Steven Alfred KUMMERL

Person

Carrollton, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with shunt and patterned metal trace
- Patent number 12,211,800
- Issue date Jan 28, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating die package
- Patent number 12,176,298
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving transistor performance
- Patent number 12,087,859
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Steven Kummerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Custom leadframe from standard plus printed leadframe portion
- Patent number 12,080,633
- Issue date Sep 3, 2024
- Texas Instruments Incorporated
- Jo Bito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical couplings designed to resolve process constraints
- Patent number 12,040,197
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film covers for sensor packages
- Patent number 11,972,994
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip with a vertical connector
- Patent number 11,854,947
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed heat-generating devices
- Patent number 11,742,265
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Hung-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with multiple exposed pads
- Patent number 11,735,506
- Issue date Aug 22, 2023
- Texas Instruments Incorporated
- Hung-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film covers for sensor packages
- Patent number 11,658,083
- Issue date May 23, 2023
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shape memory polymer for use in semiconductor device fabrication
- Patent number 11,551,986
- Issue date Jan 10, 2023
- Texas Instruments Incorporated
- Steven Alfred Kummerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermistor die-based thermal probe
- Patent number 11,525,739
- Issue date Dec 13, 2022
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric sensor apparatus
- Patent number 11,487,381
- Issue date Nov 1, 2022
- Texas Instruments Incorporated
- Wei-Yan Shih
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices and methods and apparatus to produce such sem...
- Patent number 11,296,016
- Issue date Apr 5, 2022
- Texas Instruments Incorporated
- Robert Allan Neidorff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated inductor with magnetic mold compound
- Patent number 11,270,937
- Issue date Mar 8, 2022
- Texas Instruments Incorporated
- Dongbin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolator integrated circuits with package structure cavity and fabr...
- Patent number 11,264,369
- Issue date Mar 1, 2022
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with three dimensional thermal pad
- Patent number 11,081,428
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- Stanley Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standoff connector for electrical devices
- Patent number 10,887,993
- Issue date Jan 5, 2021
- Texas Instruments Incorporated
- Steven Kummerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating die package
- Patent number 10,861,796
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip with a vertical connector
- Patent number 10,804,185
- Issue date Oct 13, 2020
- Texas Instruments Incorporated
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolator integrated circuits with package structure cavity and fabr...
- Patent number 10,636,778
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Barry Jon Male
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Self-assembly of semiconductor die onto a leadframe using magnetic...
- Patent number 10,553,573
- Issue date Feb 4, 2020
- Texas Instruments Incorporated
- Daniel Lee Revier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with extruded feed-through vias
- Patent number 10,535,594
- Issue date Jan 14, 2020
- Texas Instruments Incorporated
- Steven Kummerl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for improving transistor performance
- Patent number 10,431,684
- Issue date Oct 1, 2019
- Texas Instruments Incorporated
- Steven Kummerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit wave device and method
- Patent number 10,424,551
- Issue date Sep 24, 2019
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated force sensing element
- Patent number 10,353,503
- Issue date Jul 16, 2019
- Texas Instruments Incorporated
- Wei-Yan Shih
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mechanical couplings designed to resolve process constraints
- Patent number 10,340,152
- Issue date Jul 2, 2019
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic sensors with sensor die in package structure cavity
- Patent number 10,179,730
- Issue date Jan 15, 2019
- Texas Instruments Incorporated
- Barry Jon Male
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Isolator integrated circuits with package structure cavity and fabr...
- Patent number 10,074,639
- Issue date Sep 11, 2018
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit wave device and method
- Patent number 9,929,110
- Issue date Mar 27, 2018
- Texas Instruments Incorporated
- Barry Jon Male
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
WIREBOND ELECTROPLATING STRUCTURE FOR FULL CUT WETTABLE FLANK STRUC...
- Publication number 20250046683
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- STEVEN KUMMERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL FILTERING FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20250006870
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Steven KUMMERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LDMOS NANOSHEET TRANSISTOR
- Publication number 20240413239
- Publication date Dec 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Henry Litzmann Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUSTOM LEADFRAME FROM STANDARD PLUS PRINTED LEADFRAME PORTION
- Publication number 20240413058
- Publication date Dec 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- JO BITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN CAVITY INTEGRATED CIRCUIT
- Publication number 20240178085
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- STEVEN ALFRED KUMMERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH MULTIPLE EXPOSED PADS
- Publication number 20230395472
- Publication date Dec 7, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Hung-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM COVERS FOR SENSOR PACKAGES
- Publication number 20230253277
- Publication date Aug 10, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS LASER MODIFIED MOLD CAP PACKAGE
- Publication number 20230207410
- Publication date Jun 29, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Steven Alfred Kummerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPE MEMORY POLYMER FOR USE IN SEMICONDUCTOR DEVICE FABRICATION
- Publication number 20230093214
- Publication date Mar 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Steven Alfred KUMMERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DRILLED MOLD CAVITY
- Publication number 20220415762
- Publication date Dec 29, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE
- Publication number 20220384353
- Publication date Dec 1, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM COVERS FOR SENSOR PACKAGES
- Publication number 20220181224
- Publication date Jun 9, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS
- Publication number 20210375640
- Publication date Dec 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPE MEMORY POLYMER FOR USE IN SEMICONDUCTOR DEVICE FABRICATION
- Publication number 20210313241
- Publication date Oct 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Steven Alfred KUMMERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED HEAT-GENERATING DEVICES
- Publication number 20210118779
- Publication date Apr 22, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Hung-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOATING DIE PACKAGE
- Publication number 20210091012
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FILTER OPTICAL PACKAGE
- Publication number 20210050459
- Publication date Feb 18, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Steven Alfred Kummerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH THREE DIMENSIONAL THERMAL PAD
- Publication number 20210043548
- Publication date Feb 11, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Stanley Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP WITH A VERTICAL CONNECTOR
- Publication number 20210028093
- Publication date Jan 28, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR INTEGRATED CIRCUITS WITH PACKAGE STRUCTURE CAVITY AND FABR...
- Publication number 20200258874
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR WITH MAGNETIC MOLD COMPOUND
- Publication number 20200211959
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dongbin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUSTOM LEADFRAME FROM STANDARD PLUS PRINTED LEADFRAME PORTION
- Publication number 20200083147
- Publication date Mar 12, 2020
- TEXAS INSTRUMENTS INCORPORATED
- JO BITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVING TRANSISTOR PERFORMANCE
- Publication number 20200035833
- Publication date Jan 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Steven Kummerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH MULTIPLE EXPOSED PADS
- Publication number 20190355652
- Publication date Nov 21, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Hung-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMISTOR DIE-BASED THERMAL PROBE
- Publication number 20190346312
- Publication date Nov 14, 2019
- TEXAS INSTRUMENTS INCORPORATED
- MATTHEW DAVID ROMIG
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED FORCE SENSING ELEMENT
- Publication number 20190339806
- Publication date Nov 7, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Wei-Yan Shih
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS
- Publication number 20190326131
- Publication date Oct 24, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS
- Publication number 20190206699
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SENSORS WITH SENSOR DIE IN PACKAGE STRUCTURE CAVITY
- Publication number 20190144267
- Publication date May 16, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Barry Jon Male
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS AND APPARATUS TO PRODUCE SUCH SEM...
- Publication number 20190139868
- Publication date May 9, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Robert Allan Neidorff
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Steven Alfred KUMMERL

