Steven Howard Voldman

Person

Burlington, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structure and method of latchup robustness with placement of throug...
- Patent number 10,978,452
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Phillip F. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of latchup robustness with placement of throug...
- Patent number 10,170,476
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Phillip F. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of latchup robustness with placement of throug...
- Patent number 9,842,838
- Issue date Dec 12, 2017
- International Business Machines Corporation
- Phillip F. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of latchup robustness with placement of throug...
- Patent number 9,397,010
- Issue date Jul 19, 2016
- International Business Machines Corporation
- Phillip F. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of latchup robustness with placement of throug...
- Patent number 9,275,997
- Issue date Mar 1, 2016
- International Business Machines Corporation
- Phillip F. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Si and SiGeC on a buried oxide layer on a substrate
- Patent number 9,087,925
- Issue date Jul 21, 2015
- International Business Machines Corporation
- Xuefeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, structure and method of latch-up immunity for high and l...
- Patent number 8,994,026
- Issue date Mar 31, 2015
- International Business Machines Corporation
- Steven H. Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, structure and method of latch-up immunity for high and l...
- Patent number 8,963,158
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Steven H. Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD network circuit with a through wafer via structure and a method...
- Patent number 8,962,480
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Steven H. Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral diffusion field effect transistor with drain region self-al...
- Patent number 8,946,013
- Issue date Feb 3, 2015
- International Business Machines Corporation
- Natalie B. Feilchenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal matching in semiconductor devices using heat distribution s...
- Patent number 8,859,337
- Issue date Oct 14, 2014
- Soitec
- Stephen J Gaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of latchup robustness with placement of throug...
- Patent number 8,853,789
- Issue date Oct 7, 2014
- International Business Machines Corporation
- Phillip F. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated epitaxial modulation device
- Patent number 8,847,317
- Issue date Sep 30, 2014
- TriQuint Semiconductor, Inc.
- Yu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, structure and method of latch-up immunity for high and l...
- Patent number 8,519,402
- Issue date Aug 27, 2013
- International Business Machines Corporation
- Steven H. Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for buried inductors for ultra-high resistivit...
- Patent number 8,487,379
- Issue date Jul 16, 2013
- International Business Machines Corporation
- Max G. Levy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of designing semiconductor struc...
- Patent number 8,423,936
- Issue date Apr 16, 2013
- International Business Machines Corporation
- Steven H. Voldman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structure and method of latchup robustness with placement of throug...
- Patent number 8,420,518
- Issue date Apr 16, 2013
- International Business Machines Corporation
- Phillip F. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures with silicon germanium film incorpora...
- Patent number 8,410,534
- Issue date Apr 2, 2013
- International Business Machines Corporation
- Steven H. Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for latchup improvement using through wafer vi...
- Patent number 8,390,074
- Issue date Mar 5, 2013
- International Business Machines Corporation
- Steven H. Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated epitaxial modulation device
- Patent number 8,362,564
- Issue date Jan 29, 2013
- Intersil Americas Inc.
- Yu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized scheduling based on sensitivity data
- Patent number 8,301,288
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Brian T. Denton
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
ESD network circuit with a through wafer via structure and a method...
- Patent number 8,232,625
- Issue date Jul 31, 2012
- International Business Machines Corporation
- Steven H. Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of multiple gate oxides with shallow trench isolation m...
- Patent number 8,227,318
- Issue date Jul 24, 2012
- International Business Machines Corporation
- Max Levy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power device isolation and integration
- Patent number 8,193,563
- Issue date Jun 5, 2012
- International Business Machines Corporation
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for buried inductors for ultra-high resistivit...
- Patent number 8,188,570
- Issue date May 29, 2012
- International Business Machines Corporation
- Max G. Levy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor diode structure operation method
- Patent number 8,178,925
- Issue date May 15, 2012
- International Business Machines Corporation
- Steven Howard Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure incorporating an inductor, an associat...
- Patent number 8,171,435
- Issue date May 1, 2012
- International Business Machines Corporation
- Zhong-Xiang He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lateral trench FETs (field effect transistors)
- Patent number 8,143,671
- Issue date Mar 27, 2012
- International Business Machines Corporation
- Steven Howard Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods of forming SiGe and SiGeC buried layer for S...
- Patent number 8,138,579
- Issue date Mar 20, 2012
- International Business Machines Corporation
- Xuefeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures with silicon germanium film incorpora...
- Patent number 8,129,772
- Issue date Mar 6, 2012
- International Business Machines Corporation
- Steven H. Voldman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...
