Stephen P. Ayotte

Person

Bristol, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Contactless readable programmable transponder to monitor chip join
- Patent number 11,075,619
- Issue date Jul 27, 2021
- International Business Machines Corporation
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Screening methodology to eliminate wire sweep in bond and assembly...
- Patent number 10,605,850
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Stephen Peter Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contactless readable programmable transponder to monitor chip join
- Patent number 10,601,404
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple contact probe head disassembly method and system
- Patent number 10,429,414
- Issue date Oct 1, 2019
- GLOBALFOUNDRIES Inc.
- Marvin G. L. Montaque
- G01 - MEASURING TESTING
Information Patent Grant
Predicting semiconductor package warpage
- Patent number 10,309,884
- Issue date Jun 4, 2019
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Grant
Separation of integrated circuit structure from adjacent chip
- Patent number 10,256,204
- Issue date Apr 9, 2019
- GLOBALFOUNDRIES Inc.
- Glen E Richard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip joining by induction heating
- Patent number 10,245,667
- Issue date Apr 2, 2019
- GLOBALFOUNDRIES Inc.
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contactless readable programmable transponder to monitor chip join
- Patent number 10,200,016
- Issue date Feb 5, 2019
- International Business Machines Corporation
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for semiconductor die removal rework
- Patent number 10,050,012
- Issue date Aug 14, 2018
- International Business Machines Corporation
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contactless readable programmable transponder to monitor chip join
- Patent number 9,876,487
- Issue date Jan 23, 2018
- International Business Machines Corporation
- Stephen P. Ayotte
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip joining by induction heating
- Patent number 9,776,270
- Issue date Oct 3, 2017
- GLOBALFOUNDRIES Inc.
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Predicting semiconductor package warpage
- Patent number 9,772,268
- Issue date Sep 26, 2017
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Grant
Visually detecting electrostatic discharge events
- Patent number 9,711,422
- Issue date Jul 18, 2017
- GLOBALFOUNDRIES INC.
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of making
- Patent number 9,704,830
- Issue date Jul 11, 2017
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliability monitor test strategy definition
- Patent number 9,645,573
- Issue date May 9, 2017
- International Business Machines Corporation
- Stephen P. Ayotte
- G05 - CONTROLLING REGULATING
Information Patent Grant
Detecting sudden changes in acceleration in semiconductor device or...
- Patent number 9,548,275
- Issue date Jan 17, 2017
- GLOBALFOUNDRIES Inc.
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Induction heating for underfill removal and chip rework
- Patent number 9,508,680
- Issue date Nov 29, 2016
- GLOBALFOUNDRIES Inc.
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure with recessed solder bump area and methods of forming...
- Patent number 9,472,490
- Issue date Oct 18, 2016
- GLOBALFOUNDRIES, INC.
- Timothy M. Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Screening methodology to eliminate wire sweep in bond and assembly...
- Patent number 9,470,740
- Issue date Oct 18, 2016
- International Business Machines Corporation
- Stephen Peter Ayotte
- G01 - MEASURING TESTING
Information Patent Grant
Self-healing crack stop structure
- Patent number 9,230,921
- Issue date Jan 5, 2016
- GLOBALFOUNDRIES Inc.
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature stabilization in semiconductors using the magnetocalori...
- Patent number 9,222,707
- Issue date Dec 29, 2015
- GLOBALFOUNDRIES Inc.
- Stephen P. Ayotte
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Solder bump reflow by induction heating
- Patent number 9,190,375
- Issue date Nov 17, 2015
- GLOBALFOUNDRIES, INC.
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing thermal energy transfer during chip-join processing
- Patent number 9,177,931
- Issue date Nov 3, 2015
- GlobalFoundries U.S. 2 LLC
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Visually detecting electrostatic discharge events
- Patent number 9,105,573
- Issue date Aug 11, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Grant
Inhibiting propagation of imperfections in semiconductor devices
- Patent number 9,059,097
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microprocessor image correction and method for the detection of pot...
- Patent number 8,987,010
- Issue date Mar 24, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked multi-chip package and method of making same
- Patent number 8,829,674
- Issue date Sep 9, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled collapse chip connection (C4) structure and methods of f...
- Patent number 8,765,593
- Issue date Jul 1, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tray for transporting semiconductor devices of a BGA type
- Patent number 8,453,843
- Issue date Jun 4, 2013
- International Business Machines Corporation
- Stephen Peter Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally sensitive material embedded in the substrate
- Patent number 8,426,856
- Issue date Apr 23, 2013
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CONTACTLESS READABLE PROGRAMMABLE TRANSPONDER TO MONITOR CHIP JOIN
- Publication number 20190386646
