Steven L. Wright

Person

Cortlandt Manor, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package with varying interconnects
- Patent number 12,183,702
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structures for high bandwidth data transfer
- Patent number 12,119,335
- Issue date Oct 15, 2024
- International Business Machines Corporation
- Joshua M Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transferrable pillar structure for fanout package or interconnect b...
- Patent number 11,587,896
- Issue date Feb 21, 2023
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package structures having embedded chip interconnect bri...
- Patent number 11,574,875
- Issue date Feb 7, 2023
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid delivery device with hydrophobic surface
- Patent number 11,534,585
- Issue date Dec 27, 2022
- International Business Machines Corporation
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package structures with discrete redistribution layers
- Patent number 11,164,817
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package structure having high density chip interconnect...
- Patent number 11,133,259
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package structures formed by joining chips to pre-positi...
- Patent number 11,114,410
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package structures having embedded chip interconnect bri...
- Patent number 11,094,637
- Issue date Aug 17, 2021
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microchip substance delivery devices
- Patent number 11,000,474
- Issue date May 11, 2021
- International Business Machines Corporation
- S. Jay Chey
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Drug delivery device having a cavity sealed by a pressurized membrane
- Patent number 10,940,265
- Issue date Mar 9, 2021
- International Business Machines Corporation
- Bing Dang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Delivery device including reactive material for programmable discre...
- Patent number 10,881,788
- Issue date Jan 5, 2021
- International Business Machines Corporation
- Bing Dang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Transdermal sensing probes and smart patch systems using same
- Patent number 10,638,945
- Issue date May 5, 2020
- International Business Machines Corporation
- Bing Dang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Integrated self-coining probe
- Patent number 10,585,119
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Yang Liu
- G01 - MEASURING TESTING
Information Patent Grant
Fluid delivery device with hydrophobic surface
- Patent number 10,508,755
- Issue date Dec 17, 2019
- International Business Machines Corporation
- Yang Liu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Device layer thin-film transfer to thermally conductive substrate
- Patent number 10,396,220
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test probe head for full wafer testing
- Patent number 10,330,701
- Issue date Jun 25, 2019
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Drug delivery device having a cavity sealed by a pressurized membrane
- Patent number 10,314,970
- Issue date Jun 11, 2019
- International Business Machines Corporation
- Bing Dang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Device layer thin-film transfer to thermally conductive substrate
- Patent number 10,243,091
- Issue date Mar 26, 2019
- International Business Machines Corporation
- Bing Dang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Device layer thin-film transfer to thermally conductive substrate
- Patent number 10,032,943
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated self-coining probe
- Patent number 10,001,508
- Issue date Jun 19, 2018
- International Business Machines Corporation
- Yang Liu
- G01 - MEASURING TESTING
Information Patent Grant
Microchip substance delivery devices having low-power electromechan...
- Patent number 9,937,124
- Issue date Apr 10, 2018
- International Business Machines Corporation
- S. Jay Chey
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Drug delivery device having a cavity sealed by a pressurized membrane
- Patent number 9,867,932
- Issue date Jan 16, 2018
- International Business Machines Corporation
- Bing Dang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Planarity-tolerant reworkable interconnect with integrated testing
- Patent number 9,865,569
- Issue date Jan 9, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarity-tolerant reworkable interconnect with integrated testing
- Patent number 9,391,040
- Issue date Jul 12, 2016
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transferable probe tips
- Patent number 9,200,883
- Issue date Dec 1, 2015
- International Business Machines Corporation
- Paul S. Andry
- G01 - MEASURING TESTING
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,674,506
- Issue date Mar 18, 2014
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for selective image capture, transmission and rec...
- Patent number 8,582,648
- Issue date Nov 12, 2013
- International Business Machines Corporation
- Steven T. Berman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,446,006
- Issue date May 21, 2013
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset solder vias, methods of manufacturing and design structures
- Patent number 8,298,929
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTION STRUCTURES FOR HIGH-BANDWIDTH DATA TRANSFER
- Publication number 20230197705
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH VARYING INTERCONNECTS
- Publication number 20230197658
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Kamal K. SIKKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID DELIVERY DEVICE WITH HYDROPHOBIC SURFACE
- Publication number 20230071285
- Publication date Mar 9, 2023
- International Business Machines Corporation
- YANG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFERRABLE PILLAR STRUCTURE FOR FANOUT PACKAGE OR INTERCONNECT B...
- Publication number 20220181286
- Publication date Jun 9, 2022
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE STRUCTURES HAVING EMBEDDED CHIP INTERCONNECT BRI...
- Publication number 20210265275
- Publication date Aug 26, 2021
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE STRUCTURE HAVING HIGH DENSITY CHIP INTERCONNECT...
- Publication number 20210183773
- Publication date Jun 17, 2021
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE STRUCTURES FORMED BY JOINING CHIPS TO PRE-POSITI...
- Publication number 20210159211
- Publication date May 27, 2021
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE STRUCTURES FORMED WITH INTERCONNECT BRIDGE DEVIC...
- Publication number 20210134724
- Publication date May 6, 2021
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE STRUCTURES HAVING EMBEDDED CHIP INTERCONNECT BRI...
- Publication number 20210134728
- Publication date May 6, 2021
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID DELIVERY DEVICE WITH HYDROPHOBIC SURFACE
- Publication number 20200032925
- Publication date Jan 30, 2020
- International Business Machines Corporation
- YANG LIU
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Drug Delivery Device Having A Cavity Sealed By A Pressurized Membrane
- Publication number 20190290840
- Publication date Sep 26, 2019
- International Business Machines Corporation
- BING DANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
DEVICE LAYER THIN-FILM TRANSFER TO THERMALLY CONDUCTIVE SUBSTRATE
- Publication number 20190148564
- Publication date May 16, 2019
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID DELIVERY DEVICE WITH HYDROPHOBIC SURFACE
- Publication number 20190024823
- Publication date Jan 24, 2019
- International Business Machines Corporation
- YANG LIU
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
INTEGRATED SELF-COINING PROBE
- Publication number 20180252747
- Publication date Sep 6, 2018
- International Business Machines Corporation
- Yang Liu
- G01 - MEASURING TESTING
Information Patent Application
DEVICE LAYER THIN-FILM TRANSFER TO THERMALLY CONDUCTIVE SUBSTRATE
- Publication number 20180226516
- Publication date Aug 9, 2018
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROCHIP SUBSTANCE DELIVERY DEVICES HAVING LOW-POWER ELECTROMECHAN...
- Publication number 20180133152
- Publication date May 17, 2018
- International Business Machines Corporation
- S. Jay Chey
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Drug Delivery Device Having A Cavity Sealed By A Pressurized Membrane
- Publication number 20180117245
- Publication date May 3, 2018
- International Business Machines Corporation
- BING DANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
INTEGRATED SELF-COINING PROBE
- Publication number 20170363659
- Publication date Dec 21, 2017
- International Business Machines Corporation
- Yang Liu
- G01 - MEASURING TESTING
Information Patent Application
TRANSDERMAL SENSING PROBES AND SMART PATCH SYSTEMS USING SAME
- Publication number 20170175280
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Bing Dang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
DEVICE LAYER THIN-FILM TRANSFER TO THERMALLY CONDUCTIVE SUBSTRATE
- Publication number 20170179307
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSDERMAL SENSING PROBES AND SMART PATCH SYSTEMS USING SAME
- Publication number 20170172445
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Bing Dang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Drug Delivery Device Having A Cavity Sealed By A Pressurized Membrane
- Publication number 20170119964
- Publication date May 4, 2017
- International Business Machines Corporation
- BING DANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Delivery Device Including Reactive Material For Programmable Discre...
- Publication number 20170119960
- Publication date May 4, 2017
- International Business Machines Corporation
- BING DANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PLANARITY-TOLERANT REWORKABLE INTERCONNECT WITH INTEGRATED TESTING
- Publication number 20160240513
- Publication date Aug 18, 2016
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARITY-TOLERANT REWORKABLE INTERCONNECT WITH INTEGRATED TESTING
- Publication number 20160111387
- Publication date Apr 21, 2016
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PROBE HEAD FOR FULL WAFER TESTING
- Publication number 20160084882
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Bing Dang
- G01 - MEASURING TESTING
Information Patent Application
MICROCHIP SUBSTANCE DELIVERY DEVICES HAVING LOW-POWER ELECTROMECHAN...
- Publication number 20160074323
- Publication date Mar 17, 2016
- International Business Machines Corporation
- S. Jay Chey
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20130234329
- Publication date Sep 12, 2013
- Intetnational Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transferable Probe Tips
- Publication number 20120279287
- Publication date Nov 8, 2012
- International Business Machines Corporation
- Paul S. Andry
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OFFSET SOLDER VIAS, METHODS OF MANUFACTURING AND DESIGN STRUCTURES
- Publication number 20120139123
- Publication date Jun 7, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- G06 - COMPUTING CALCULATING COUNTING

Steven L. Wright

Person

Patents Grantslast 30 patents

Electronic package with varying interconnects

Interconnection structures for high bandwidth data transfer

Transferrable pillar structure for fanout package or interconnect b...

