Steven J. Duda

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Underhill Center, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
Techniques for improving bond pad performance
- Patent number 8,524,596
- Issue date Sep 3, 2013
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer probe interface arrangement with nonresilient probe elements...
- Patent number 6,426,636
- Issue date Jul 30, 2002
- International Business Machines Corporation
- Gobinda Das
- G01 - MEASURING TESTING
Information Patent Grant
Off-axis contact tip and dense packing design for a fine pitch probe
- Patent number 6,411,112
- Issue date Jun 25, 2002
- International Business Machines Corporation
- Gobinda Das
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Techniques for Improving Bond Pad Performance
- Publication number 20120279767
- Publication date Nov 8, 2012
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for improving bond pad performance
- Publication number 20060244138
- Publication date Nov 2, 2006
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS