Stephen M. Hugo

Person

Stewartville, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Modified internal clearance(s) at connector pin aperture(s) of a ci...
- Patent number 12,256,494
- Issue date Mar 18, 2025
- International Business Machines Corporation
- James D. Bielick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shape-memory alloy lock for connectors
- Patent number 12,100,910
- Issue date Sep 24, 2024
- International Business Machines Corporation
- Theron Lee Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid socket warp indicator
- Patent number 11,906,574
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Stephen Michael Hugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shielding of heatsinks with spring press-fit pins
- Patent number 11,699,884
- Issue date Jul 11, 2023
- International Business Machines Corporation
- David J. Braun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized rework using liquid media soldering
- Patent number 11,445,650
- Issue date Sep 13, 2022
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Detecting and correcting deficiencies in surface conditions for bon...
- Patent number 11,268,809
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Jennifer Bennett
- G01 - MEASURING TESTING
Information Patent Grant
Tool for shaping contact tab interconnects at a circuit card edge
- Patent number 11,245,238
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Timothy P. Younger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stutter step press-fit connector insertion process
- Patent number 11,211,760
- Issue date Dec 28, 2021
- International Business Machines Corporation
- Timothy Jennings
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sinks using memory shaping materials
- Patent number 11,175,100
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Theron L. Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Barrier for hybrid socket movement reduction
- Patent number 10,834,839
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Theron Lee Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making integrated die paddle structures for bottom termin...
- Patent number 10,679,926
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Stephen M. Hugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Facilitating reliable circuit board press-fit connector assembly fa...
- Patent number 10,677,856
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Stephen M. Hugo
- G01 - MEASURING TESTING
Information Patent Grant
Dye and pry process for removing quad flat no-lead packages and bot...
- Patent number 10,593,601
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Tim A. Bartsch
- G01 - MEASURING TESTING
Information Patent Grant
Electromagnetic shielding of heat sinks with shape-memory alloy gro...
- Patent number 10,575,448
- Issue date Feb 25, 2020
- International Business Machines Corporation
- Theron L. Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated die paddle structures for bottom terminated components
- Patent number 10,559,522
- Issue date Feb 11, 2020
- International Business Machines Corporation
- Stephen M. Hugo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dye and pry process for removing quad flat no-lead packages and bot...
- Patent number 10,262,907
- Issue date Apr 16, 2019
- International Business Machines Corporation
- Tim A. Bartsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing printed circuit board assembly
- Patent number 10,168,383
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Mark K. Hoffmeyer
- G01 - MEASURING TESTING
Information Patent Grant
Integrated die paddle structures for bottom terminated components
- Patent number 10,083,894
- Issue date Sep 25, 2018
- International Business Machines Corporation
- Stephen M. Hugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate bond strength detection
- Patent number 10,073,134
- Issue date Sep 11, 2018
- International Business Machines Corporation
- Stephen M. Hugo
- G01 - MEASURING TESTING
Information Patent Grant
Testing printed circuit board assembly
- Patent number 10,048,312
- Issue date Aug 14, 2018
- International Business Machines Corporation
- Mark K. Hoffmeyer
- G01 - MEASURING TESTING
Information Patent Grant
Increasing solder hole-fill in a printed circuit board assembly
- Patent number 9,986,649
- Issue date May 29, 2018
- International Business Machine Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate bond strength detection
- Patent number 9,910,085
- Issue date Mar 6, 2018
- International Business Machines Corporation
- Stephen M. Hugo
- G01 - MEASURING TESTING
Information Patent Grant
Solder assembly temperature monitoring process
- Patent number 9,733,134
- Issue date Aug 15, 2017
- International Business Machines Corporation
- Stephen Michael Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder assembly temperature monitoring process
- Patent number 9,714,870
- Issue date Jul 25, 2017
- International Business Machines Corporation
- Stephen Michael Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Increasing solder hole-fill in a printed circuit board assembly
- Patent number 9,662,732
- Issue date May 30, 2017
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Increasing solder hole-fill in a printed circuit board assembly
- Patent number 9,427,828
- Issue date Aug 30, 2016
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat transfer device for wave soldering
- Patent number 9,232,664
- Issue date Jan 5, 2016
