Stephen S. Drofitz Jr.

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip module and heat-sink cap combination
- Patent number 6,373,133
- Issue date Apr 16, 2002
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding heatsink to multiple-height chip
- Patent number 6,214,647
- Issue date Apr 10, 2001
- International Business Machines Corporation
- Giulio Di Giacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic CBGA/CCGA structure with thermal paste cooling
- Patent number 5,990,418
- Issue date Nov 23, 1999
- International Business Machines Corporation
- Kevin G. Bivona
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip heat-sink cap assembly
- Patent number 5,981,310
- Issue date Nov 9, 1999
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer solder seal band for semiconductor substrates and process
- Patent number 5,881,945
- Issue date Mar 16, 1999
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer solder seal band for semiconductor substrates
- Patent number 5,881,944
- Issue date Mar 16, 1999
- International Business Machines Corporation
- David L. Edwards
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Determination of electric current flow patterns
- Patent number 4,272,722
- Issue date Jun 9, 1981
- International Business Machines Corporation
- Armando S. Cammarano
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Method for bonding heatsink to multiple-height chip
- Publication number 20020017715
- Publication date Feb 14, 2002
- Giulio Di Giacomo
- H01 - BASIC ELECTRIC ELEMENTS

Stephen S. Drofitz Jr.

Person

Patents Grantslast 30 patents

Multi-chip module and heat-sink cap combination

Method for bonding heatsink to multiple-height chip

Hermetic CBGA/CCGA structure with thermal paste cooling

Multi-chip heat-sink cap assembly

Multi-layer solder seal band for semiconductor substrates and process

Multi-layer solder seal band for semiconductor substrates

Determination of electric current flow patterns

Patents Applicationslast 30 patents

Method for bonding heatsink to multiple-height chip