standoffs for centralizing internals in packaging process

Methods and apparatuses for encapsulating microelectronic devices

Leadframe alteration to direct compound flow into package

Standoffs for centralizing internals in packaging process

Packaged microelectronic devices with pressure release elements and...

Leadframe alteration to direct compound flow into package

Leadframe alteration to direct compound flow into package

Semiconductor component having dummy segments with trapped corner air

Method for fabricating semiconductor components using mold cavities...

Standoffs for centralizing internals in packaging process

Standoffs for centralizing internals in packaging process

Single sided adhesive tape for compound diversion on BOC substrates

Standoffs for centralizing internals in packaging process

Apparatus and method for reducing interposer compression during mol...

Leadframe alteration to direct compound flow into package

Packaged microelectronic devices with pressure release elements and...

Gate area relief strip for a molded I/C package

Single sided adhesive tape for compound diversion on BOC substrates

Apparatus and method for reducing interposer compression during mol...

Leadframe alteration to direct compound flow into package