Steven Joel Diffenderfer

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Deposit, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of making interconnections between a multi-layer chip stack...
- Patent number 6,107,121
- Issue date Aug 22, 2000
- International Business Machines Corporation
- Steven Joel Diffenderfer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including a thick integrated circuit c...
- Patent number 5,872,397
- Issue date Feb 16, 1999
- International Business Machines Corporation
- Steven Joel Diffenderfer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single layer leadframe design with groundplane capability
- Patent number 5,814,877
- Issue date Sep 29, 1998
- International Business Machines Corporation
- Steven Joel Diffenderfer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making single layer leadframe having groundplane capability
- Patent number 5,639,694
- Issue date Jun 17, 1997
- International Business Machines Corporation
- Steven Joel Diffenderfer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single layer leadframe design with groundplane capability
- Patent number 5,543,657
- Issue date Aug 6, 1996
- International Business Machines Corporation
- Steven J. Diffenderfer
- H01 - BASIC ELECTRIC ELEMENTS