Stephen W. MacQuarrie

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optimization of electronic package geometry for thermal dissipation
- Patent number 7,737,550
- Issue date Jun 15, 2010
- International Business Machines Corporation
- Stephen W. MacQuarrie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective C4 connection in IC packaging
- Patent number 6,650,016
- Issue date Nov 18, 2003
- International Business Machines Corporation
- Stephen W. MacQuarrie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of a metalized blind via
- Patent number 6,576,549
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of a metalized blind via
- Patent number 6,522,014
- Issue date Feb 18, 2003
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of producing plastic pin grid array
- Patent number 6,438,830
- Issue date Aug 27, 2002
- International Business Machines Corporation
- Eric P. Dibble
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integral design features for heatsink attach for electronic packages
- Patent number 6,373,703
- Issue date Apr 16, 2002
- International Business Machines Corporation
- Eric Arthur Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced heat-dissipating printed circuit board package
- Patent number 6,212,076
- Issue date Apr 3, 2001
- International Business Machines Corporation
- Stephen W. MacQuarrie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal substrate having an IC chip and carrier mounting
- Patent number 6,150,716
- Issue date Nov 21, 2000
- International Business Machines Corporation
- Stephen Wesley MacQuarrie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal substrate having an IC chip and carrier mounting
- Patent number 6,131,278
- Issue date Oct 17, 2000
- International Business Machines Corporation
- Stephen W. MacQuarrie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making interconnections between a multi-layer chip stack...
- Patent number 6,107,121
- Issue date Aug 22, 2000
- International Business Machines Corporation
- Steven Joel Diffenderfer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integral design features for heatsink attach for electronic packages
- Patent number 5,969,947
- Issue date Oct 19, 1999
- International Business Machines Corporation
- Eric Arthur Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin attach structure for an electronic package
- Patent number 5,952,716
- Issue date Sep 14, 1999
- International Business Machines Corporation
- Eric P. Dibble
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including a thick integrated circuit c...
- Patent number 5,872,397
- Issue date Feb 16, 1999
- International Business Machines Corporation
- Steven Joel Diffenderfer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTIMIZATION OF ELECTRONIC PACKAGE GEOMETRY FOR THERMAL DISSIPATION
- Publication number 20090059537
- Publication date Mar 5, 2009
- International Business Machines Corporation
- Stephen W. MacQuarrie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication of a metalized blind via
- Publication number 20030054635
- Publication date Mar 20, 2003
- Frank D. Egitto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integral design features for heatsink attach for electronic packages
- Publication number 20010005312
- Publication date Jun 28, 2001
- Eric Arthur Johnson
- H01 - BASIC ELECTRIC ELEMENTS

Stephen W. MacQuarrie

Person

Patents Grantslast 30 patents

Optimization of electronic package geometry for thermal dissipation

Selective C4 connection in IC packaging

Fabrication of a metalized blind via

Fabrication of a metalized blind via

Process of producing plastic pin grid array

Integral design features for heatsink attach for electronic packages

Enhanced heat-dissipating printed circuit board package

Metal substrate having an IC chip and carrier mounting

Metal substrate having an IC chip and carrier mounting

Method of making interconnections between a multi-layer chip stack...

Integral design features for heatsink attach for electronic packages

Pin attach structure for an electronic package

Semiconductor device package including a thick integrated circuit c...

Patents Applicationslast 30 patents

OPTIMIZATION OF ELECTRONIC PACKAGE GEOMETRY FOR THERMAL DISSIPATION

Fabrication of a metalized blind via

Integral design features for heatsink attach for electronic packages