- Publication date Dec 19, 2019
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Application
CONTACTLESS READABLE PROGRAMMABLE TRANSPONDER TO MONITOR CHIP JOIN
- Publication number 20180358955
- Publication date Dec 13, 2018
- International Business Machines Corporation
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEPARATION OF INTEGRATED CIRCUIT STRUCTURE FROM ADJACENT CHIP
- Publication number 20180130733
- Publication date May 10, 2018
- GLOBALFOUNDRIES INC.
- Glen E. Richard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTLESS READABLE PROGRAMMABLE TRANSPONDER TO MONITOR CHIP JOIN
- Publication number 20170366172
- Publication date Dec 21, 2017
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Application
CHIP JOINING BY INDUCTION HEATING
- Publication number 20170312841
- Publication date Nov 2, 2017
- GLOBALFOUNDRIES INC.
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREDICTING SEMICONDUCTOR PACKAGE WARPAGE
- Publication number 20170284913
- Publication date Oct 5, 2017
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Application
MULTIPLE CONTACT PROBE HEAD DISASSEMBLY METHOD AND SYSTEM
- Publication number 20170219631
- Publication date Aug 3, 2017
- GLOBALFOUNDRIES INC.
- Marvin G. L. Montaque
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20170200699
- Publication date Jul 13, 2017
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR SEMICONDUCTOR DIE REMOVAL REWORK
- Publication number 20170148762
- Publication date May 25, 2017
- International Business Machine Corporation
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Screening Methodology to Eliminate Wire Sweep in Bond and Assembly...
- Publication number 20170016950
- Publication date Jan 19, 2017
- International Business Machines Corporation
- Stephen Peter Ayotte
- G01 - MEASURING TESTING
Information Patent Application
INDUCTION HEATING FOR UNDERFILL REMOVAL AND CHIP REWORK
- Publication number 20160372444
- Publication date Dec 22, 2016
- GLOBALFOUNDRIES Inc.
- Stephen P. Ayotte
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PREDICTING SEMICONDUCTOR PACKAGE WARPAGE
- Publication number 20160290905
- Publication date Oct 6, 2016
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Application
RELIABILITY MONITOR TEST STRATEGY DEFINITION
- Publication number 20160147220
- Publication date May 26, 2016
- International Business Machines Corporation
- Stephen P. Ayotte
- G05 - CONTROLLING REGULATING
Information Patent Application
ELLIPTICAL WAFER MANUFACTURE
- Publication number 20160079059
- Publication date Mar 17, 2016
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISUALLY DETECTING ELECTROSTATIC DISCHARGE EVENTS
- Publication number 20150355253
- Publication date Dec 10, 2015
- GLOBALFOUNDRIES Inc.
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Application
SOLDER BUMP REFLOW BY INDUCTION HEATING
- Publication number 20150294948
- Publication date Oct 15, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING THERMAL ENERGY TRANSFER DURING CHIP-JOIN PROCESSING
- Publication number 20150243618
- Publication date Aug 27, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-HEALING CRACK STOP STRUCTURE
- Publication number 20150097271
- Publication date Apr 9, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTLESS READABLE PROGRAMMABLE TRANSPONDER TO MONITOR CHIP JOIN
- Publication number 20150091584
- Publication date Apr 2, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Application
CHIP JOINING BY INDUCTION HEATING
- Publication number 20150089805
- Publication date Apr 2, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROPROCESSOR IMAGE CORRECTION AND METHOD FOR THE DETECTION OF POT...
- Publication number 20150064813
- Publication date Mar 5, 2015
- International Business Machines Corporation
- Stephen P. AYOTTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTING SUDDEN CHANGES IN ACCELERATION IN SEMICONDUCTOR DEVICE OR...
- Publication number 20140346619
- Publication date Nov 27, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Application
SCREENING METHODOLOGY TO ELIMINATE WIRE SWEEP IN BOND AND ASSEMBLY...
- Publication number 20140266242
- Publication date Sep 18, 2014
- International Business Machines Corporation
- Stephen Peter Ayotte
- G01 - MEASURING TESTING
Information Patent Application
TEMPERATURE STABILIZATION IN SEMICONDUCTORS USING THE MAGNETOCALORI...
- Publication number 20140223922
- Publication date Aug 14, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MULTI-CHIP PACKAGE AND METHOD OF MAKING SAME
- Publication number 20140183723
- Publication date Jul 3, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED COLLAPSE CHIP CONNECTION (C4) STRUCTURE AND METHODS OF F...
- Publication number 20140042630
- Publication date Feb 13, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHIBITING PROPAGATION OF IMPERFECTIONS IN SEMICONDUCTOR DEVICES
- Publication number 20140042594
- Publication date Feb 13, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISUALLY DETECTING ELECTROSTATIC DISCHARGE EVENTS
- Publication number 20130257624
- Publication date Oct 3, 2013
- International Business Machines Corporation
- Stephen P. AYOTTE
- G01 - MEASURING TESTING
Information Patent Application
THERMALLY SENSITIVE MATERIAL EMBEDDED IN THE SUBSTRATE
- Publication number 20120007074
- Publication date Jan 12, 2012
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Application
OPTICALLY TRANSPARENT WIRES FOR SECURE CIRCUITS AND METHODS OF MAKI...
- Publication number 20110284280
- Publication date Nov 24, 2011
- International Business Machines Corporation
- Stephen Peter Ayotte
- H01 - BASIC ELECTRIC ELEMENTS