Multi-chip package structures having embedded chip interconnect bri...

Fluid delivery device with hydrophobic surface

Multi-chip package structures with discrete redistribution layers

Multi-chip package structure having high density chip interconnect...

Multi-chip package structures formed by joining chips to pre-positi...

Multi-chip package structures having embedded chip interconnect bri...

Microchip substance delivery devices

Drug delivery device having a cavity sealed by a pressurized membrane

Delivery device including reactive material for programmable discre...

Transdermal sensing probes and smart patch systems using same

Integrated self-coining probe

Fluid delivery device with hydrophobic surface

Device layer thin-film transfer to thermally conductive substrate

Test probe head for full wafer testing

Drug delivery device having a cavity sealed by a pressurized membrane

Device layer thin-film transfer to thermally conductive substrate

Device layer thin-film transfer to thermally conductive substrate

Integrated self-coining probe

Microchip substance delivery devices having low-power electromechan...

Drug delivery device having a cavity sealed by a pressurized membrane

Planarity-tolerant reworkable interconnect with integrated testing

Planarity-tolerant reworkable interconnect with integrated testing

Transferable probe tips

Structures and methods to reduce maximum current density in a solde...

System and method for selective image capture, transmission and rec...

Structures and methods to reduce maximum current density in a solde...

Offset solder vias, methods of manufacturing and design structures

Patents Applicationslast 30 patents

INTERCONNECTION STRUCTURES FOR HIGH-BANDWIDTH DATA TRANSFER

ELECTRONIC PACKAGE WITH VARYING INTERCONNECTS

FLUID DELIVERY DEVICE WITH HYDROPHOBIC SURFACE

TRANSFERRABLE PILLAR STRUCTURE FOR FANOUT PACKAGE OR INTERCONNECT B...

MULTI-CHIP PACKAGE STRUCTURES HAVING EMBEDDED CHIP INTERCONNECT BRI...

MULTI-CHIP PACKAGE STRUCTURE HAVING HIGH DENSITY CHIP INTERCONNECT...

MULTI-CHIP PACKAGE STRUCTURES FORMED BY JOINING CHIPS TO PRE-POSITI...

MULTI-CHIP PACKAGE STRUCTURES FORMED WITH INTERCONNECT BRIDGE DEVIC...

MULTI-CHIP PACKAGE STRUCTURES HAVING EMBEDDED CHIP INTERCONNECT BRI...

FLUID DELIVERY DEVICE WITH HYDROPHOBIC SURFACE

Drug Delivery Device Having A Cavity Sealed By A Pressurized Membrane

DEVICE LAYER THIN-FILM TRANSFER TO THERMALLY CONDUCTIVE SUBSTRATE

FLUID DELIVERY DEVICE WITH HYDROPHOBIC SURFACE

INTEGRATED SELF-COINING PROBE

DEVICE LAYER THIN-FILM TRANSFER TO THERMALLY CONDUCTIVE SUBSTRATE

MICROCHIP SUBSTANCE DELIVERY DEVICES HAVING LOW-POWER ELECTROMECHAN...

Drug Delivery Device Having A Cavity Sealed By A Pressurized Membrane

INTEGRATED SELF-COINING PROBE

TRANSDERMAL SENSING PROBES AND SMART PATCH SYSTEMS USING SAME

DEVICE LAYER THIN-FILM TRANSFER TO THERMALLY CONDUCTIVE SUBSTRATE

TRANSDERMAL SENSING PROBES AND SMART PATCH SYSTEMS USING SAME

Drug Delivery Device Having A Cavity Sealed By A Pressurized Membrane

Delivery Device Including Reactive Material For Programmable Discre...

PLANARITY-TOLERANT REWORKABLE INTERCONNECT WITH INTEGRATED TESTING

PLANARITY-TOLERANT REWORKABLE INTERCONNECT WITH INTEGRATED TESTING

TEST PROBE HEAD FOR FULL WAFER TESTING

MICROCHIP SUBSTANCE DELIVERY DEVICES HAVING LOW-POWER ELECTROMECHAN...

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

Transferable Probe Tips

OFFSET SOLDER VIAS, METHODS OF MANUFACTURING AND DESIGN STRUCTURES