Person

Patents Grantslast 30 patents

Semiconductor package with shunt and patterned metal trace

Floating die package

Method for improving transistor performance

Custom leadframe from standard plus printed leadframe portion

Mechanical couplings designed to resolve process constraints

Film covers for sensor packages

Integrated circuit chip with a vertical connector

Exposed heat-generating devices

Packages with multiple exposed pads

Film covers for sensor packages

Shape memory polymer for use in semiconductor device fabrication

Thermistor die-based thermal probe

Piezoelectric sensor apparatus

Semiconductor devices and methods and apparatus to produce such sem...

Integrated inductor with magnetic mold compound

Isolator integrated circuits with package structure cavity and fabr...

Electronic device with three dimensional thermal pad

Standoff connector for electrical devices

Floating die package

Integrated circuit chip with a vertical connector

Isolator integrated circuits with package structure cavity and fabr...

Self-assembly of semiconductor die onto a leadframe using magnetic...

Interposer with extruded feed-through vias

Method for improving transistor performance

Integrated circuit wave device and method

Integrated force sensing element

Mechanical couplings designed to resolve process constraints

Electronic sensors with sensor die in package structure cavity

Isolator integrated circuits with package structure cavity and fabr...

Integrated circuit wave device and method

Patents Applicationslast 30 patents

WIREBOND ELECTROPLATING STRUCTURE FOR FULL CUT WETTABLE FLANK STRUC...

OPTICAL FILTERING FOR SEMICONDUCTOR DEVICE PACKAGING

LDMOS NANOSHEET TRANSISTOR

CUSTOM LEADFRAME FROM STANDARD PLUS PRINTED LEADFRAME PORTION

OPEN CAVITY INTEGRATED CIRCUIT

PACKAGES WITH MULTIPLE EXPOSED PADS

FILM COVERS FOR SENSOR PACKAGES

LOW STRESS LASER MODIFIED MOLD CAP PACKAGE

SHAPE MEMORY POLYMER FOR USE IN SEMICONDUCTOR DEVICE FABRICATION

SEMICONDUCTOR PACKAGE WITH DRILLED MOLD CAVITY

SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE

FILM COVERS FOR SENSOR PACKAGES

MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS

SHAPE MEMORY POLYMER FOR USE IN SEMICONDUCTOR DEVICE FABRICATION

EXPOSED HEAT-GENERATING DEVICES

FLOATING DIE PACKAGE

INTEGRATED FILTER OPTICAL PACKAGE

ELECTRONIC DEVICE WITH THREE DIMENSIONAL THERMAL PAD

INTEGRATED CIRCUIT CHIP WITH A VERTICAL CONNECTOR

ISOLATOR INTEGRATED CIRCUITS WITH PACKAGE STRUCTURE CAVITY AND FABR...

INTEGRATED INDUCTOR WITH MAGNETIC MOLD COMPOUND

CUSTOM LEADFRAME FROM STANDARD PLUS PRINTED LEADFRAME PORTION

METHOD FOR IMPROVING TRANSISTOR PERFORMANCE

PACKAGES WITH MULTIPLE EXPOSED PADS

THERMISTOR DIE-BASED THERMAL PROBE

INTEGRATED FORCE SENSING ELEMENT

MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS

MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS

ELECTRONIC SENSORS WITH SENSOR DIE IN PACKAGE STRUCTURE CAVITY

SEMICONDUCTOR DEVICES AND METHODS AND APPARATUS TO PRODUCE SUCH SEM...