- Publication number 20190081046
- Publication date Mar 14, 2019
- International Business Machines Corporation
- Phillip F. CHAPMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...
- Publication number 20180040619
- Publication date Feb 8, 2018
- International Business Machines Corporation
- Phillip F. CHAPMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...
- Publication number 20160268258
- Publication date Sep 15, 2016
- International Business Machines Corporation
- Phillip F. CHAPMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...
- Publication number 20160126147
- Publication date May 5, 2016
- International Business Machines Corporation
- Phillip F. CHAPMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...
- Publication number 20140367792
- Publication date Dec 18, 2014
- Phillip F. CHAPMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN STRUCTURE, STRUCTURE AND METHOD OF LATCH-UP IMMUNITY FOR HIG...
- Publication number 20130299915
- Publication date Nov 14, 2013
- Steven H. Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN STRUCTURE, STRUCTURE AND METHOD OF LATCH-UP IMMUNITY FOR HIG...
- Publication number 20130168818
- Publication date Jul 4, 2013
- International Business Machines Corporation
- Steven H. Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...
- Publication number 20130154024
- Publication date Jun 20, 2013
- International Business Machines Corporation
- Phillip F. CHAPMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED EPITAXIAL MODULATION DEVICE
- Publication number 20130154008
- Publication date Jun 20, 2013
- Intersil Americas Inc.
- Yu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESD NETWORK CIRCUIT WITH A THROUGH WAFER VIA STRUCTURE AND A METHOD...
- Publication number 20120238069
- Publication date Sep 20, 2012
- International Business Machines Corporation
- Steven H. Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR BURIED INDUCTORS FOR ULTRA-HIGH RESISTIVIT...
- Publication number 20120205741
- Publication date Aug 16, 2012
- International Business Machines Corporation
- Max G. LEVY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH SILICON GERMANIUM FILM INCORPORA...
- Publication number 20120132974
- Publication date May 31, 2012
- International Business Machines Corporation
- Steven H. Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL DIFFUSION FIELD EFFECT TRANSISTOR WITH DRAIN REGION SELF-AL...
- Publication number 20120126319
- Publication date May 24, 2012
- International Business Machines Corporation
- Natalie B. Feilchenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF DESIGNING SEMICONDUCTOR STRUC...
- Publication number 20120124533
- Publication date May 17, 2012
- International Business Machines Corporation
- Steven H. Voldman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ISOLATED EPITAXIAL MODULATION DEVICE
- Publication number 20120044732
- Publication date Feb 23, 2012
- Intersil Americas Inc.
- Yu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS OF FORMING SIGE AND SIGEC BURIED LAYER FOR S...
- Publication number 20110227130
- Publication date Sep 22, 2011
- International Business Machines Corporation
- Xuefeng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR LATCHUP IMPROVEMENT USING THROUGH WAFER VI...
- Publication number 20110227166
- Publication date Sep 22, 2011
- International Business Machines Corporation
- Steven H. Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...
- Publication number 20110198703
- Publication date Aug 18, 2011
- International Business Machines Corporation
- Phillip F. CHAPMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MATCHING IN SEMICONDUCTOR DEVICES USING HEAT DISTRIBUTION S...
- Publication number 20110141696
- Publication date Jun 16, 2011
- Intersil Americas Inc.
- Stephen J. Gaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration of Multiple Gate Oxides with Shallow Trench Isolation M...
- Publication number 20110117714
- Publication date May 19, 2011
- International Business Machines Corporation
- Max Levy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING ESD DEVICES USING MOSFET AND LDMOS ION IMPLAN...
- Publication number 20110039378
- Publication date Feb 17, 2011
- International Business Machines Corporation
- Steven Howard Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN STRUCTURE AND METHOD FOR BURIED INDUCTORS FOR ULTRA-HIGH RES...
- Publication number 20100327398
- Publication date Dec 30, 2010
- International Business Machines Corporation
- Max G. LEVY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrostatic Discharge Structures and Methods of Manufacture
- Publication number 20100321842
- Publication date Dec 23, 2010
- International Business Machines Corporation
- Ephrem G. GEBRESELASIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH SILICON GERMANIUM FILM INCORPORA...
- Publication number 20100244112
- Publication date Sep 30, 2010
- STEVEN H VOLDMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESD NETWORK CIRCUIT WITH A THROUGH WAFER VIA STRUCTURE AND A METHOD...
- Publication number 20100244187
- Publication date Sep 30, 2010
- International Business Machines Corporation
- Steven H. Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR LATCHUP IMPROVEMENT USING THROUGH WAFER VI...
- Publication number 20100244179
- Publication date Sep 30, 2010
- International Business Machines Corporation
- Steven H. Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER DEVICE ISOLATION AND INTEGRATION
- Publication number 20100207233
- Publication date Aug 19, 2010
- International Business Machines Corporation
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIODE STRUCTURE OPERATION METHOD
- Publication number 20100202091
- Publication date Aug 12, 2010
- International Business Machines Corporation
- Steven Howard Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20100171148
- Publication date Jul 8, 2010
- International Business Machines Corporation
- Xuefeng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE INCORPORATING AN INDUCTOR, AN ASSOCIAT...
- Publication number 20100175035
- Publication date Jul 8, 2010
- International Business Machines Corporation
- Zhong-Xiang He
- G06 - COMPUTING CALCULATING COUNTING

Steven Howard Voldman

Person

Patents Grantslast 30 patents

Structure and method of latchup robustness with placement of throug...

