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Steven J. Mass
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La Palma, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Direct write, high conductivity MMIC attach
Patent number
11,264,299
Issue date
Mar 1, 2022
Northrop Grumman Systems Corporation
Jesse Tice
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resilient micro lattice electrical interconnection assembly
Patent number
11,129,277
Issue date
Sep 21, 2021
Northrop Grumman Systems Corporation
Matthew J. Pirih
B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information
Patent Grant
Printed board antenna system
Patent number
11,075,456
Issue date
Jul 27, 2021
Northrop Grumman Systems Corporation
Kelly Jill T. Hennig
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a low mass foam electrical structure
Patent number
11,056,760
Issue date
Jul 6, 2021
Northrop Grumman Systems Corporation
Steven J. Mass
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Method of making a low mass foam electrical structure
Patent number
10,122,063
Issue date
Nov 6, 2018
Northrop Grumman Systems Corporation
Steven J. Mass
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resilient micro lattice electrical interconnection assembly
Patent number
10,104,773
Issue date
Oct 16, 2018
Northrop Grumman Systems Corporation
Matthew J. Pirih
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Antenna array using sandwiched radiating elements above a ground pl...
Patent number
9,502,780
Issue date
Nov 22, 2016
Northrop Grumman Systems Corporation
Loc B. Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RF transmission line disposed within a conductively plated cavity l...
Patent number
9,293,800
Issue date
Mar 22, 2016
Northrop Grumman Systems Corporation
Steven J. Mass
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Eutectic bonding of ultrathin semiconductors
Patent number
7,476,606
Issue date
Jan 13, 2009
Northrop Grumman Corporation
Dean Tran
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DIRECT WRITE, HIGH CONDUCTIVITY MMIC ATTACH
Publication number
20220068752
Publication date
Mar 3, 2022
Northrop Grumman Systems Corporation
Jesse Tice
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY
Publication number
20210368622
Publication date
Nov 25, 2021
Northrop Grumman Systems Corporation
Matthew J. Pirih
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MAKING A LOW MASS FOAM ELECTRICAL STRUCTURE
Publication number
20190081381
Publication date
Mar 14, 2019
Northrop Grumman Systems Corporation
Steven J. Mass
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY
Publication number
20180376595
Publication date
Dec 27, 2018
Northrop Grumman Systems Corporation
Matthew J. Pirih
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC TILE PACKAGING
Publication number
20180116052
Publication date
Apr 26, 2018
Northrop Grumman Systems Corporation
Steven J. Mass
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY
Publication number
20170215286
Publication date
Jul 27, 2017
Northrop Grumman Systems Corporation
Matthew J. Pirih
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ANTENNA ARRAY USING SANDWICHED RADIATING ELEMENTS ABOVE A GROUND PL...
Publication number
20160211585
Publication date
Jul 21, 2016
Northrop Grumman Systems Corporation
Loc B. Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MAKING A LOW MASS FOAM ELECTRICAL STRUCTURE
Publication number
20160149286
Publication date
May 26, 2016
Northrop Grumman Systems Corporation
Steven J. Mass
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW MASS FOAM ELECTRICAL STRUCTURE
Publication number
20120152454
Publication date
Jun 21, 2012
Steven J. Mass
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Eutectic bonding of ultrathin semiconductors
Publication number
20070235744
Publication date
Oct 11, 2007
Dean Tran
H01 - BASIC ELECTRIC ELEMENTS