Steve Nagel

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Chandler, AZ, US

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Patents Applicationslast 30 patents

Information Patent Application
HYBRID SEMICONDUCTOR WAFER AND METHOD OF FORMING
- Publication number 20250112035
- Publication date Apr 3, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Steve Nagel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH LINES HAVING PORTIONS SEPARATED BY BARRIER LAYERS
- Publication number 20240321760
- Publication date Sep 26, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Steve Nagel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A PATTERNED FD-SOI WAFER
- Publication number 20240170325
- Publication date May 23, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Steve Nagel
- H01 - BASIC ELECTRIC ELEMENTS