TREA

Steven Frederick Reiber

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  • Sunnyvale, CA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Flip chip bonding tool tip
    • Patent number 7,389,905
    • Issue date Jun 24, 2008
    • Steven F. Reiber
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Flip chip bonding tool and ball placement capillary
    • Patent number 7,124,927
    • Issue date Oct 24, 2006
    • Steven F. Reiber
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding tool with resistance
    • Patent number 7,032,802
    • Issue date Apr 25, 2006
    • Steven F. Reiber
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Dissipative ceramic bonding tool tip
    • Patent number 6,935,548
    • Issue date Aug 30, 2005
    • Steven-Frederick Reiber
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Dissipative ceramic bonding tool tip
    • Patent number 6,651,864
    • Issue date Nov 25, 2003
    • Steven Frederick Reiber
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Dissipative ceramic bonding tip
    • Patent number 6,354,479
    • Issue date Mar 12, 2002
    • SJM Technologies
    • Steven Frederick Reiber
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Bonding Tool
    • Publication number 20080197172
    • Publication date Aug 21, 2008
    • Steven F. Reiber
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Solder ball placement system
    • Publication number 20070131661
    • Publication date Jun 14, 2007
    • Steven F. Reiber
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Dissipative pick and place tools for light wire and LED displays
    • Publication number 20070085085
    • Publication date Apr 19, 2007
    • Steven F. Reiber
    • F21 - LIGHTING
  • Information Patent Application

    Low range bonding tool
    • Publication number 20060261132
    • Publication date Nov 23, 2006
    • Steven F. Reiber
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-head tab bonding tool
    • Publication number 20060071050
    • Publication date Apr 6, 2006
    • Steven F. Reiber
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Flip chip bonding tool and ball placement capillary
    • Publication number 20050242155
    • Publication date Nov 3, 2005
    • Steven F. Reiber
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Flip chip bonding tool tip
    • Publication number 20050109817
    • Publication date May 26, 2005
    • Steven F. Reiber
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding tool with resistance
    • Publication number 20050109814
    • Publication date May 26, 2005
    • Steven F. Reiber
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Dissipative ceramic bonding tool tip
    • Publication number 20040046007
    • Publication date Mar 11, 2004
    • Steven-Frederick Reiber
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Dissipative ceramic bonding tool tip
    • Publication number 20020096551
    • Publication date Jul 25, 2002
    • Steven Frederick Reiber
    • H01 - BASIC ELECTRIC ELEMENTS