Steven H. Boettcher

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of TEM sample preparation for electron holography for semico...
- Patent number 7,560,692
- Issue date Jul 14, 2009
- International Business Machines Corporation
- Keith E. Barton
- G01 - MEASURING TESTING
Information Patent Grant
Electroplated copper interconnection structure, process for making...
- Patent number 7,227,265
- Issue date Jun 5, 2007
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission electron microscopy sample preparation method for elec...
- Patent number 7,214,935
- Issue date May 8, 2007
- International Business Machines Corporation
- Thomas A. Bauer
- G01 - MEASURING TESTING
Information Patent Grant
Structure comprising an interlayer of palladium and/or platinum and...
- Patent number 6,911,229
- Issue date Jun 28, 2005
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration-resistant copper microstructure
- Patent number 6,572,982
- Issue date Jun 3, 2003
- International Business Machines Corporation
- Cyprian E. Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for depositing copper onto a barrier layer
- Patent number 6,416,812
- Issue date Jul 9, 2002
- International Business Machines Corporation
- Panayotis Andricacos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper vias in low-k technology
- Patent number 6,383,929
- Issue date May 7, 2002
- International Business Machines Corporation
- Steven H. Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration-resistant copper microstructure and process of making
- Patent number 6,123,825
- Issue date Sep 26, 2000
- International Business Machines Corporation
- Cyprian E. Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE COMPRISING A BARRIER LAYER OF A TUNGSTEN ALLOY COMPRISING...
- Publication number 20080237053
- Publication date Oct 2, 2008
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF TEM SAMPLE PREPARATION FOR ELECTRON HOLOGRAPHY FOR SEMICO...
- Publication number 20080156987
- Publication date Jul 3, 2008
- International Business Machines Corporation
- Keith E. Barton
- G01 - MEASURING TESTING
Information Patent Application
TRANSMISSION ELECTRON MICROSCOPY SAMPLE PREPARATION METHOD FOR ELEC...
- Publication number 20060065830
- Publication date Mar 30, 2006
- International Business Machines Corporation
- Thomas A. Bauer
- G01 - MEASURING TESTING
Information Patent Application
Tungsten encapsulated copper interconnections using electroplating
- Publication number 20050269708
- Publication date Dec 8, 2005
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure comprising an interlayer of palladium and/or platinum and...
- Publication number 20050006777
- Publication date Jan 13, 2005
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroplated copper interconnection structure, process for making...
- Publication number 20040178078
- Publication date Sep 16, 2004
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplated copper interconnection structure, process for making...
- Publication number 20040178077
- Publication date Sep 16, 2004
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Structure comprising a barrier layer of a tungsten alloy comprising...
- Publication number 20040108136
- Publication date Jun 10, 2004
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Structure comprising an interlayer of palladium and/or platinum and...
- Publication number 20040028882
- Publication date Feb 12, 2004
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tungsten encapsulated copper interconnections using electroplating
- Publication number 20020092673
- Publication date Jul 18, 2002
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless metal liner formation methods
- Publication number 20020081842
- Publication date Jun 27, 2002
- Carlos J. Sambucetti
- H01 - BASIC ELECTRIC ELEMENTS

Steven H. Boettcher

Person

Patents Grantslast 30 patents

Method of TEM sample preparation for electron holography for semico...

Electroplated copper interconnection structure, process for making...

Transmission electron microscopy sample preparation method for elec...

Structure comprising an interlayer of palladium and/or platinum and...

Electromigration-resistant copper microstructure

Method for depositing copper onto a barrier layer

Copper vias in low-k technology

Electromigration-resistant copper microstructure and process of making

Patents Applicationslast 30 patents

STRUCTURE COMPRISING A BARRIER LAYER OF A TUNGSTEN ALLOY COMPRISING...

METHOD OF TEM SAMPLE PREPARATION FOR ELECTRON HOLOGRAPHY FOR SEMICO...

TRANSMISSION ELECTRON MICROSCOPY SAMPLE PREPARATION METHOD FOR ELEC...

Tungsten encapsulated copper interconnections using electroplating

Structure comprising an interlayer of palladium and/or platinum and...

Electroplated copper interconnection structure, process for making...

Electroplated copper interconnection structure, process for making...

Structure comprising a barrier layer of a tungsten alloy comprising...

Structure comprising an interlayer of palladium and/or platinum and...

Tungsten encapsulated copper interconnections using electroplating

Electroless metal liner formation methods