Steve Greathouse

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Nampa, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
MEMS packaging using a non-silicon substrate for encapsulation and...
- Patent number 7,368,808
- Issue date May 6, 2008
- Intel Corporation
- John Heck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level packaging of electronic devices before singulation
- Patent number 6,867,060
- Issue date Mar 15, 2005
- Intel Corporation
- Steve Greathouse
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Paper substrates for use in integrated circuit packaging molding pr...
- Patent number 6,436,318
- Issue date Aug 20, 2002
- Intel Corporation
- Jonathan L. McFarland
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH INTEGRATED MAGNETS FOR ELECTROMAGNETICALLY-ACTUATED PR...
- Publication number 20100039729
- Publication date Feb 18, 2010
- Nanochip, Inc.
- John Heck
- G11 - INFORMATION STORAGE
Information Patent Application
MEMS packaging using a non-silicon substrate for encapsulation and...
- Publication number 20060194361
- Publication date Aug 31, 2006
- John Heck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer-level packaging of electronic devices before singulation
- Publication number 20040099917
- Publication date May 27, 2004
- Steve Greathouse
- B81 - MICRO-STRUCTURAL TECHNOLOGY