Stephen P. Ayotte

Person

Patents Grantslast 30 patents

Contactless readable programmable transponder to monitor chip join

Screening methodology to eliminate wire sweep in bond and assembly...

Contactless readable programmable transponder to monitor chip join

Multiple contact probe head disassembly method and system

Predicting semiconductor package warpage

Separation of integrated circuit structure from adjacent chip

Chip joining by induction heating

Contactless readable programmable transponder to monitor chip join

Method for semiconductor die removal rework

Contactless readable programmable transponder to monitor chip join

Chip joining by induction heating

Predicting semiconductor package warpage

Visually detecting electrostatic discharge events

Semiconductor structure and method of making

Reliability monitor test strategy definition

Detecting sudden changes in acceleration in semiconductor device or...

Induction heating for underfill removal and chip rework

IC structure with recessed solder bump area and methods of forming...

Screening methodology to eliminate wire sweep in bond and assembly...

Self-healing crack stop structure

Temperature stabilization in semiconductors using the magnetocalori...

Solder bump reflow by induction heating

Reducing thermal energy transfer during chip-join processing

Visually detecting electrostatic discharge events

Inhibiting propagation of imperfections in semiconductor devices

Microprocessor image correction and method for the detection of pot...

Stacked multi-chip package and method of making same

Controlled collapse chip connection (C4) structure and methods of f...

Tray for transporting semiconductor devices of a BGA type

Thermally sensitive material embedded in the substrate

Patents Applicationslast 30 patents

CONTACTLESS READABLE PROGRAMMABLE TRANSPONDER TO MONITOR CHIP JOIN

CONTACTLESS READABLE PROGRAMMABLE TRANSPONDER TO MONITOR CHIP JOIN

SEPARATION OF INTEGRATED CIRCUIT STRUCTURE FROM ADJACENT CHIP

CONTACTLESS READABLE PROGRAMMABLE TRANSPONDER TO MONITOR CHIP JOIN

CHIP JOINING BY INDUCTION HEATING

PREDICTING SEMICONDUCTOR PACKAGE WARPAGE

MULTIPLE CONTACT PROBE HEAD DISASSEMBLY METHOD AND SYSTEM

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

METHOD AND STRUCTURE FOR SEMICONDUCTOR DIE REMOVAL REWORK

Screening Methodology to Eliminate Wire Sweep in Bond and Assembly...

INDUCTION HEATING FOR UNDERFILL REMOVAL AND CHIP REWORK

PREDICTING SEMICONDUCTOR PACKAGE WARPAGE

RELIABILITY MONITOR TEST STRATEGY DEFINITION

ELLIPTICAL WAFER MANUFACTURE

VISUALLY DETECTING ELECTROSTATIC DISCHARGE EVENTS

SOLDER BUMP REFLOW BY INDUCTION HEATING

REDUCING THERMAL ENERGY TRANSFER DURING CHIP-JOIN PROCESSING

SELF-HEALING CRACK STOP STRUCTURE

CONTACTLESS READABLE PROGRAMMABLE TRANSPONDER TO MONITOR CHIP JOIN

CHIP JOINING BY INDUCTION HEATING

MICROPROCESSOR IMAGE CORRECTION AND METHOD FOR THE DETECTION OF POT...

DETECTING SUDDEN CHANGES IN ACCELERATION IN SEMICONDUCTOR DEVICE OR...

SCREENING METHODOLOGY TO ELIMINATE WIRE SWEEP IN BOND AND ASSEMBLY...

TEMPERATURE STABILIZATION IN SEMICONDUCTORS USING THE MAGNETOCALORI...

STACKED MULTI-CHIP PACKAGE AND METHOD OF MAKING SAME

CONTROLLED COLLAPSE CHIP CONNECTION (C4) STRUCTURE AND METHODS OF F...

INHIBITING PROPAGATION OF IMPERFECTIONS IN SEMICONDUCTOR DEVICES

VISUALLY DETECTING ELECTROSTATIC DISCHARGE EVENTS

THERMALLY SENSITIVE MATERIAL EMBEDDED IN THE SUBSTRATE

OPTICALLY TRANSPARENT WIRES FOR SECURE CIRCUITS AND METHODS OF MAKI...