Stephen Moxham

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Solder ball landpad design to improve laminate performance
- Patent number 7,951,646
- Issue date May 31, 2011
- Round Rock Research, LLC
- Brad D. Rumsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having stiffener, circuit decal and termina...
- Patent number 7,335,978
- Issue date Feb 26, 2008
- Micron Technology, Inc.
- Stephen F. Moxham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor component with stiffener and c...
- Patent number 7,268,018
- Issue date Sep 11, 2007
- Micron Technology, Inc.
- Stephen F. Moxham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having stiffener, stacked dice and circuit...
- Patent number 7,115,982
- Issue date Oct 3, 2006
- Micron Technology, Inc.
- Stephen F. Moxham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and system having stiffener and circuit decal
- Patent number 7,061,085
- Issue date Jun 13, 2006
- Micron Technology, Inc.
- Stephen F. Moxham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for coupling a flowable conductive material to microelectro...
- Patent number 6,995,026
- Issue date Feb 7, 2006
- Micron Technology, Inc.
- Stephen Moxham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic assemblies and electronic devices including connect...
- Patent number 6,936,916
- Issue date Aug 30, 2005
- Micron Technology, Inc.
- Stephen Moxham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming circuit traces and contact pads for interposers...
- Patent number 6,913,952
- Issue date Jul 5, 2005
- Micron Technology, Inc.
- Stephen F. Moxham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball landpad design to improve laminate performance
- Patent number 6,914,326
- Issue date Jul 5, 2005
- Micron Technology, Inc.
- Brad D. Rumsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for supporting microelectronic substrates
- Patent number 6,870,276
- Issue date Mar 22, 2005
- Micron Technology, Inc.
- Stephen Moxham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball landpad design to improve laminate performance
- Patent number 6,577,004
- Issue date Jun 10, 2003
- Micron Technology, Inc.
- Brad D. Rumsey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATES WITH CONTINUOUS SLOT VIAS
- Publication number 20240074055
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component having stiffener, circuit decal and termina...
- Publication number 20060202316
- Publication date Sep 14, 2006
- Stephen F. Moxham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for supporting microelectronic substrates
- Publication number 20050242437
- Publication date Nov 3, 2005
- Micron Technology, Inc.
- Stephen Moxham
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for fabricating semiconductor component with stiffener and c...
- Publication number 20050179124
- Publication date Aug 18, 2005
- Stephen F. Moxham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component having stiffener, circuit decal and termina...
- Publication number 20050179143
- Publication date Aug 18, 2005
- Stephen F. Moxham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component having stiffener and circuit decal and meth...
- Publication number 20050073035
- Publication date Apr 7, 2005
- Stephen F. Moxham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming circuit traces and contact pads for interposers...
- Publication number 20050003607
- Publication date Jan 6, 2005
- Stephen F. Moxham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for coupling a flowable conductive material to microelectro...
- Publication number 20040159921
- Publication date Aug 19, 2004
- Stephen Moxham
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Microelectronic assemblies, electronic devices, and apparatuses for...
- Publication number 20040159946
- Publication date Aug 19, 2004
- Stephen Moxham
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder ball landpad design to improve laminate performance
- Publication number 20030205807
- Publication date Nov 6, 2003
- Brad D. Rumsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder ball landpad design to improve laminate performance
- Publication number 20030193089
- Publication date Oct 16, 2003
- Brad D. Rumsey
- H01 - BASIC ELECTRIC ELEMENTS

Stephen Moxham

Person

Patents Grantslast 30 patents

Solder ball landpad design to improve laminate performance

Semiconductor component having stiffener, circuit decal and termina...

Method for fabricating semiconductor component with stiffener and c...

Semiconductor component having stiffener, stacked dice and circuit...

Semiconductor component and system having stiffener and circuit decal

Methods for coupling a flowable conductive material to microelectro...

Microelectronic assemblies and electronic devices including connect...

Methods of forming circuit traces and contact pads for interposers...

Solder ball landpad design to improve laminate performance

Apparatus for supporting microelectronic substrates

Solder ball landpad design to improve laminate performance

Patents Applicationslast 30 patents

SUBSTRATES WITH CONTINUOUS SLOT VIAS

Semiconductor component having stiffener, circuit decal and termina...

Method and apparatus for supporting microelectronic substrates

Method for fabricating semiconductor component with stiffener and c...

Semiconductor component having stiffener, circuit decal and termina...

Semiconductor component having stiffener and circuit decal and meth...

Methods of forming circuit traces and contact pads for interposers...

Methods for coupling a flowable conductive material to microelectro...

Microelectronic assemblies, electronic devices, and apparatuses for...

Solder ball landpad design to improve laminate performance

Solder ball landpad design to improve laminate performance