Structure and method of latchup robustness with placement of throug...

Structure and method of latchup robustness with placement of throug...

Structure and method of latchup robustness with placement of throug...

Structure and method of latchup robustness with placement of throug...

Si and SiGeC on a buried oxide layer on a substrate

Structure, structure and method of latch-up immunity for high and l...

Structure, structure and method of latch-up immunity for high and l...

ESD network circuit with a through wafer via structure and a method...

Lateral diffusion field effect transistor with drain region self-al...

Thermal matching in semiconductor devices using heat distribution s...

Structure and method of latchup robustness with placement of throug...

Isolated epitaxial modulation device

Structure, structure and method of latch-up immunity for high and l...

Structure and method for buried inductors for ultra-high resistivit...

Semiconductor structure and method of designing semiconductor struc...

Structure and method of latchup robustness with placement of throug...

Integrated circuit structures with silicon germanium film incorpora...

Structure and method for latchup improvement using through wafer vi...

Isolated epitaxial modulation device

Optimized scheduling based on sensitivity data

ESD network circuit with a through wafer via structure and a method...

Integration of multiple gate oxides with shallow trench isolation m...

High power device isolation and integration

Structure and method for buried inductors for ultra-high resistivit...

Semiconductor diode structure operation method

Integrated circuit structure incorporating an inductor, an associat...

Lateral trench FETs (field effect transistors)

Structures and methods of forming SiGe and SiGeC buried layer for S...

Integrated circuit structures with silicon germanium film incorpora...

Patents Applicationslast 30 patents

STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...

STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...

STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...

STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...

STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...

DESIGN STRUCTURE, STRUCTURE AND METHOD OF LATCH-UP IMMUNITY FOR HIG...

DESIGN STRUCTURE, STRUCTURE AND METHOD OF LATCH-UP IMMUNITY FOR HIG...

STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...

ISOLATED EPITAXIAL MODULATION DEVICE

ESD NETWORK CIRCUIT WITH A THROUGH WAFER VIA STRUCTURE AND A METHOD...

STRUCTURE AND METHOD FOR BURIED INDUCTORS FOR ULTRA-HIGH RESISTIVIT...

INTEGRATED CIRCUIT STRUCTURES WITH SILICON GERMANIUM FILM INCORPORA...

LATERAL DIFFUSION FIELD EFFECT TRANSISTOR WITH DRAIN REGION SELF-AL...

SEMICONDUCTOR STRUCTURE AND METHOD OF DESIGNING SEMICONDUCTOR STRUC...

ISOLATED EPITAXIAL MODULATION DEVICE

STRUCTURES AND METHODS OF FORMING SIGE AND SIGEC BURIED LAYER FOR S...

STRUCTURE AND METHOD FOR LATCHUP IMPROVEMENT USING THROUGH WAFER VI...

STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUG...

THERMAL MATCHING IN SEMICONDUCTOR DEVICES USING HEAT DISTRIBUTION S...

Integration of Multiple Gate Oxides with Shallow Trench Isolation M...

METHOD OF FABRICATING ESD DEVICES USING MOSFET AND LDMOS ION IMPLAN...

DESIGN STRUCTURE AND METHOD FOR BURIED INDUCTORS FOR ULTRA-HIGH RES...

Electrostatic Discharge Structures and Methods of Manufacture

INTEGRATED CIRCUIT STRUCTURES WITH SILICON GERMANIUM FILM INCORPORA...

ESD NETWORK CIRCUIT WITH A THROUGH WAFER VIA STRUCTURE AND A METHOD...

STRUCTURE AND METHOD FOR LATCHUP IMPROVEMENT USING THROUGH WAFER VI...

HIGH POWER DEVICE ISOLATION AND INTEGRATION

SEMICONDUCTOR DIODE STRUCTURE OPERATION METHOD

SEMICONDUCTOR DEVICES

INTEGRATED CIRCUIT STRUCTURE INCORPORATING AN INDUCTOR, AN ASSOCIAT...