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Steve Whitehead
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Shefford, CA
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last 30 patents
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Patent Grant
High-density chip-to-chip interconnection with silicon bridge
Patent number
10,784,202
Issue date
Sep 22, 2020
International Business Machines Corporation
Francois Arguin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser ashing of polyimide for semiconductor manufacturing
Patent number
9,865,564
Issue date
Jan 9, 2018
GLOBALFOUNDRIES Inc.
Maxime Cadotte
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Temporary liquid thermal interface material for surface tension adh...
Patent number
9,269,603
Issue date
Feb 23, 2016
GLOBALFOUNDRIES Inc.
Luc Guerin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser ashing of polyimide for semiconductor manufacturing
Patent number
8,999,107
Issue date
Apr 7, 2015
International Business Machines Corporation
Maxime Cadotte
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
HIGH-DENSITY CHIP-TO-CHIP INTERCONNECTION WITH SILICON BRIDGE
Publication number
20190172787
Publication date
Jun 6, 2019
International Business Machines Corporation
Francois Arguin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING
Publication number
20150162300
Publication date
Jun 11, 2015
International Business Machines Corporation
Maxime Cadotte
B32 - LAYERED PRODUCTS
Information
Patent Application
TEMPORARY LIQUID THERMAL INTERFACE MATERIAL FOR SURFACE TENSION ADH...
Publication number
20140332810
Publication date
Nov 13, 2014
International Business Machines Corporation
Luc GUERIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING
Publication number
20120111496
Publication date
May 10, 2012
International Business Machines Corporation
Maxime Cadotte
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR