Stephen N. Golovato

Person

Lexington, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for increasing adhesion of copper to polymeric surfaces
- Patent number 9,355,864
- Issue date May 31, 2016
- Tel Nexx, Inc.
- Georgiy Seryogin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing pallet with cooling
- Patent number 9,147,588
- Issue date Sep 29, 2015
- Tel Nexx, Inc.
- Daniel Goodman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical coupling between chamber parts in electronic device proc...
- Patent number 6,779,481
- Issue date Aug 24, 2004
- Tokyo Electron Limited
- Martin A. Kent
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic device processing equipment having contact gasket betwee...
- Patent number 6,695,318
- Issue date Feb 24, 2004
- Tokyo Electron Limited
- Stephen N. Golovato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for insulating a high power RF electrode throu...
- Patent number 6,173,673
- Issue date Jan 16, 2001
- Tokyo Electron Limited
- Stephen N. Golovato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etch rate enhancement by background oxygen control in a...
- Patent number 6,143,144
- Issue date Nov 7, 2000
- Tokyo ElectronLimited
- Stephen N. Golovato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Increasing Adhesion of Copper to Polymeric Surfaces
- Publication number 20160260673
- Publication date Sep 8, 2016
- TEL NEXX, Inc.
- Georgiy Seryogin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for Increasing Adhesion of Copper to Polymeric Surfaces
- Publication number 20160071703
- Publication date Mar 10, 2016
- TEL NEXX, Inc.
- Georgiy Seryogin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INCREASING ADHESION OF COPPER TO POLYMERIC SURFACES
- Publication number 20150044871
- Publication date Feb 12, 2015
- TEL NEXX, Inc.
- Georgiy Seryogin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING PALLET WITH COOLING
- Publication number 20110024964
- Publication date Feb 3, 2011
- Nexx Systems, Inc.
- Daniel Goodman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate processing pallet with cooling
- Publication number 20080220622
- Publication date Sep 11, 2008
- Daniel Goodman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device processing equipment having contact gasket betwee...
- Publication number 20020093148
- Publication date Jul 18, 2002
- TOKYO ELECTRON LIMITED
- Stephen N. Golovato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical coupling between chamber parts in electronic device proc...
- Publication number 20010035132
- Publication date Nov 1, 2001
- TOKYO ELECTRON LIMITED
- Martin A. Kent
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Stephen N. Golovato

Person

Patents Grantslast 30 patents

Method for increasing adhesion of copper to polymeric surfaces

Substrate processing pallet with cooling

Electrical coupling between chamber parts in electronic device proc...

Electronic device processing equipment having contact gasket betwee...

Method and apparatus for insulating a high power RF electrode throu...

Method for etch rate enhancement by background oxygen control in a...

Patents Applicationslast 30 patents

Method for Increasing Adhesion of Copper to Polymeric Surfaces

Method for Increasing Adhesion of Copper to Polymeric Surfaces

METHOD FOR INCREASING ADHESION OF COPPER TO POLYMERIC SURFACES

SUBSTRATE PROCESSING PALLET WITH COOLING

Substrate processing pallet with cooling

Electronic device processing equipment having contact gasket betwee...

Electrical coupling between chamber parts in electronic device proc...