Stephen Martin

Person

South Portland, ME, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectromechanical systems microphone packaging systems
- Patent number 8,421,168
- Issue date Apr 16, 2013
- Fairchild Semiconductor Corporation
- Howard Allen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level stack die package
- Patent number 8,211,747
- Issue date Jul 3, 2012
- Fairchild Semiconductor Corporation
- Dan Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level stack die package
- Patent number 8,115,260
- Issue date Feb 14, 2012
- Fairchild Semiconductor Corporation
- Dan Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to manufacture a universal footprint for a package with expo...
- Patent number 7,256,479
- Issue date Aug 14, 2007
- Fairchild Semiconductor Corporation
- Jonathan A. Noquil
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging system for die-up connection of a die-down oriented integ...
- Patent number 6,891,257
- Issue date May 10, 2005
- Fairchild Semiconductor Corporation
- David Chong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL STACK DIE PACKAGE
- Publication number 20120088331
- Publication date Apr 12, 2012
- Dan Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL STACK DIE PACKAGE
- Publication number 20110163391
- Publication date Jul 7, 2011
- Fairchild Semiconductor Corporation
- Dan Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS MICROPHONE PACKAGING SYSTEMS
- Publication number 20110121413
- Publication date May 26, 2011
- Howard Allen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method to manufacture a universal footprint for a package with expo...
- Publication number 20060151861
- Publication date Jul 13, 2006
- Jonathan A. Noquil
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Package and method for packaging an integrated circuit die
- Publication number 20050275089
- Publication date Dec 15, 2005
- Rajeev Dinkar Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single row bond pad arrangement
- Publication number 20050245062
- Publication date Nov 3, 2005
- Jeff Kingsbury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging system for die-up connection of a die-down oriented integ...
- Publication number 20040080056
- Publication date Apr 29, 2004
- David Chong Sook Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging system for die-up connection of a die-down oriented integ...
- Publication number 20020140070
- Publication date Oct 3, 2002
- Fairchild Semiconductor Corp.
- David Chong Sook Lim
- H01 - BASIC ELECTRIC ELEMENTS

Stephen Martin

Person

Patents Grantslast 30 patents

Microelectromechanical systems microphone packaging systems

Wafer level stack die package

Wafer level stack die package

Method to manufacture a universal footprint for a package with expo...

Packaging system for die-up connection of a die-down oriented integ...

Patents Applicationslast 30 patents

WAFER LEVEL STACK DIE PACKAGE

WAFER LEVEL STACK DIE PACKAGE

MICROELECTROMECHANICAL SYSTEMS MICROPHONE PACKAGING SYSTEMS

Method to manufacture a universal footprint for a package with expo...

Package and method for packaging an integrated circuit die

Single row bond pad arrangement

Packaging system for die-up connection of a die-down oriented integ...

Packaging system for die-up connection of a die-down oriented integ...