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat transfer device for wave soldering
- Patent number 9,148,962
- Issue date Sep 29, 2015
- International Business Machines Corporation
- Stephen M. Hugo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INFRARED SENSOR TURRET FOR REFLOW OVENS
- Publication number 20250093106
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Abdikarim Hussein
- G01 - MEASURING TESTING
Information Patent Application
MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...
- Publication number 20240237210
- Publication date Jul 11, 2024
- International Business Machines Corporation
- James D. BIELICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROLLED EXTRACTION OF ELECTRONIC CONNECTOR FROM ELECTRONIC CONNE...
- Publication number 20240170903
- Publication date May 23, 2024
- International Business Machines Corporation
- Theron Lee LEWIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...
- Publication number 20240138064
- Publication date Apr 25, 2024
- International Business Machines Corporation
- James D. BIELICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHAPE-MEMORY ALLOY LOCK FOR CONNECTORS
- Publication number 20230178922
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Theron Lee Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SOCKET WARP INDICATOR
- Publication number 20230009784
- Publication date Jan 12, 2023
- International Business Machines Corporation
- Stephen Michael Hugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELDING OF HEATSINKS WITH SPRING PRESS-FIT PINS
- Publication number 20220029361
- Publication date Jan 27, 2022
- International Business Machines Corporation
- David J. Braun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED REWORK USING LIQUID MEDIA SOLDERING
- Publication number 20210120712
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Theron Lee Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STUTTER STEP PRESS-FIT CONNECTOR INSERTION PROCESS
- Publication number 20210075179
- Publication date Mar 11, 2021
- International Business Machines Corporation
- Timothy Jennings
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINKS USING MEMORY SHAPING MATERIALS
- Publication number 20200355442
- Publication date Nov 12, 2020
- International Business Machines Corporation
- Theron L. Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DETECTING AND CORRECTING DEFICIENCIES IN SURFACE CONDITIONS FOR BON...
- Publication number 20200141726
- Publication date May 7, 2020
- International Business Machines Corporation
- JENNIFER BENNETT
- G01 - MEASURING TESTING
Information Patent Application
TOOL FOR SHAPING CONTACT TAB INTERCONNECTS AT A CIRCUIT CARD EDGE
- Publication number 20200119507
- Publication date Apr 16, 2020
- International Business Machines Corporation
- Timothy P. YOUNGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACILITATING RELIABLE CIRCUIT BOARD PRESS-FIT CONNECTOR ASSEMBLY FA...
- Publication number 20200057102
- Publication date Feb 20, 2020
- International Business Machines Corporation
- Stephen M. HUGO
- G01 - MEASURING TESTING
Information Patent Application
DYE AND PRY PROCESS FOR REMOVING QUAD FLAT NO-LEAD PACKAGES AND BOT...
- Publication number 20190157169
- Publication date May 23, 2019
- International Business Machines Corporation
- Tim A. Bartsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20180328980
- Publication date Nov 15, 2018
- International Business Machines Corporation
- Mark K. Hoffmeyer
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS
- Publication number 20180301399
- Publication date Oct 18, 2018
- International Business Machines Corporation
- Stephen M. Hugo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS
- Publication number 20180053711
- Publication date Feb 22, 2018
- International Business Machines Corporation
- Stephen M. Hugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE BOND STRENGTH DETECTION
- Publication number 20180045773
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Stephen M. Hugo
- G01 - MEASURING TESTING
Information Patent Application
LAMINATE BOND STRENGTH DETECTION
- Publication number 20170192051
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Stephen M. Hugo
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS
- Publication number 20170179004
- Publication date Jun 22, 2017
- International Business Machines
- Stephen M. Hugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20170142845
- Publication date May 18, 2017
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20160297022
- Publication date Oct 13, 2016
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20160044791
- Publication date Feb 11, 2016
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ASSEMBLY TEMPERATURE MONITORING PROCESS
- Publication number 20160011061
- Publication date Jan 14, 2016
- International Business Machines Corporation
- Stephen Michael Hugo
- G01 - MEASURING TESTING
Information Patent Application
SOLDER ASSEMBLY TEMPERATURE MONITORING PROCESS
- Publication number 20140198424
- Publication date Jul 17, 2014
- International Business Machines Corporation
- Stephen Michael Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT TRANSFER DEVICE FOR WAVE SOLDERING
- Publication number 20140182909
- Publication date Jul 3, 2014
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT TRANSFER DEVICE FOR WAVE SOLDERING
- Publication number 20140183250
- Publication date Jul 3, 2014
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Stephen M. Hugo

Person

Patents Grantslast 30 patents

Modified internal clearance(s) at connector pin aperture(s) of a ci...

Shape-memory alloy lock for connectors

Hybrid socket warp indicator

Electromagnetic shielding of heatsinks with spring press-fit pins

Localized rework using liquid media soldering

Detecting and correcting deficiencies in surface conditions for bon...

Tool for shaping contact tab interconnects at a circuit card edge

Stutter step press-fit connector insertion process

Heat sinks using memory shaping materials

Barrier for hybrid socket movement reduction

Method of making integrated die paddle structures for bottom termin...

Facilitating reliable circuit board press-fit connector assembly fa...

Dye and pry process for removing quad flat no-lead packages and bot...

Electromagnetic shielding of heat sinks with shape-memory alloy gro...

Integrated die paddle structures for bottom terminated components

Dye and pry process for removing quad flat no-lead packages and bot...

Testing printed circuit board assembly

Integrated die paddle structures for bottom terminated components

Laminate bond strength detection

Testing printed circuit board assembly

Increasing solder hole-fill in a printed circuit board assembly

Laminate bond strength detection

Solder assembly temperature monitoring process

Solder assembly temperature monitoring process

Increasing solder hole-fill in a printed circuit board assembly

Increasing solder hole-fill in a printed circuit board assembly

Heat transfer device for wave soldering

Heat transfer device for wave soldering

Patents Applicationslast 30 patents

INFRARED SENSOR TURRET FOR REFLOW OVENS

MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...

CONTROLLED EXTRACTION OF ELECTRONIC CONNECTOR FROM ELECTRONIC CONNE...

MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...

SHAPE-MEMORY ALLOY LOCK FOR CONNECTORS

HYBRID SOCKET WARP INDICATOR

ELECTROMAGNETIC SHIELDING OF HEATSINKS WITH SPRING PRESS-FIT PINS

LOCALIZED REWORK USING LIQUID MEDIA SOLDERING

STUTTER STEP PRESS-FIT CONNECTOR INSERTION PROCESS

HEAT SINKS USING MEMORY SHAPING MATERIALS

DETECTING AND CORRECTING DEFICIENCIES IN SURFACE CONDITIONS FOR BON...

TOOL FOR SHAPING CONTACT TAB INTERCONNECTS AT A CIRCUIT CARD EDGE

FACILITATING RELIABLE CIRCUIT BOARD PRESS-FIT CONNECTOR ASSEMBLY FA...

DYE AND PRY PROCESS FOR REMOVING QUAD FLAT NO-LEAD PACKAGES AND BOT...

TESTING PRINTED CIRCUIT BOARD ASSEMBLY

INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS

INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS

LAMINATE BOND STRENGTH DETECTION

LAMINATE BOND STRENGTH DETECTION

INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

SOLDER ASSEMBLY TEMPERATURE MONITORING PROCESS

SOLDER ASSEMBLY TEMPERATURE MONITORING PROCESS

HEAT TRANSFER DEVICE FOR WAVE SOLDERING

HEAT TRANSFER DEVICE FOR WAVE SOLDERING