Steven H. C. Hsieh

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Cupertino, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package with plated heat spreader
- Patent number 9,559,036
- Issue date Jan 31, 2017
- Altera Corporation
- Steven Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid and method of employing a lid on an integrated circuit
- Patent number 7,429,501
- Issue date Sep 30, 2008
- Xilinx, Inc.
- Paul Ying-Fung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and circuits for measuring the thermal resistance of a pack...
- Patent number 7,257,511
- Issue date Aug 14, 2007
- Xilinx, Inc.
- Steven H. C. Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid and method of employing a lid on an integrated circuit
- Patent number 7,012,326
- Issue date Mar 14, 2006
- Xilinx, Inc.
- Paul Ying-Fung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for isolating critical paths on an IC device...
- Patent number 6,895,566
- Issue date May 17, 2005
- Xilinx, Inc.
- Siuki Chan
- G01 - MEASURING TESTING
Information Patent Grant
Methods and circuits for measuring the thermal resistance of a pack...
- Patent number 6,847,010
- Issue date Jan 25, 2005
- Xilinx, Inc.
- Steven H. C. Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and assembly for testing solder joint fractures between inte...
- Patent number 6,564,986
- Issue date May 20, 2003
- Xilinx, Inc.
- Steven H. C. Hsieh
- G01 - MEASURING TESTING