Steven Hsu

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Chung-Ho City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Enhanced reliability of wafer-level chip-scale packaging (WLCSP) di...
- Patent number 7,838,424
- Issue date Nov 23, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tjandra Winata Karta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball-mounting method for coplanarity improvement in large package
- Patent number 7,642,129
- Issue date Jan 5, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jimmy Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Enhanced Reliability of Wafer-Level Chip-Scale Packaging (WLCSP) Di...
- Publication number 20090011543
- Publication date Jan 8, 2009
- Tjandra Winata Karta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel substrate design for semiconductor device
- Publication number 20080246147
- Publication date Oct 9, 2008
- Chao-Yuan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball-mounting method for coplanarity improvement in large package
- Publication number 20080160671
- Publication date Jul 3, 2008
- Jimmy Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR