Stephen St. Germain

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structures and methods of manufacture
- Patent number 11,984,388
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,955,412
- Issue date Apr 9, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,948,870
- Issue date Apr 2, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,908,840
- Issue date Feb 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,894,347
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for supporting ultra-thin semicondu...
- Patent number 11,881,398
- Issue date Jan 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method related to a power module using a hybrid spacer
- Patent number 11,842,942
- Issue date Dec 12, 2023
- Semiconductor Components Industries, LLC
- Liangbiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures and methods of manufacture
- Patent number 11,710,686
- Issue date Jul 25, 2023
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,469,163
- Issue date Oct 11, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,462,515
- Issue date Oct 4, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for supporting ultra-thin semicondu...
- Patent number 11,355,341
- Issue date Jun 7, 2022
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method related to a power module using a hybrid spacer
- Patent number 11,282,764
- Issue date Mar 22, 2022
- Semiconductor Components Industries, LLC
- Liangbiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures and methods of manufacture
- Patent number 11,217,515
- Issue date Jan 4, 2022
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure for gallium nitride devices
- Patent number 11,107,753
- Issue date Aug 31, 2021
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for supporting ultra-thin semicondu...
- Patent number 10,672,607
- Issue date Jun 2, 2020
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single or multi chip module package and related methods
- Patent number 10,522,448
- Issue date Dec 31, 2019
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,490,488
- Issue date Nov 26, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,325,835
- Issue date Jun 18, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for supporting ultra-thin semicondu...
- Patent number 10,090,199
- Issue date Oct 2, 2018
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Holes and dimples to control solder flow
- Patent number 9,911,684
- Issue date Mar 6, 2018
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single or multi chip module package and related methods
- Patent number 9,870,986
- Issue date Jan 16, 2018
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge HEMT circuit and an electronic package including the ci...
- Patent number 9,773,895
- Issue date Sep 26, 2017
- Semiconductor Components Industries, LLC
- Balaji Padmanabhan
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package for a lateral device and related methods
- Patent number 9,646,919
- Issue date May 9, 2017
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 9,576,883
- Issue date Feb 21, 2017
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single or multi chip module package and related methods
- Patent number 9,558,968
- Issue date Jan 31, 2017
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 9,397,028
- Issue date Jul 19, 2016
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for a lateral device and related methods
- Patent number 9,379,193
- Issue date Jun 28, 2016
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 9,070,721
- Issue date Jun 30, 2015
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,384,206
- Issue date Feb 26, 2013
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor connector
- Patent number 8,253,239
- Issue date Aug 28, 2012
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20240290758
- Publication date Aug 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20240203846
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20240203845
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER
- Publication number 20240136247
- Publication date Apr 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Liangbiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20240128240
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20230317576
- Publication date Oct 5, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20220415857
- Publication date Dec 29, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20220415766
- Publication date Dec 29, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20220415858
- Publication date Dec 29, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20220415767
- Publication date Dec 29, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR SUPPORTING ULTRA-THIN SEMICONDU...
- Publication number 20220262633
- Publication date Aug 18, 2022
- Semiconductor Components Industries, LLC
- Gordon M. GRIVNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER
- Publication number 20220208637
- Publication date Jun 30, 2022
- Semiconductor Components Industries, LLC
- Liangbiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20220084920
- Publication date Mar 17, 2022
- Semiconductor Components Industries, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER
- Publication number 20210249329
- Publication date Aug 12, 2021
- Semiconductor Components Industries, LLC
- Liangbiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20210035956
- Publication date Feb 4, 2021
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20210035892
- Publication date Feb 4, 2021
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR SUPPORTING ULTRA-THIN SEMICONDU...
- Publication number 20200258739
- Publication date Aug 13, 2020
- Semiconductor Components Industries, LLC
- Gordon M. GRIVNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE FOR GALLIUM NITRIDE DEVICES
- Publication number 20200168529
- Publication date May 28, 2020
- Semiconductor Components Industries, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20190385939
- Publication date Dec 19, 2019
- Semiconductor Components Industries, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20190326202
- Publication date Oct 24, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR SUPPORTING ULTRA-THIN SEMICONDU...
- Publication number 20190035687
- Publication date Jan 31, 2019
- Semiconductor Components Industries, LLC
- Gordon M. GRIVNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR SUPPORTING ULTRA-THIN SEMICONDU...
- Publication number 20180254217
- Publication date Sep 6, 2018
- Semiconductor Components Industries, LLC
- Gordon M. GRIVNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20180138109
- Publication date May 17, 2018
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS
- Publication number 20180096925
- Publication date Apr 5, 2018
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLES AND DIMPLES TO CONTROL SOLDER FLOW
- Publication number 20180053712
- Publication date Feb 22, 2018
- Semiconductor Components Industries, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20170141017
- Publication date May 18, 2017
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS
- Publication number 20170110391
- Publication date Apr 20, 2017
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALF-BRIDGE HEMT CIRCUIT AND AN ELECTRONIC PACKAGE INCLUDING THE CI...
- Publication number 20160322969
- Publication date Nov 3, 2016
- Semiconductor Components Industries, LLC
- Balaji PADMANABHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20160315032
- Publication date Oct 27, 2016
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR A LATERAL DEVICE AND RELATED METHODS
- Publication number 20160276250
- Publication date Sep 22, 2016
- Semiconductor Components Industries, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS

Stephen St. Germain

Person

Patents Grantslast 30 patents

Semiconductor package structures and methods of manufacture

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Semiconductor device and method for supporting ultra-thin semicondu...

Structure and method related to a power module using a hybrid spacer

Semiconductor package structures and methods of manufacture

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Semiconductor device and method for supporting ultra-thin semicondu...

Structure and method related to a power module using a hybrid spacer

Semiconductor package structures and methods of manufacture

Packaging structure for gallium nitride devices

Semiconductor device and method for supporting ultra-thin semicondu...

Single or multi chip module package and related methods

Semiconductor devices and methods of making the same

Semiconductor devices and methods of making the same

Semiconductor device and method for supporting ultra-thin semicondu...

Holes and dimples to control solder flow

Single or multi chip module package and related methods

Half-bridge HEMT circuit and an electronic package including the ci...

Semiconductor package for a lateral device and related methods

Semiconductor devices and methods of making the same

Single or multi chip module package and related methods

Semiconductor devices and methods of making the same

Semiconductor package for a lateral device and related methods

Semiconductor devices and methods of making the same

Semiconductor package

Multi-chip semiconductor connector

Patents Applicationslast 30 patents

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR SUPPORTING ULTRA-THIN SEMICONDU...

STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE

STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR SUPPORTING ULTRA-THIN SEMICONDU...

PACKAGING STRUCTURE FOR GALLIUM NITRIDE DEVICES

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR SUPPORTING ULTRA-THIN SEMICONDU...

SEMICONDUCTOR DEVICE AND METHOD FOR SUPPORTING ULTRA-THIN SEMICONDU...

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS

HOLES AND DIMPLES TO CONTROL SOLDER FLOW

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS

HALF-BRIDGE HEMT CIRCUIT AND AN ELECTRONIC PACKAGE INCLUDING THE CI...

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR PACKAGE FOR A LATERAL DEVICE AND RELATED METHODS