Stephen R. Engle

Person

Binghampton, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of packaging a high performance chip
- Patent number 6,655,020
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Timothy F. Carden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance chip packaging and method
- Patent number 6,552,264
- Issue date Apr 22, 2003
- International Business Machines Corporation
- Timothy F. Carden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance chip packaging and method
- Patent number 6,552,266
- Issue date Apr 22, 2003
- International Business Machines Corporation
- Timothy F. Carden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced ball grid array package
- Patent number 5,768,774
- Issue date Jun 23, 1998
- International Business Machines
- James Warren Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced ball grid array package
- Patent number 5,572,405
- Issue date Nov 5, 1996
- International Business Machines Corporation (IBM)
- James W. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic chip carrier with lead frame or edge clip
- Patent number 5,243,133
- Issue date Sep 7, 1993
- International Business Machines, Inc.
- Stephen R. Engle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suspension and use thereof
- Patent number 4,803,100
- Issue date Feb 7, 1989
- International Business Machines Corporation
- Joseph G. Ameen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
HIGH PERFORMANCE CHIP PACKAGING AND METHOD
- Publication number 20020053449
- Publication date May 9, 2002
- TIMOTHY F. CARDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance chip packaging and method
- Publication number 20010009196
- Publication date Jul 26, 2001
- Timothy F. Carden
- H01 - BASIC ELECTRIC ELEMENTS

Stephen R. Engle

Person

Patents Grantslast 30 patents

Method of packaging a high performance chip

High performance chip packaging and method

High performance chip packaging and method

Thermally enhanced ball grid array package

Thermally enhanced ball grid array package

Ceramic chip carrier with lead frame or edge clip

Suspension and use thereof

Patents Applicationslast 30 patents

HIGH PERFORMANCE CHIP PACKAGING AND METHOD

High performance chip packaging and method