Steven H. Johnston

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chemical oxide removal of plasma damaged SiCOH low k dielectrics
- Patent number 8,106,485
- Issue date Jan 31, 2012
- International Business Machines Corporation
- William G. America
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for treating wafer edge region with toroidal p...
- Patent number 7,404,874
- Issue date Jul 29, 2008
- International Business Machines Corporation
- William George America
- B08 - CLEANING
Information Patent Grant
Chemical oxide removal of plasma damaged SiCOH low k dielectrics
- Patent number 7,368,393
- Issue date May 6, 2008
- International Business Machines Corporation
- William G. America
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated dual damascene RIE process with organic patterning layer
- Patent number 7,129,159
- Issue date Oct 31, 2006
- International Business Machines Corporation
- William G. America
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL OXIDE REMOVAL OF PLASMA DAMAGED SICOH LOW K DIELECTRICS
- Publication number 20080224273
- Publication date Sep 18, 2008
- International Business Machines Corporation
- William G. AMERICA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING UNWANTED FILM FROM WAFER EDGE REGION WITH REACTIVE GAS JET
- Publication number 20080210270
- Publication date Sep 4, 2008
- International Business Machines Corporation
- William George America
- B08 - CLEANING
Information Patent Application
REMOVING UNWANTED FILM FROM WAFER EDGE REGION WITH REACTIVE GAS JET
- Publication number 20080210269
- Publication date Sep 4, 2008
- International Business Machines Corporation
- William George America
- B08 - CLEANING
Information Patent Application
CHEMICAL OXIDE REMOVAL OF PLASMA DAMAGED SICOH LOW K DIELECTRICS
- Publication number 20070246442
- Publication date Oct 25, 2007
- International Business Machines Corporation
- William G. America
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated dual damascene RIE process with organic patterning layer
- Publication number 20060040501
- Publication date Feb 23, 2006
- William G. America
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING UNWANTED FILM FROM WAFER EDGE REGION WITH REACTIVE GAS JET
- Publication number 20050284568
- Publication date Dec 29, 2005
- International Business Machines Corporation
- William George America
- B08 - CLEANING
Information Patent Application
METHOD AND APPARATUS FOR TREATING WAFER EDGE REGION WITH TOROIDAL P...
- Publication number 20050284576
- Publication date Dec 29, 2005
- International Business Machines Corporation
- William George America
- B08 - CLEANING

Steven H. Johnston

Person

Patents Grantslast 30 patents

Chemical oxide removal of plasma damaged SiCOH low k dielectrics

Method and apparatus for treating wafer edge region with toroidal p...

Chemical oxide removal of plasma damaged SiCOH low k dielectrics

Integrated dual damascene RIE process with organic patterning layer

Patents Applicationslast 30 patents

CHEMICAL OXIDE REMOVAL OF PLASMA DAMAGED SICOH LOW K DIELECTRICS

REMOVING UNWANTED FILM FROM WAFER EDGE REGION WITH REACTIVE GAS JET

REMOVING UNWANTED FILM FROM WAFER EDGE REGION WITH REACTIVE GAS JET

CHEMICAL OXIDE REMOVAL OF PLASMA DAMAGED SICOH LOW K DIELECTRICS

Integrated dual damascene RIE process with organic patterning layer

REMOVING UNWANTED FILM FROM WAFER EDGE REGION WITH REACTIVE GAS JET

METHOD AND APPARATUS FOR TREATING WAFER EDGE REGION WITH TOROIDAL P...