TREA

Stephen R. Farrar

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  • Albany, OR, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Circuit package
    • Patent number 11,183,437
    • Issue date Nov 23, 2021
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit package
    • Patent number 10,685,898
    • Issue date Jun 16, 2020
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit package
    • Patent number 10,559,512
    • Issue date Feb 11, 2020
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit package
    • Patent number 10,276,468
    • Issue date Apr 30, 2019
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-wafer pair anodic bonding apparatus and method
    • Patent number 9,287,126
    • Issue date Mar 15, 2016
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • C03 - GLASS MINERAL OR SLAG WOOL

Patents Applicationslast 30 patents

  • Information Patent Application

    CIRCUIT PACKAGE
    • Publication number 20200144148
    • Publication date May 7, 2020
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    Circuit Package
    • Publication number 20190214325
    • Publication date Jul 11, 2019
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT PACKAGE
    • Publication number 20180269125
    • Publication date Sep 20, 2018
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    Circuit Package
    • Publication number 20180226316
    • Publication date Aug 9, 2018
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    Circuit Package
    • Publication number 20180012816
    • Publication date Jan 11, 2018
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-WAFER PAIR ANODIC BONDING APPARATUS AND METHOD
    • Publication number 20140322892
    • Publication date Oct 30, 2014
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • C03 - GLASS MINERAL OR SLAG WOOL